公开(公告)号：US20250014775A1

公开(公告)日：2025-01-09

申请号：US18897160

申请日：2024-09-26

Applicant: TDK Corporation

Inventor： Hiroshi SHINGAI ,  Keisuke NISHIOKA ,  Haruna OGAWA ,  Shinsuke HASHIMOTO

IPC: H01B1/22 ,  H01B17/64

Abstract: A conductive film including a film-like base material and a conductive layer provided on one main surface side of the base material is provided. The conductive layer includes a first metal layer containing a first metal and a second metal layer containing a second metal different from the first metal, provided in order from the base material side. The first metal layer includes grain boundaries.

公开(公告)号：US20250022629A1

公开(公告)日：2025-01-16

申请号：US18897309

申请日：2024-09-26

Applicant: TDK Corporation

Inventor： Hiroshi SHINGAI ,  Keisuke NISHIOKA ,  Haruna OGAWA ,  Shinsuke HASHIMOTO

IPC: H01B1/22 ,  H01B17/64

Abstract: A conductive film includes a base material 1, a first resin layer 10 provided on the base material 1, a second resin layer 20 provided on the first resin layer 10 and having a trench 25 opening to a surface opposite to the first resin layer 10, and a conductive layer 30 provided in the trench 25. The first resin layer 10 contains a first resin portion 12 and a plurality of first inorganic particles 11. At least a part of the plurality of first inorganic particles 11 partially protrude from the first resin portion 12 toward the second resin layer 20.