公开(公告)号：US20190295986A1

公开(公告)日：2019-09-26

申请号：US16164524

申请日：2018-10-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： SEONG HWAN OH ,  Kyung Suk OH ,  KILSOO KIM

IPC: H01L25/065 ,  H01L21/78 ,  H01L23/00

Abstract: A semiconductor package may include a package substrate, a first semiconductor chip on the package substrate, and a second semiconductor chip on the first semiconductor chip. The first semiconductor chip comprises a chip substrate including a first surface and a second surface opposite to the first surface, a plurality of first chip pads between the package substrate and the chip substrate, and electrically connecting the first semiconductor chip to the package substrate, a plurality of second chip pads disposed on the second surface and between the second semiconductor chip and the second surface, and a plurality of redistribution lines on the second surface, the redistribution lines electrically connecting to the second semiconductor chip, and a plurality of bonding wires electrically connecting the redistribution lines to the package substrate.