公开(公告)号：US20180132353A1

公开(公告)日：2018-05-10

申请号：US15574133

申请日：2016-05-27

Applicant: THALES

Inventor： Eric PREDON ,  Pierre BELEC

IPC: H05K1/14 ,  H05K1/02 ,  H05K3/22

CPC classification number: H05K1/144 ,  H05K1/0203 ,  H05K3/22 ,  H05K7/20545

Abstract: An electronic circuit board comprising an assembly of a printed circuit board comprises a first face receiving at least one electronic component, and a heat sink, the printed circuit board and the heat sink stacked in a stacking direction, the heat sink fixed to the printed circuit board on a second face opposite the first face, the heat sink comprising a base, in the form of a plate, and reliefs extending from a flat surface of the base, the reliefs intended to increase the contact surface between the heat sink and a flow of air relative to the contact surface between the base and the flow of air, the base interposed between the printed circuit board and the reliefs in the stacking direction, the heat sink fixed directly to the printed circuit board by gluing only and wherein the heat sink is of a single piece.