公开(公告)号：US20180087132A1

公开(公告)日：2018-03-29

申请号：US15721635

申请日：2017-09-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-tae Park ,  Won Ju ,  Jung-soo Lim ,  Jeong-su Han

IPC: C22C21/08 ,  B22D21/00 ,  C22F1/05

CPC classification number: C22C21/08 ,  B22D21/007 ,  C22C21/02 ,  C22F1/05

Abstract: An aluminum alloy for die casting. The aluminum alloy for die casting of the present disclosure includes, by wt %, 3≦Si≦10, 3≦Mg≦10, 0.01≦Fe≦1.3, 0.01≦Zn≦2, 0.01≦Cu≦1.5, 0.01≦Mn≦0.5, 0.05≦Ti≦0.15, 0.01≦La≦2, 0.01≦Sr≦2, a balance of Al, and unavoidable impurities.