公开(公告)号：US20180366316A1

公开(公告)日：2018-12-20

申请号：US15623186

申请日：2017-06-14

Applicant: United Microelectronics Corp.

Inventor： Chun-Jung Wang ,  Chia-Ming Lee ,  Tsung-Hsun Tsai ,  Kuo-Wei Chih ,  Chia-Yen Hsu

IPC: H01L21/02 ,  B08B3/08 ,  B08B3/10

Abstract: A method is provided for cleaning a semiconductor structure. The method includes performing a rinse process of CO2 with water (CO2W) process over the semiconductor structure; and performing a standard clean (SC) process over the semiconductor structure with an overlapping period with the step of performing the rinse process of CO2W.