公开(公告)号：US20140318851A1

公开(公告)日：2014-10-30

申请号：US14260708

申请日：2014-04-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Jea JANG ,  Dong-In HA ,  Jin-Young KWAK ,  Gi-Heung KIM ,  Jung-Yoon SEO ,  Jae-Joon YOO ,  Byoung-Hee LEE ,  Sung-Jin CHOI

IPC: H05K9/00

CPC classification number: H05K9/0035 ,  H05K9/0028

Abstract: A shield reinforcing apparatus is provided. The shield reinforcing apparatus includes a printed circuit board, a shield member that covers the printed circuit board, and at least one shield reinforcing part provided in the printed circuit board and configured to contact the shield member to be pressed.

Abstract translation: 提供了屏蔽加强装置。 屏蔽增强装置包括印刷电路板，覆盖印刷电路板的屏蔽构件和设置在印刷电路板中并被配置为接触要被按压的屏蔽构件的至少一个屏蔽加强部。