公开(公告)号：US20210183762A1

公开(公告)日：2021-06-17

申请号：US17022718

申请日：2020-09-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joonsung Kim ,  Khaile Kim

IPC: H01L23/528 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00

Abstract: A fan-out semiconductor package includes a frame substrate having a through hole therein, a semiconductor chip in the through hole, wherein the semiconductor chip includes a chip body, a chip pad on a surface of the chip body and a passivation layer on the chip body and on the chip pad, an encapsulation layer on side surfaces of the semiconductor chip within the through hole, and a guard ring on the passivation layer and on an edge portion of the chip body.

公开(公告)号：US12159833B2

公开(公告)日：2024-12-03

申请号：US18151731

申请日：2023-01-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonsung Kim ,  Khaile Kim

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A fan-out semiconductor package includes a frame substrate having a through hole therein, a semiconductor chip in the through hole, wherein the semiconductor chip includes a chip body, a chip pad on a surface of the chip body and a passivation layer on the chip body and on the chip pad, an encapsulation layer on side surfaces of the semiconductor chip within the through hole, and a guard ring on the passivation layer and on an edge portion of the chip body.

公开(公告)号：US11574868B2

公开(公告)日：2023-02-07

申请号：US17022718

申请日：2020-09-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joonsung Kim ,  Khaile Kim

IPC: H01L23/00 ,  H01L23/528 ,  H01L23/31 ,  H01L23/498

Abstract: A fan-out semiconductor package includes a frame substrate having a through hole therein, a semiconductor chip in the through hole, wherein the semiconductor chip includes a chip body, a chip pad on a surface of the chip body and a passivation layer on the chip body and on the chip pad, an encapsulation layer on side surfaces of the semiconductor chip within the through hole, and a guard ring on the passivation layer and on an edge portion of the chip body.