公开(公告)号：US09305688B2

公开(公告)日：2016-04-05

申请号：US14046177

申请日：2013-10-04

Applicant: Texas Instruments Incorporated

Inventor： PingHai Hao ,  Fuchao Wang ,  Duofeng Yue

IPC: H01C1/012 ,  H01C17/06 ,  H01L49/02 ,  H01C7/00 ,  H01C17/075

CPC classification number: H01L28/24 ,  H01C7/006 ,  H01C17/06 ,  H01C17/075 ,  Y10T29/435

Abstract: An integrated circuit contains a thin film resistor in which a body of the thin film resistor is disposed over a lower dielectric layer in a system of interconnects in the integrated circuit. Heads of the thin film resistor are disposed over electrodes which are interconnect elements in the lower dielectric layer, which provide electrical connections to a bottom surface of the thin film resistor. Top surfaces of the electrodes are substantially coplanar with a top surface of the lower dielectric layer. A top surface of the thin film resistor is free of electrical connections. An upper dielectric layer is disposed over the thin film resistor.

Abstract translation: 集成电路包括薄膜电阻器，其中薄膜电阻体的主体设置在集成电路中的互连系统中的下介电层上。 薄膜电阻器的头部设置在电介质上，电极是下电介质层中的互连元件，其提供与薄膜电阻器的底表面的电连接。 电极的顶表面与下介电层的顶表面基本共面。 薄膜电阻的顶表面没有电气连接。 上电介质层设置在薄膜电阻器的上方。

公开(公告)号：US20140184381A1

公开(公告)日：2014-07-03

申请号：US14046177

申请日：2013-10-04

Applicant: Texas Instruments Incorporated

Inventor： PingHai HAO ,  Fuchao WANG ,  Duofeng Yue

IPC: H01C1/012 ,  H01C17/06

CPC classification number: H01L28/24 ,  H01C7/006 ,  H01C17/06 ,  H01C17/075 ,  Y10T29/435

Abstract: An integrated circuit contains a thin film resistor in which a body of the thin film resistor is disposed over a lower dielectric layer in a system of interconnects in the integrated circuit. Heads of the thin film resistor are disposed over electrodes which are interconnect elements in the lower dielectric layer, which provide electrical connections to a bottom surface of the thin film resistor. Top surfaces of the electrodes are substantially coplanar with a top surface of the lower dielectric layer. A top surface of the thin film resistor is free of electrical connections. An upper dielectric layer is disposed over the thin film resistor.

Abstract translation: 集成电路包括薄膜电阻器，其中薄膜电阻体的主体设置在集成电路中的互连系统中的下介电层上。 薄膜电阻器的头部设置在电介质上，电极是下电介质层中的互连元件，其提供与薄膜电阻器的底表面的电连接。 电极的顶表面与下介电层的顶表面基本共面。 薄膜电阻的顶表面没有电气连接。 上电介质层设置在薄膜电阻器的上方。

公开(公告)号：US09842895B2

公开(公告)日：2017-12-12

申请号：US15055959

申请日：2016-02-29

Applicant: Texas Instruments Incorporated

Inventor： Pinghai Hao ,  Fuchao Wang ,  Duofeng Yue

IPC: H01C1/012 ,  H01L49/02 ,  H01C17/06 ,  H01C7/00 ,  H01C17/075

CPC classification number: H01L28/24 ,  H01C7/006 ,  H01C17/06 ,  H01C17/075 ,  Y10T29/435

Abstract: An integrated circuit contains a thin film resistor in which a body of the thin film resistor is disposed over a lower dielectric layer in a system of interconnects in the integrated circuit. Heads of the thin film resistor are disposed over electrodes which are interconnect elements in the lower dielectric layer, which provide electrical connections to a bottom surface of the thin film resistor. Top surfaces of the electrodes are substantially coplanar with a top surface of the lower dielectric layer. A top surface of the thin film resistor is free of electrical connections. An upper dielectric layer is disposed over the thin film resistor.