公开(公告)号：US08890084B1

公开(公告)日：2014-11-18

申请号：US14016243

申请日：2013-09-03

Applicant: United Microelectronics Corp.

Inventor： Bin Guo ,  Xu Ma ,  Hong Liao

IPC: G01J1/42 ,  G01N23/00

CPC classification number: H01L22/30

Abstract: A method for analyzing circuit pattern is disclosed. The method includes the steps of: providing a plurality of monitor metal line structures formed on discrete locations of a substrate corresponding to different values of variable factors; performing a defect review to identify failure locations of the monitor metal line structures; determining a failure tendency of the monitor metal line structures so as to determine a boundary of the variable factors; and determining whether adjustment is to be made to product metal line structures.

Abstract translation: 公开了一种用于分析电路图案的方法。 该方法包括以下步骤：提供形成在对应于可变因子的不同值的衬底的离散位置上的多个监视金属线结构; 执行缺陷检查以识别监视器金属线结构的故障位置; 确定监视器金属线结构的故障趋势，以便确定可变因子的边界; 并且确定是否对产品金属线结构进行调整。