公开(公告)号：US20220073791A1

公开(公告)日：2022-03-10

申请号：US17416751

申请日：2019-12-17

Applicant: TESA SE

Inventor： Julia SCHÖNROCK ,  CaiRong LIM ,  Yeliz TEPE

IPC: C09J7/38 ,  C09J7/25

Abstract: A process for producing a cured pressure-sensitive adhesive that comprises a composition including at least one solid acrylonitrile-butadiene rubber, at least one tackifier resin, and optionally at least one liquid acrylonitrile-butadiene rubber, comprises subjecting the composition to electron-beam irradiation (EBC) with an acceleration voltage of 1.8 to 2.38 kV per 1 pm layer thickness of the composition and with a total beam dose of 5 to 50 kGy. Also disclosed is a cured pressure-sensitive adhesive obtained or obtainable by the process. Further disclosed is a double-sidedly adhering, especially carrierless, adhesive tape, and also single- or double-sidedly adhering adhesive tape comprising, on a carrier layer, the cured pressure-sensitive adhesive. Disclosed finally is the use of the pressure-sensitive adhesive or of an adhesive tape made therefrom for bonding components in electronic devices, especially in mobile electronic devices, preferably tablets, mobile phones or smart watches.

公开(公告)号：US20200010732A1

公开(公告)日：2020-01-09

申请号：US16488472

申请日：2018-01-29

Applicant: TESA SE

Inventor： Beatrice SALERT ,  Michael EGGER ,  CaiRong LIM

IPC: C09J7/38 ,  C09J109/02

Abstract: Disclosed is a pressure-sensitive adhesive strip comprising a carrier and a pressure-sensitive adhesive compound layer HS1 on one of the surfaces of said carrier, wherein (i) the carrier has a breaking elongation of at least 250% in the longitudinal direction and/or transverse direction, and (ii) the pressure-sensitive adhesive compound layer HS1 consists of a pressure-sensitive adhesive compound which contains, as the base polymer, at least one solid acrylonitrile-butadiene rubber as well as at least one adhesive resin, wherein the proportion of adhesive resin is in total 30 to 130 phr.