公开(公告)号：US20210084745A1

公开(公告)日：2021-03-18

申请号：US17025453

申请日：2020-09-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juhyeok KIM ,  Boik CHO ,  Jieun HA ,  Sangeun LEE

IPC: H05K1/02

Abstract: A heat sink fastening structure includes a push pin to fasten a heat sink to a printed circuit board (PCB) and including a head portion formed at an end thereof, a bracket mounted on the PCB and including a through hole formed at a central portion thereof to allow the head portion to penetrate, and an accommodating hole included in the PCB to accommodate the head portion therein, and the head portion is configured to penetrate the through hole and thereafter be accommodated in the accommodating hole, to thereby be fixed to the bracket.