IC CARD AND METHOD FOR MANUFACTURING IC CARD

    公开(公告)号:US20230259734A1

    公开(公告)日:2023-08-17

    申请号:US18134959

    申请日:2023-04-14

    Applicant: TOPPAN INC.

    CPC classification number: G06K19/07354

    Abstract: An IC card provided with an IC chip, and configured to enable at least one of contact communication and contactless communication, the IC card including an ultrasonic fingerprint sensor connected to the IC chip and a storage unit in which fingerprint data for matching is stored. An outer surface of the IC card is formed of synthetic resin, and the ultrasonic fingerprint sensor is covered with the synthetic resin.

    CARD-TYPE MEDIA
    2.
    发明申请

    公开(公告)号:US20230111259A1

    公开(公告)日:2023-04-13

    申请号:US18079172

    申请日:2022-12-12

    Applicant: TOPPAN INC.

    Abstract: A card-type medium includes: a card body; an internal component embedded in the card body; an exposed component partially exposed on a front surface of the card body; and a circuit board to which the internal component and the exposed component are bonded, wherein the circuit board includes a first connection portion to which the internal component is bonded, a second connection portion to which the exposed component is bonded, the second connection portion being located at a position different from the first connection portion in a card thickness direction connecting the front surface of the card body and a rear surface on an opposite side of the card body to the front surface, and a connection wiring portion that connects the first connection portion and the second connection portion, the connection wiring portion extending in a direction including the card thickness direction.

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