公开(公告)号：US20250105104A1

公开(公告)日：2025-03-27

申请号：US18475563

申请日：2023-09-27

Applicant: Texas Instruments Incorporated

Inventor： Li Jiang ,  Rey Javier ,  Guangxu Li ,  Enis Tuncer

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: An electronic device includes a package structure having four lateral corners, a semiconductor die at least partially enclosed inside the package structure and attached to a die attach pad, conductive leads at least partially exposed outside the package structure along the four lateral sides, a first one of the conductive leads electrically connected to the semiconductor die, an instance of a first conductive feature partially exposed outside the package structure at each of the corners, and an instance of a second conductive feature partially exposed outside the package structure and contacting a respective instance of the first conductive feature at each of the corners, the instance of the second conductive feature exposed outside the package structure along the first side.