公开(公告)号：US12200859B2

公开(公告)日：2025-01-14

申请号：US17860438

申请日：2022-07-08

Applicant: TOPPAN INC.

Inventor： Jun Onohara

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/16

Abstract: A circuit board having excellent reliability of connection between layers while being capable of achieving a compact and low-profile electronic device. In the circuit board has an LC circuit built therein with the use of a glass core having a through hole, a conductor layer formed in the through hole is connected to a wiring pattern formed on one surface of the glass core, and connected to a wiring pattern formed on the other surface of the glass core, with the conduction layer projected from the surface of the glass core. Thus, the area of contact between the conduction layer and the through hole is increased, thus making it possible to prevent the reliability of connection between layers in the through hole from being decreased, even when the glass core is reduced in thickness for achieving a low-profile device.