公开(公告)号：US10176832B2

公开(公告)日：2019-01-08

申请号：US15869361

申请日：2018-01-12

Applicant: Seagate Technology LLC

Inventor： Jason Bryce Gadbois ,  Declan Macken ,  Karsten Klarqvist

IPC: G11B5/48 ,  G11B5/49 ,  G11B5/00

Abstract: A bond pad set includes at least one ground pad and at least one electrical bond pad configured to bias and send/receive signals. The bond pad set is electrically connected to a multiplicity of electrical components. At least one electrical bond pad of the bond pad set is shared between two or more of the electrical components.

公开(公告)号：US09899047B2

公开(公告)日：2018-02-20

申请号：US14050725

申请日：2013-10-10

Applicant: Seagate Technology LLC

Inventor： Jason Bryce Gadbois ,  Declan Macken ,  Karsten Klarqvist

IPC: G11B5/48 ,  G11B5/49 ,  G11B5/00

CPC classification number: G11B5/4853 ,  G11B5/4886 ,  G11B5/4976 ,  G11B2005/0008 ,  G11B2005/0021

Abstract: A bond pad set includes at least one ground pad and at least one electrical bond pad configured to bias and send/receive signals. The bond pad set is electrically connected to a multiplicity of electrical components. At least one electrical bond pad of the bond pad set is shared between two or more of the electrical components.

公开(公告)号：US09489971B1

公开(公告)日：2016-11-08

申请号：US14608730

申请日：2015-01-29

Applicant: Seagate Technology LLC

Inventor： Karsten Klarqvist ,  Andrew R. Motzko ,  Rick P. Freeman

IPC: G11B5/48

CPC classification number: G11B5/4846

Abstract: A system includes a first preamplifier, a second preamplifier and a flex circuit. The first preamplifier is configured to be connected to a first plurality of recording heads. The second preamplifier is configured to be connected to a second plurality of recording heads. At least one of the first plurality of recording heads and at least one of the second plurality of recording heads are configured to concurrently perform read and or write operations. The flex circuit is a single flex circuit configured to connect the first and second preamplifiers to the plurality of recording heads.

Abstract translation: 系统包括第一前置放大器，第二前置放大器和柔性电路。 第一前置放大器被配置为连接到第一多个记录头。 第二前置放大器被配置为连接到第二多个记录头。 第一多个记录头中的至少一个和第二多个记录头中的至少一个被配置为同时执行读取和/或写入操作。 柔性电路是被配置为将第一和第二前置放大器连接到多个记录头的单个柔性电路。

公开(公告)号：US20180137885A1

公开(公告)日：2018-05-17

申请号：US15869361

申请日：2018-01-12

Applicant: Seagate Technology LLC

Inventor： Jason Bryce Gadbois ,  Declan Macken ,  Karsten Klarqvist

IPC: G11B5/48 ,  G11B5/49 ,  G11B5/00

CPC classification number: G11B5/4853 ,  G11B5/4886 ,  G11B5/4976 ,  G11B2005/0008 ,  G11B2005/0021

Abstract: A bond pad set includes at least one ground pad and at least one electrical bond pad configured to bias and send/receive signals. The bond pad set is electrically connected to a multiplicity of electrical components. At least one electrical bond pad of the bond pad set is shared between two or more of the electrical components.

公开(公告)号：US20150103430A1

公开(公告)日：2015-04-16

申请号：US14050725

申请日：2013-10-10

Applicant: Seagate Technology LLC

Inventor： Jason Bryce Gadbois ,  Declan Macken ,  Karsten Klarqvist

IPC: G11B5/48

CPC classification number: G11B5/4853 ,  G11B5/4886 ,  G11B5/4976 ,  G11B2005/0008 ,  G11B2005/0021

Abstract: A bond pad set includes at least one ground pad and at least one electrical bond pad configured to bias and send/receive signals. The bond pad set is electrically connected to a multiplicity of electrical components. At least one electrical bond pad of the bond pad set is shared between two or more of the electrical components.

Abstract translation: 接合焊盘组包括至少一个接地焊盘和配置成偏置和发送/接收信号的至少一个电接合焊盘。 接合焊盘组电连接到多个电气部件。 键合焊盘组中的至少一个电接合焊盘在两个或多个电组件之间共享。