公开(公告)号：US11774519B2

公开(公告)日：2023-10-03

申请号：US17003693

申请日：2020-08-26

Applicant: Texas Instruments Incorporated

Inventor： Yong Deng ,  Jo Bito ,  Benjamin Stassen Cook

IPC: G01R33/00 ,  G01R33/07 ,  H05K9/00

CPC classification number: G01R33/0076 ,  G01R33/07 ,  H05K9/0045 ,  H05K9/0075

Abstract: In a described example, a structure includes a substrate having a surface with multiple sides. A sensor is positioned within the substrate and a seed layer is over at least four sides of the surface of the substrate. A magnetic shield layer is over the seed layer for the at least four sides of the surface of the substrate.