公开(公告)号：US20240072066A1

公开(公告)日：2024-02-29

申请号：US17765218

申请日：2022-03-29

Applicant: HUIZHOU CHINA STAR OPTOELECTRONICS DISPLAY CO., LTD. ,  TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Jing LIU ,  Hongzhao DENG ,  Zhengbo CUI ,  Hao CHEN

IPC: H01L27/12 ,  H01L25/16

CPC classification number: H01L27/124 ,  H01L25/167

Abstract: A display panel is provided, including a grounding signal wiring, driving chips, a driving chip input output signal wiring, and a power line. A grounding signal pin is connected to the grounding signal wiring. The driving chip input output signal wiring is configured to connect a stage-transfer signal input pin and a stage-transfer signal output pin of two adjacent driving chips. The grounding signal wiring, the driving chip input output signal wiring, and the power line are disposed in a same layer and do not intersect with each other.

公开(公告)号：US20250133834A1

公开(公告)日：2025-04-24

申请号：US19007870

申请日：2025-01-02

Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Jing LIU ,  Hongzhao DENG ,  Zhengbo CUI ,  Hao CHEN

IPC: H10D86/60 ,  H01L25/16 ,  H10D86/40

Abstract: A display panel is provided, including a grounding signal wiring, driving chips, a driving chip input output signal wiring, and a power line. A grounding signal pin is connected to the grounding signal wiring. The driving chip input output signal wiring is configured to connect a stage-transfer signal input pin and a stage-transfer signal output pin of two adjacent driving chips. The grounding signal wiring, the driving chip input output signal wiring, and the power line are disposed in a same layer and do not intersect with each other.

公开(公告)号：US20240055418A1

公开(公告)日：2024-02-15

申请号：US17765588

申请日：2022-03-30

Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Jing LIU ,  Hongzhao DENG ,  Zhengbo CUI ,  Yichen BAI

IPC: H01L25/16 ,  H01L27/12

CPC classification number: H01L25/167 ,  H01L27/124

Abstract: A display panel is provided, including a power line, light-emitting lamp groups, partition channel wirings, driving chips, and a grounding signal wiring. The driving chips, the light-emitting lamp groups, and the partition channel wirings are disposed between the power line and the grouping signal wiring spaced apart. The driving chips are connected to the grounding signal wiring. The light-emitting lamp groups are connected to the power line. The partition channel wirings are connected to the light-emitting lamp groups. The power line, the grounding signal wiring, and the partition channel wirings are disposed in a same layer.