Allergen remover
    1.
    发明申请
    Allergen remover 有权
    过敏原去除剂

    公开(公告)号:US20050119148A1

    公开(公告)日:2005-06-02

    申请号:US10983733

    申请日:2004-11-09

    摘要: The invention relates to an allergen remover composition containing component (a): an organic compound forming an azeotropic mixture with water and having an azeotropic point of lower than 100° C. with water at 1013.25 hPa, component (b): a component which upon evaporation of a liquid component in the allergen remover, forms a solid containing a compound represented by the following general formula (1) or component (b′) a combination of potassium ion, sodium ion and sulfate ion at a potassium ion/sodium ion molar ratio of from 2/8 to 9/1 and component (c) water. KxNay(SO4)2  (1) wherein x is a number of 0.8 to 3.6, y is a number of 0.4 to 3.2, and x+y is 4.

    摘要翻译: 本发明涉及含有组分(a)的有机化合物:与水形成共沸混合物并与1013.25hPa的水共沸点低于100℃的有机化合物,组分(b):一种组分 在变应原去除剂中蒸发液体组分,形成含钾离子/钠离子摩尔浓度的钾离子,钠离子和硫酸根离子的组合的由以下通式(1)或组分(b')表示的化合物的固体 比例为2/8至9/1,组分(c)为水。 <?in-line-formula description =“In-line Formulas”end =“lead”?> K&lt; x&lt; Na&gt;(SO 4) )&lt; 2&gt;(1)<?in-line-formula description =“In-line Formulas”end =“tail”?>其中x是0.8至3.6的数,y是0.4的数 至3.2,x + y为4。

    Allergen remover
    3.
    发明授权
    Allergen remover 有权
    过敏原去除剂

    公开(公告)号:US07431945B2

    公开(公告)日:2008-10-07

    申请号:US10983733

    申请日:2004-11-09

    摘要: The invention relates to an allergen remover composition containing component (a): an organic compound forming an azeotropic mixture with water and having an azeotropic point of lower than 100° C. with water at 1013.25 hPa, component (b): a component which upon evaporation of a liquid component in the allergen remover, forms a solid containing a compound represented by the following general formula (1) or component (b′): a combination of potassium ion, sodium ion and sulfate ion at a potassium ion/sodium ion molar ratio of from 2/8 to 9/1 and component (c): water. KxNay(SO4)2   (1) wherein x is a number of 0.8 to 3.6, y is a number of 0.4 to 3.2, and x+y is 4.

    摘要翻译: 本发明涉及含有组分(a)的有机化合物:与水形成共沸混合物并与1013.25hPa的水共沸点低于100℃的有机化合物,组分(b):一种组分 蒸发过敏原去除剂中的液体组分,形成含有由以下通式(1)或组分(b')表示的化合物的固体:钾离子/钠离子的钾离子,钠离子和硫酸根离子的组合 摩尔比为2/8〜9/1,成分(c)为水。 <?in-line-formula description =“In-line Formulas”end =“lead”?> K&lt; x&lt; Na&gt;(SO 4) )&lt; 2&gt;(1)<?in-line-formula description =“In-line Formulas”end =“tail”?>其中x是0.8至3.6的数,y是0.4的数 至3.2,x + y为4。

    LITHOGRAPHY TOOL ALIGNMENT CONTROL SYSTEM
    6.
    发明申请
    LITHOGRAPHY TOOL ALIGNMENT CONTROL SYSTEM 审中-公开
    LITHOGRAPHY工具对齐控制系统

    公开(公告)号:US20130090877A1

    公开(公告)日:2013-04-11

    申请号:US13268248

    申请日:2011-10-07

    申请人: Satoshi Nagai

    发明人: Satoshi Nagai

    IPC分类号: G06F19/00

    CPC分类号: G03F7/70633 G03F9/7034

    摘要: Described herein are methods and systems for aligning a wafer using a wafer leveling map with alignment marks. A set of alignment marks can be selected to create overlay correction parameters to realign the wafer. Alignment marks that are near wafer leveling hotspots, or alignment marks that have poor reproducibility are not selected for realignment purposes. The wafer leveling data is used to determine which alignment marks have poor reproducibility and can create an unstable offset. The wafer leveling data identifies areas on the wafer that are uneven. Only alignment marks which have a stable offset are used to calculate the associated overlay correction parameters.

    摘要翻译: 这里描述了使用晶片调平图与对准标记对准晶片的方法和系统。 可以选择一组对准标记来创建重叠校正参数以重新对准晶片。 靠近晶片调平热点的对准标记或重复性差的对准标记未被选择用于重新对准。 晶圆调平数据用于确定哪些对准标记具有差的再现性,并可能产生不稳定的偏移。 晶片调平数据识别晶片上不均匀的区域。 仅使用具有稳定偏移的对准标记来计算相关联的重叠校正参数。

    Polishing apparatus
    7.
    发明申请
    Polishing apparatus 审中-公开
    抛光设备

    公开(公告)号:US20070032174A1

    公开(公告)日:2007-02-08

    申请号:US10555004

    申请日:2004-04-28

    申请人: Satoshi Nagai

    发明人: Satoshi Nagai

    IPC分类号: B24B7/30 B24B1/00

    CPC分类号: B24B37/16

    摘要: The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer to form a flat surface thereon. The polishing apparatus includes a polishing table (20), a polishing tool (1) attached to an upper surface of the polishing table (20), and a fluid passage (40) having openings on the upper surface of the polishing table (20). The apparatus is operable to bring a workpiece (W) into sliding contact with the polishing tool (1) to polish the workpiece while supplying a polishing liquid onto the polishing tool (1). The polishing tool (1) is fixed to the polishing table (20) by a vacuum produced in the fluid passage (40).

