公开(公告)号：US20190081404A1

公开(公告)日：2019-03-14

申请号：US16130495

申请日：2018-09-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Gil JEON ,  Hyung Wook KIM ,  Jeong Heum LEE ,  Jong Hwan LEE ,  Ho Young IM

IPC: H01Q13/10 ,  H01Q9/04

Abstract: An electronic device is provided. The electronic device includes a housing that includes a first surface, a second surface facing the first surface, and a side surface surrounding a space between the first and second surfaces, a printed circuit board (PCB) that is arranged inside the housing and includes at least one antenna unit, and a communication circuit that is arranged inside the PCB or between the PCB and the housing.

公开(公告)号：US20190165452A1

公开(公告)日：2019-05-30

申请号：US16199876

申请日：2018-11-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Gil JEON ,  Jeong Heum LEE ,  Jae Bong CHUN

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q1/44

Abstract: An electronic device is provided. The electronic device includes a housing that includes a front surface, a rear surface facing away from the front surface, and a side surface surrounding a space between the front surface and the rear surface, wherein the front surface includes a dielectric substance having a first permittivity and the rear surface includes a dielectric substance having a second permittivity, an antenna array that is positioned adjacent to the side surface, radiates a millimeter wave signal, the antenna array including at least one antenna element, a communication circuit that is electrically connected with the antenna array and communicates by using the millimeter wave signal, and an electrical element that is positioned to be spaced from the antenna array by a specified distance such that a radiation pattern of the millimeter wave signal radiated from the antenna array has a directivity toward the side surface.

公开(公告)号：US20160329628A1

公开(公告)日：2016-11-10

申请号：US15146337

申请日：2016-05-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeon Woo KIM ,  Jung Sik PARK ,  Seung Gil JEON

IPC: H01Q1/24 ,  H01Q9/06

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q9/06

Abstract: An antenna is provided. The antenna includes a carrier having a via hole penetrating an outer surface and an inner surface thereof, a first antenna radiator formed on the outer surface of the carrier and at least a part of a surface of the carrier that defines the via hole, a second antenna radiator formed on an inner surface of the carrier and electrically contacting the first antenna radiator through the via hole, and a coupling member configured to electrically connect the second antenna radiator with a circuit board provided in the electronic device.

Abstract translation: 提供天线。 天线包括具有贯穿其外表面和内表面的通孔的载体，形成在载体的外表面上的第一天线辐射体和限定通孔的载体表面的至少一部分，第二 天线辐射体形成在载体的内表面上并且通过通孔与第一天线辐射器电接触，以及耦合构件，其被配置为将第二天线辐射体与设置在电子设备中的电路板电连接。

公开(公告)号：US20200076055A1

公开(公告)日：2020-03-05

申请号：US16614710

申请日：2018-05-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Gil JEON

IPC: H01Q1/24 ,  H01Q21/06 ,  H01Q21/00

Abstract: An electronic device according to an embodiment of the disclosure may include housing including a rear cover and a cover glass facing away from the rear cover, an antenna array interposed between the rear cover and the cover glass and including at least one or more antenna units, a printed circuit board (PCB) interposed between the antenna array and the cover glass, and a communication circuit disposed on the PCB and feeding the antenna array. Other various embodiments as understood from the specification are also possible.

公开(公告)号：US20190165470A1

公开(公告)日：2019-05-30

申请号：US16199069

申请日：2018-11-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Gil JEON

IPC: H01Q3/26 ,  H01Q21/00 ,  H01Q21/06 ,  H01Q21/29

Abstract: An electronic device is provided. The electronic device includes a cover glass, a rear cover which faces away from the cover glass, and a plurality of communication devices that are interposed between the cover glass and the rear cover. Each of the plurality of communication devices comprises a printed circuit board (PCB), an antenna array positioned at the PCB, a dielectric substance positioned on one surface of the antenna array, a conductor positioned on an opposite surface of the antenna array, and a communication circuit electrically connected with the antenna array. The communication circuit is configured to feed the antenna array and transmit/receive a signal in a specified frequency band based on an electrical path formed through the antenna array.