公开(公告)号：US20220392796A1

公开(公告)日：2022-12-08

申请号：US17846431

申请日：2022-06-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

Inventor： Chien-Chih CHEN ,  Yao-Min YU ,  Ching-Ling LEE ,  Ren-Dou LEE

IPC: H01L21/677 ,  H01L21/687 ,  B25J11/00

Abstract: In an embodiment, a system includes: a cassette comprising a slit opening configured to house a wafer; a blade configured to move the wafer to and from the slit opening by extending into the slit opening, wherein a blade thickness of the blade is at most ⅖ of a height of the slit opening and wherein the blade is configured to secure the wafer within a pocket on the blade that is at least ⅔ of a wafer thickness of the wafer.