    摘要翻译: 本发明涉及一种抛光装置,用于抛光诸如半导体晶片的工件以在其上形成平坦表面。 抛光装置包括:研磨台(20),安装在研磨台(20)的上表面的研磨工具(1)和在研磨台(20)的上表面上具有开口的流体通道(40) 。 该装置可操作以使工件(W)与抛光工具(1)滑动接触,以在将抛光液体供应到抛光工具(1)上时抛光工件。 抛光工具(1)通过在流体通道(40)中产生的真空固定在抛光台(20)上。

    Aromatic-aliphatic copolycarbonate and process for producing the same
    8.
    发明授权
    Aromatic-aliphatic copolycarbonate and process for producing the same 有权
    芳香族 - 脂肪族共聚碳酸酯及其制造方法

    公开(公告)号:US06359103B1

    公开(公告)日:2002-03-19

    申请号:US09639985

    申请日:2000-08-17

    IPC分类号: C08G6416

    CPC分类号: C08G64/1608 C08G64/30

    摘要: An aromatic-aliphatic copolycarbonate and a process for producing the same which comprises polycondensation of an aromatic dihydroxy compound, such as 1,1-bis(4-hydroxyphenyl)cyclohexane, tricyclo(5.2.1.02,6)decanedimethanol, and a carbonic acid diester in a molten state under heating, wherein the carbonic acid diester has a chlorine content of 20 ppm or lower. The copolycarbonate has improved refractive index, balance of dispersion, and photoelastic constant while retaining high impact resistance, high heat resistance, and excellent hue.

    摘要翻译: 芳香族 - 脂肪族共聚碳酸酯及其制造方法,其包括芳族二羟基化合物如1,1-双(4-羟基苯基)环己烷,三环(5.2.1.0 2,6)癸烷二甲醇和碳酸二酯的缩聚 在加热下处于熔融状态,其中碳酸二酯的氯含量为20ppm以下。 共聚碳酸酯具有改善的折射率,平衡分散和光弹性常数,同时保持高耐冲击性,高耐热性和优异的色调。

    Discharge lamp igniting apparatus including feedback control
    9.
    发明授权
    Discharge lamp igniting apparatus including feedback control 失效
    放电灯点火装置包括反馈控制

    公开(公告)号:US5952793A

    公开(公告)日:1999-09-14

    申请号:US816051

    申请日:1997-03-11

    摘要: A current flowing through a discharge lamp 4 is detected by a current detecting circuit 5, and the detected current is outputted as a lamp current signal A to a feedback control circuit 7 where a difference between the lamp current signal A and the dimming control signal B is obtained and amplified, and then a simplified signal D is outputted to an adder 12 which adds the amplified signal D to the dimming control signal B to constitute a control signal E. The control signal is fed back to a high frequency power supply 2. When a comparing circuit 15 detects that the light level of the dimming control signal B with respect to the full light becomes higher than or equal to 40% to 60%, the feedback circuit is disconnected by operating a switch 13 provided between an error amplifying circuit 9 and an adder 12 to stop the feedback control.

    摘要翻译: 通过电流检测电路5检测流过放电灯4的电流,将检测电流作为灯电流信号A输出到反馈控制电路7,反馈控制电路7将灯电流信号A与调光控制信号B 并且然后将简化信号D输出到加法器12,加法器12将放大的信号D加到调光控制信号B以构成控制信号E.控制信号反馈给高频电源2。 当比较电路15检测到调光控制信号B相对于全光的光电平变得高于或等于40%至60%时,通过操作设置在误差放大电路之间的开关13来断开反馈电路, 9和加法器12,以停止反馈控制。

    Cleaning sheet
    10.
    发明授权
    Cleaning sheet 有权
    清洁纸

    公开(公告)号:US08752232B2

    公开(公告)日:2014-06-17

    申请号:US13144252

    申请日:2010-02-04

    IPC分类号: A47L13/16

    摘要: A cleaning sheet (1A) includes: a substrate sheet (2); and a plurality of long-fiber bundles (3) provided thereon, each long-fiber bundle (3) being made by aggregating long fibers (31), the long-fiber bundles (3) being arranged side-by-side and joined to the substrate sheet (2). Each long-fiber bundle (3) is joined together by fiber-joining sections (32). Each long-fiber bundle (3) is joined to the substrate sheet (2) by sheet-joining sections (21). Each sheet-joining section (21) is provided so as to overlap one of the fiber-joining sections (32). Each long-fiber bundle (3) has been cut by linear cut sections (24), each linear cut section (24) being formed in a region between adjacent sheet-joining sections (21). Each long-fiber bundle (3) includes cut fibers (311) and uncut fibers (312).

    摘要翻译: 清洁片(1A)包括:基片(2); 和多个长纤维束(3),每个长纤维束(3)通过聚集长纤维(31)制成,长纤维束(3)并排设置并连接到 基片(2)。 每个长纤维束(3)通过纤维接合部分(32)连接在一起。 每个长纤维束(3)通过片接合部分(21)连接到基片(2)。 每个片材接合部分(21)设置成与纤维接合部分(32)中的一个重叠。 每个长纤维束(3)已被直线切割部分(24)切割,每个直线切割部分(24)形成在相邻的片材接合部分(21)之间的区域中。 每个长纤维束(3)包括切割纤维(311)和未切割纤维(312)。