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公开(公告)号：US20210101177A1
公开(公告)日：2021-04-08
申请号：US17074559
申请日：2020-10-19
IPC分类号： B06B1/04
摘要： A haptic actuator includes mechanical links defining a first J-trajectory and mechanical links defining a second J-trajectory as well as a motor coupled to the mechanical links so as to synchronously accelerate a first mass over the first J-trajectory and a second mass over the second J-trajectory. During a first time interval, reactive forces of the first mass accelerating substantially balance reactive forces of the second mass accelerating and during a second time interval reactive forces of the first mass accelerating do not substantially balance reactive forces of the second mass accelerating. This un-balanced condition results in a tap signal being produced.
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公开(公告)号：US11465175B2
公开(公告)日：2022-10-11
申请号：US17074559
申请日：2020-10-19
IPC分类号： B06B1/04
摘要： A haptic actuator includes mechanical links defining a first J-trajectory and mechanical links defining a second J-trajectory as well as a motor coupled to the mechanical links so as to synchronously accelerate a first mass over the first J-trajectory and a second mass over the second J-trajectory. During a first time interval, reactive forces of the first mass accelerating substantially balance reactive forces of the second mass accelerating and during a second time interval reactive forces of the first mass accelerating do not substantially balance reactive forces of the second mass accelerating. This un-balanced condition results in a tap signal being produced.
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公开(公告)号：US11832404B2
公开(公告)日：2023-11-28
申请号：US16933585
申请日：2020-07-20
CPC分类号： H05K5/0226 , E05D1/00 , E05D1/02 , E05D11/0081 , Y10T29/49004
摘要： An assembly structure is formed of generally rigid layers of material bonded to generally flexible layers so as to form apparatus including hinges, bearings, and other translating and rotating subunits along with embedded functional devices.
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公开(公告)号：US10721828B2
公开(公告)日：2020-07-21
申请号：US16431476
申请日：2019-06-04
摘要： An assembly structure is formed of generally rigid layers of material bonded to generally flexible layers so as to form apparatus including hinges, bearings, and other translating and rotating subunits along with embedded functional devices.
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公开(公告)号：US20200375047A1
公开(公告)日：2020-11-26
申请号：US16933585
申请日：2020-07-20
摘要： An assembly structure is formed of generally rigid layers of material bonded to generally flexible layers so as to form apparatus including hinges, bearings, and other translating and rotating subunits along with embedded functional devices.
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公开(公告)号：US10315220B2
公开(公告)日：2019-06-11
申请号：US15242508
申请日：2016-08-20
IPC分类号： B06B1/04
摘要： A haptic actuator includes mechanical links defining a first J-trajectory and mechanical links defining a second J-trajectory as well as a motor coupled to the mechanical links so as to synchronously accelerate a first mass over the first J-trajectory and a second mass over the second J-trajectory. During a first time interval, reactive forces of the first mass accelerating substantially balance reactive forces of the second mass accelerating and during a second time interval reactive forces of the first mass accelerating do not substantially balance reactive forces of the second mass accelerating. This un-balanced condition results in a tap signal being produced.
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公开(公告)号：US20220259038A1
公开(公告)日：2022-08-18
申请号：US17739959
申请日：2022-05-09
摘要： A method for manufacturing a millimeter scale electromechanical device includes coupling a stainless steel ply to a polymer carrier ply, coating the stainless steel ply in a photo resist material, masking the photoresist material, exposing the photoresist material to cure a portion of the photoresist material, developing the photoresist material to remove uncured photoresist material from the stainless steel ply, chemically etching the stainless steel ply to remove a patterned portion of the stainless steel ply, dissolving the polymer carrier ply to release unwanted chips of the stainless steel ply, and adhering the patterned stainless steel ply to a flexible material ply to form a sub-laminate.
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公开(公告)号：US11325828B2
公开(公告)日：2022-05-10
申请号：US16279966
申请日：2019-02-19
摘要： A method for manufacturing a millimeter scale electromechanical device includes coupling a stainless steel ply to a polymer carrier ply, coating the stainless steel ply in a photo resist material, masking the photoresist material, exposing the photoresist material to cure a portion of the photoresist material, developing the photoresist material to remove uncured photoresist material from the stainless steel ply, chemically etching the stainless steel ply to remove a patterned portion of the stainless steel ply, dissolving the polymer carrier ply to release unwanted chips of the stainless steel ply, and adhering the patterned stainless steel ply to a flexible material ply to form a sub-laminate.
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公开(公告)号：US10828674B2
公开(公告)日：2020-11-10
申请号：US16411088
申请日：2019-05-13
IPC分类号： B06B1/04
摘要： A haptic actuator includes mechanical links defining a first J-trajectory and mechanical links defining a second J-trajectory as well as a motor coupled to the mechanical links so as to synchronously accelerate a first mass over the first J-trajectory and a second mass over the second J-trajectory. During a first time interval, reactive forces of the first mass accelerating substantially balance reactive forces of the second mass accelerating and during a second time interval reactive forces of the first mass accelerating do not substantially balance reactive forces of the second mass accelerating. This un-balanced condition results in a tap signal being produced.
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