公开(公告)号：US09713274B2

公开(公告)日：2017-07-18

申请号：US14477947

申请日：2014-09-05

Applicant: Sony Computer Entertainment Inc.

Inventor： Furubo Takayuki ,  Shinichi Takeyama ,  Beppu Hirokuni ,  Nobuyuki Sugawara

IPC: H05K5/02 ,  H05K7/14 ,  G06F1/16 ,  H01H13/14

CPC classification number: H05K5/0217 ,  G06F1/1658 ,  H01H13/14 ,  H01H2221/044 ,  H05K7/142

Abstract: Electronic apparatus includes a housing configured to have an inner layer portion forming an inner surface and an outer layer portion forming an outer surface. The inner layer portion and the outer layer portion are formed by two-color molding. The electronic apparatus includes one of a region in which the inner layer portion is not formed and a region in which the inner layer portion is thin. The one region is set in the inner surface of the housing. The electronic apparatus further includes a component configured to be housed in the housing and is disposed in the one region.