公开(公告)号：US20220278157A1

公开(公告)日：2022-09-01

申请号：US17749808

申请日：2022-05-20

Applicant: TOPPAN Inc.

Inventor： Kazuhiro TAJIMA ,  Kenta ARIYAMA

IPC: H01L27/146

Abstract: A solid-state imaging device including a semiconductor substrate including photoelectric conversion elements formed in first and second directions, color filters of respective colors formed on the semiconductor substrate, and lens elements formed on the color filters. Each of the lens elements includes a transmission portion and a microlens portion, the microlens portion has a height greater than a height of the transmission portion, the transmission portion is formed between the microlens portion and the color filter such that light from the microlens portion is transmitted toward the photoelectric conversion element, and the lens elements are formed such that the microlens portions have gaps between the microlens portions adjacent in the first and second directions, and a third direction intersecting the first and second directions at 45° , and that the transmission portions are formed connected to each other with no gaps therebetween in the first, second and third directions.