公开(公告)号：US20230063262A1

公开(公告)日：2023-03-02

申请号：US17463124

申请日：2021-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chung-Hao LIN ,  Hung-Yu CHOU ,  Bo-Hsun PAN ,  Dong-Ren PENG ,  Pi-Chiang HUANG ,  Yuh-Harng CHIEN

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: In some examples a semiconductor chip package includes a conductive terminal. In addition, the semiconductor chip package includes a die pad including a top side and a recess extending into the top side. The die pad is downset relative to the conductive terminal. Further, the semiconductor ship package includes a semiconductor die positioned within the recess, wherein the semiconductor die has an outer perimeter, and a solder fillet engaged within the recess and with the outer perimeter of the semiconductor die. Still further, the semiconductor chip package includes a wire bond coupled to the semiconductor die and the conductive terminal, and a mold compound covering the conductive terminal, the wire bond, the die pad, and the semiconductor die.