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公开(公告)号:US20240021996A1
公开(公告)日:2024-01-18
申请号:US18351200
申请日:2023-07-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Doo Hyun YANG , Doo Seok CHOI , Sang Hyun BAEK , Young Ki LEE , Joon Hoi HUR
CPC classification number: H01Q9/0414 , H01Q9/045 , H01Q1/2283
Abstract: Provided is an antenna module including a first antenna patch for radiating electromagnetic energy of a first frequency band, a second antenna patch for radiating electromagnetic energy of a second frequency band different from the first frequency band, and both the first antenna patch and the second antenna patch spaced apart from a ground structure in a first direction, and a feed structure spaced apart from each of the first antenna patch and the second antenna patch, the feed structure being between the first antenna patch and the second antenna patch, the feed structure being connected to the ground structure, and the feed structure being configured to provide an RF signal to the first antenna patch and second antenna patch, and the feed structure including a horizontal feed line extending in a second direction intersecting the first direction, and a vertical feed line extending in the first direction.
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2.
公开(公告)号:US20210091473A1
公开(公告)日:2021-03-25
申请号:US16954771
申请日:2018-11-09
Inventor: Jung Yub LEE , Jun Ho PARK , Doo Seok CHOI , Won Bin HONG , Young Ju LEE
Abstract: The present invention relates to a communication technique for fusing a 5G communication system to support a higher data transmission rate than a 4G system, with IoT technology, and a system thereof. In addition, the present invention provides an antenna module comprising: a first plate which forms an upper surface of the antenna module and has a first opening surface on one side surface, a second plate which forms a side surface of the antenna module, forms a first angle with the first plate in contact with the first plate, and has a second opening surface on one side surface so as to extend the first opening surface, and a power supply unit which has one surface electrically connected to the first plate and is disposed on the first opening surface or the second opening surface.
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