公开(公告)号：US20240036237A1

公开(公告)日：2024-02-01

申请号：US18483039

申请日：2023-10-09

Applicant: TOPPAN Inc.

Inventor： Tomohiro SHIMAZAKI

IPC: G02B3/00 ,  H01L27/146 ,  H01L27/15

CPC classification number: G02B3/0043 ,  H01L27/14627 ,  H01L27/14621 ,  H01L27/156

Abstract: A solid-state imaging element includes a semiconductor substrate having photoelectric conversion elements, a color filter layer formed on the semiconductor substrate and having types of color filters positioned corresponding to the photoelectric conversion elements, and a microlens array including microlenses positioned corresponding to the color filters. The microlens array includes a PDAF pixel microlens positioned in a PDAF pixel of a pixel array unit and imaging pixel microlenses positioned in imaging pixels of the pixel array unit. The PDAF pixel microlens includes a lens part and a pedestal part adjoining the lens part and has a greater height than the imaging pixel microlenses.