Substrate apparatus with multi-layer substrate for cell-based meat cultivators

    公开(公告)号:US11959054B2

    公开(公告)日:2024-04-16

    申请号:US17755761

    申请日:2021-11-04

    CPC classification number: C12M21/08 C12M23/34 C08J5/18

    Abstract: The present disclosure relates to a substrate apparatus (and methods of manufacturing the same) with one or more substrates having a substrate spacing for growing a cell mass. In particular embodiments, the disclosed substrate apparatus includes a substrate wound into a coiled configuration with an intra-coil spacing between coil layers. To provide the intra-coil spacing, certain implementations use a separator. For example, a separator is applied to a substrate surface, and the separator-substrate combination is wound together (e.g., around a spool). In turn, a locking element is attached to the substrate to maintain the coiled configuration. The separator is then removed via heat treatment, chemical treatment, or physical displacement—thereby leaving the intra-coil spacing between the coil layers. Alternatively, no separator is used to provide a substrate spacing. For example, in lieu of a separator, the locking element is actively applied to the substrate during the winding process.

    SUBSTRATE APPARATUS WITH MULTI-LAYER SUBSTRATE FOR CELL-BASED MEAT CULTIVATORS

    公开(公告)号:US20240218307A1

    公开(公告)日:2024-07-04

    申请号:US18608451

    申请日:2024-03-18

    CPC classification number: C12M21/08 C12M23/34 C08J5/18

    Abstract: The present disclosure relates to a substrate apparatus (and methods of manufacturing the same) with one or more substrates having a substrate spacing for growing a cell mass. In particular embodiments, the disclosed substrate apparatus includes a substrate wound into a coiled configuration with an intra-coil spacing between coil layers. To provide the intra-coil spacing, certain implementations use a separator. For example, a separator is applied to a substrate surface, and the separator-substrate combination is wound together (e.g., around a spool). In turn, a locking element is attached to the substrate to maintain the coiled configuration. The separator is then removed via heat treatment, chemical treatment, or physical displacement-thereby leaving the intra-coil spacing between the coil layers. Alternatively, no separator is used to provide a substrate spacing. For example, in lieu of a separator, the locking element is actively applied to the substrate during the winding process.

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