MULTILAYER ELECTRONIC COMPONENT
    1.
    发明申请

    公开(公告)号:US20220294409A1

    公开(公告)日:2022-09-15

    申请号:US17688067

    申请日:2022-03-07

    Abstract: An electronic component includes a first and second inductor forming sections integrated with a stack, and a connection conductor layer connecting the first and second inductor forming sections inside the stack. In the first inductor forming section, two first through hole lines are connected to a wide portion of an inductor conductor layer, and two second through hole lines are connected to a narrow portion of the inductor conductor layer. In the second inductor forming section, two first through hole lines are connected to a wide portion of an inductor conductor layer, and two second through hole lines are connected to a narrow portion of the inductor conductor layer.

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