公开(公告)号：US11839949B2

公开(公告)日：2023-12-12

申请号：US16951850

申请日：2020-11-18

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.

Inventor： Long-Fei Liu ,  Yen-Sheng Lin ,  Gao-Yang Deng ,  Yao-Wei Hong ,  Xue Peng

IPC: B24B7/07

CPC classification number: B24B7/07

Abstract: A grinding and polishing device includes a main body, a grinding disk, a sample disk, a first console, and a second console. The main body includes a support table and a support column. The support table is coupled to the support column. The grinding disk is fixed on the support table and includes a polishing surface. The sample disk is fixed on the support column and configured to hold a preform. The first console is electrically coupled to the sample disk and used for controlling a distance between the preform held by the sample disk and the grinding disk. The second console is electrically coupled to the grinding disk and used for controlling a working state of the grinding disk for grinding and polishing the preform.