公开(公告)号：US11538743B2

公开(公告)日：2022-12-27

申请号：US17108920

申请日：2020-12-01

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  Jk Ho

IPC: H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L23/522 ,  H01L23/64

Abstract: A microelectronic device has a first die attached to a first die pad, and a second die attached to a second die pad. A magnetically permeable member is attached to a first coupler pad and a second coupler pad. A coupler component is attached to the magnetically permeable member. The first die pad, the second die pad, the first coupler pad, the second coupler pad, and the magnetically permeable member are electrically conductive. The first coupler pad is electrically isolated from the first die, from the second coupler pad, and from external leads of the microelectronic device. The second coupler pad is electrically isolated from the first die and from the external leads. The first die and the second die are electrically coupled to the coupler component. A package structure contains at least portions of the components of the microelectronic device and extends to the external leads.