摘要:
Systems and methods are provided for evaluating and sorting seeds based on characteristics of the seeds. One system includes an imaging and analysis subsystem that collects image data from the seeds and analyzes the collected image data for characteristics of the seeds. This subsystem can include an imaging theater having minors that reflect image data from the seeds to an imaging device for collection. The system can also include an off-loading and sorting subsystem configured to sort the seeds based on their characteristics. And, one method includes illuminating the seeds and collecting image data from the seeds for determining their characteristics. The image data can be collected from at least three portions of the seeds at each of a plurality of sequentially changing spectral wavelengths. In addition (or alternatively), the image data can be collected from top and bottom portions of the seeds using a single imaging device.
摘要:
Systems and methods are provided for evaluating and sorting seeds based on characteristics of the seeds. One system includes an imaging and analysis subsystem that collects image data from the seeds and analyzes the collected image data for characteristics of the seeds. This subsystem can include an imaging theater having mirrors that reflect image data from the seeds to an imaging device for collection. The system can also include an off-loading and sorting subsystem configured to sort the seeds based on their characteristics. And, one method includes illuminating the seeds and collecting image data from the seeds for determining their characteristics. The image data can be collected from at least three portions of the seeds at each of a plurality of sequentially changing spectral wavelengths. In addition (or alternatively), the image data can be collected from top and bottom portions of the seeds using a single imaging device.
摘要:
The present disclosure provides systems and methods for sorting seeds based on identified phenotypes of the seeds. In various embodiments, the system includes an optics and controller station structured and operable to collect image data of a top portion, a bottom portion and a plurality of side portions of each respective seed in a set of seeds, and to analyze the collected image data to determine whether each seed exhibits a desired phenotype. The system further includes a seed loading, transporting and sorting station structured and operable to singulate each seed of the set of seeds from a plurality of seeds in a bulk seed hopper, transport the set of seeds to the optics and controller station, and selectively sort each seed to a respective one of a plurality of seed repositories based on whether each respective seed exhibits the desired phenotype.
摘要:
The present disclosure provides systems and methods for sorting seeds based on identified phenotypes of the seeds. In various embodiments, the system includes an optics and controller station structured and operable to collect image data of a top portion, a bottom portion and a plurality of side portions of each respective seed in a set of seeds, and to analyze the collected image data to determine whether each seed exhibits a desired phenotype. The system further includes a seed loading, transporting and sorting station structured and operable to singulate each seed of the set of seeds from a plurality of seeds in a bulk seed hopper, transport the set of seeds to the optics and controller station, and selectively sort each seed to a respective one of a plurality of seed repositories based on whether each respective seed exhibits the desired phenotype.
摘要:
A test chip module for testing the integrity of the flip chip solder ball interconnections between chip and substrate. The interconnections are thermally stressed through an array of individual heaters formed in a layer of chip metallurgy to provide a uniform and ubiquitous source of heat. Current is passed through the interconnection to be tested by a current supply circuit using one signal I/O interconnection and the voltage drop across the interconnection to be tested from the current passed therethrough is measured by a voltage measuring circuit connected through another signal I/O interconnection. Stress initiating cracking and degradation at the interconnection creates a measurable change in voltage drop across the interconnection.
摘要:
An integrated circuit chip (104) having a contact layer (136) that includes a plurality of Vdd, Vddx, ground and I/O contacts (116, 120, 124, 128) arranged in a generally radial pattern having diagonal and major axis symmetry and generally defining four quadrants. An X-Y power grid (140) is located beneath the contact layer and includes metal layers (LM′) each having a plurality of wires (68) extending in one direction. The direction of the wires alternates from one metal layer to the next adjacent metal layer. A wiring layer (IM) is interposed between the contact layer and power grid layers to provide a well-behaved electrical transition between the generally radial Vdd, Vddx and ground contacts and the rectangular X-Y power grid. The interposed wiring layer includes concentric square rings of Vdd, Vddx and ground wires (144, 148, 152) located alternatingly with one another. The Vddx wires are discontinuous between adjacent quadrants so that the magnitude of Vddx may be different in each quadrant of the chip if desired.
摘要:
A test chip module for testing the integrity of the nip chip solder ball interconnections between chip and substrate. The interconnection, are thermally stressed through an array of individual heaters formed in a layer of chip metallurgy to provide a uniform and ubiquitous source of heat. Current is passed through the interconnection to be tested by a current supply circuit using one signal I/O interconnection and the voltage drop across the interconnection to be tested from the current passed therethrough is measured by a voltage measuring circuit connected through another signal I/O interconnection. Stress initiating cracking and degradation at the interconnection creates a measurable change in voltage drop across the interconnection.