公开(公告)号：US20210118779A1

公开(公告)日：2021-04-22

申请号：US16660713

申请日：2019-10-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hung-Yu CHOU ,  Chi-Chen CHIEN ,  Yuh-Harng CHIEN ,  Steven Alfred KUMMERL ,  Bo-Hsun PAN ,  Fu-Hua YU

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31 ,  H01L23/522

Abstract: In some examples, a semiconductor package comprises a lead frame. The lead frame includes a first row of leads; a first pad coupled to the first row of leads; a second row of leads; and a second pad coupled to the second row of leads, the first and second pads separated by a gap. The semiconductor package includes a heat-generating device coupled to the first and second pads and exposed to an exterior of the semiconductor package.