公开(公告)号：US20230359857A1

公开(公告)日：2023-11-09

申请号：US18221279

申请日：2023-07-12

Applicant: TOPPAN INC.

Inventor： Eriko UEHARA ,  Yukiko KATANO ,  Shigeki MINEMURA

IPC: G06K19/077 ,  G06K19/07 ,  H05K1/09 ,  H05K1/18

CPC classification number: G06K19/07745 ,  G06K19/0718 ,  G06K19/07743 ,  H05K1/09 ,  H05K1/186

Abstract: A card-type medium includes a card body; an exposed component that is accommodated inside an opening formed in a front surface of the card body and is disposed so as to be partially exposed on the front surface; and a circuit board that is embedded in the card body and to which the exposed component is attached. The exposed component includes a first exposed component that is attached to the circuit board with an intermediate spacer interposed therebetween. The first exposed component and the intermediate spacer are joined together by a first conductive joining material. The circuit board and the intermediate spacer are joined together by a second conductive joining material. A joint-forming temperature of the first conductive joining material and a joint-forming temperature of the second conductive joining material are different from each other.