公开(公告)号：US20180342659A1

公开(公告)日：2018-11-29

申请号：US16037835

申请日：2018-07-17

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： Patrick J. Taylor ,  Sudhir Trivedi ,  Wendy L. Sarney

IPC: H01L35/08 ,  H01L35/34 ,  H01L23/00

Abstract: Provided among other things is an electrical device comprising: a first component that is a semiconductor or an electrical conductor; a second component that is an electrical conductor; and a strong, heat stable junction there between including an intermetallic bond formed of: substantially (a) tin (Sn) or a mixture of Sn and indium (In) thereof, and (b) substantially nickel (Ni). The junction can have an electrical contact resistance that is small compared to the resistance of the electrical device.

公开(公告)号：US10026708B2

公开(公告)日：2018-07-17

申请号：US13657957

申请日：2012-10-23

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： Patrick J Taylor ,  Sudhir Trivedi ,  Wendy L Sarney

IPC: H01L23/48 ,  H01L23/00

Abstract: Provided among other things is an electrical device comprising: a first component that is a semiconductor or an electrical conductor; a second component that is an electrical conductor; and a strong, heat stable junction there between including an intermetallic bond formed of: substantially (a) indium (In), tin (Sn) or a mixture thereof, and (b) substantially nickel (Ni). The junction can have an electrical contact resistance that is small compared to the resistance of the electrical device.