公开(公告)号：US20210321540A1

公开(公告)日：2021-10-14

申请号：US17266355

申请日：2019-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunmin OH ,  Sungjin PARK ,  Daegyu KANG ,  Insu KIM ,  Daegi LEE ,  Jonghyun LEE

IPC: H05K7/20 ,  H04R1/02 ,  H04R9/02

Abstract: An electronic device according to various embodiments of the disclosure includes: a housing including a plurality of acoustic holes; an enclosure mounted in the housing; at least one heating element disposed in the enclosure; a heat dissipation structure disposed on the heating element to transfer heat generated from the heating element; and a heat dissipation duct disposed at least partially on the heat dissipation structure to provide a path for transferring the heat transferred from the heat dissipation structure to the outside through the acoustic holes. The heat dissipation structure may include: at least one first heat transfer member coupled to the one heating element; and a second heat transfer member disposed at least partially on the first heat transfer member to transfer, to the heat dissipation duct, heat transferred from the first heat transfer member.