公开(公告)号：US07777160B2

公开(公告)日：2010-08-17

申请号：US12002381

申请日：2007-12-17

申请人： Wei Fan ,  Benjamin J. Olechnowicz ,  Marc Schaepkens ,  David M. Rusinko, Jr. ,  Xiang Liu ,  John T. Mariner

发明人： Wei Fan ,  Benjamin J. Olechnowicz ,  Marc Schaepkens ,  David M. Rusinko, Jr. ,  Xiang Liu ,  John T. Mariner

IPC分类号： H05B3/68 ,  C23C16/00

CPC分类号： H01L21/68735 ,  H01L21/67103 ,  H05B3/143

摘要： A layered heater structure including an electrode layer and a localized tuning method for tuning the electrode layer of a layered heater structure with high precision is provided. The localized tuning method tunes the electrode layer to its proper local resistance to minimize temperature offsets on the heater surface and thus provide a desired thermal profile that is in marked contrast to conventional, non-localized resistance tuning approaches based on thickness trimming practices, such as grinding or blasting, or resistivity adjustment, such as local heat treatment.

摘要翻译： 提供了包括电极层和用于高精度地调谐层状加热器结构的电极层的局部调谐方法的层状加热器结构。 局部调谐方法将电极层调整到其适当的局部电阻以最小化加热器表面上的温度偏移，并因此提供期望的热分布，其与基于厚度修整实践的常规非局部电阻调谐方法形成鲜明对比，例如 研磨或爆破，或电阻率调整，如局部热处理。

公开(公告)号：US20090152259A1

公开(公告)日：2009-06-18

申请号：US12002381

申请日：2007-12-17

申请人： Wei Fan ,  Benjamin J. Olechnowicz ,  Marc Schaepkens ,  David M. Rusinko, JR. ,  Xiang Liu ,  John T. Mariner

发明人： Wei Fan ,  Benjamin J. Olechnowicz ,  Marc Schaepkens ,  David M. Rusinko, JR. ,  Xiang Liu ,  John T. Mariner

IPC分类号： H05B3/68 ,  G06F17/50 ,  G06G7/62

CPC分类号： H01L21/68735 ,  H01L21/67103 ,  H05B3/143

摘要： A layered heater structure including an electrode layer and a localized tuning method for tuning the electrode layer of a layered heater structure with high precision is provided. The localized tuning method tunes the electrode layer to its proper local resistance to minimize temperature offsets on the heater surface and thus provide a desired thermal profile that is in marked contrast to conventional, non-localized resistance tuning approaches based on thickness trimming practices, such as grinding or blasting, or resistivity adjustment, such as local heat treatment.

摘要翻译： 提供了包括电极层和用于高精度地调谐层状加热器结构的电极层的局部调谐方法的层状加热器结构。 局部调谐方法将电极层调整到其适当的局部电阻以最小化加热器表面上的温度偏移，并因此提供期望的热分布，其与基于厚度修整实践的常规非局部电阻调谐方法形成鲜明对比，例如 研磨或爆破，或电阻率调整，如局部热处理。

公开(公告)号：US20080016684A1

公开(公告)日：2008-01-24

申请号：US11557905

申请日：2006-11-08

申请人： Benjamin J. Olechnowicz ,  David M. Rusinko ,  Wei Fan ,  Demetrius Sarigiannis ,  Marc Schaepkens ,  Douglas A. Longworth

发明人： Benjamin J. Olechnowicz ,  David M. Rusinko ,  Wei Fan ,  Demetrius Sarigiannis ,  Marc Schaepkens ,  Douglas A. Longworth

IPC分类号： H01R43/00

CPC分类号： H01L21/67103 ,  C03C3/062 ,  C03C4/20 ,  H01L21/6875 ,  H01L21/68757 ,  H01L21/68785 ,  Y10T29/53213

摘要： A wafer processing apparatus characterized by having corrosion resistant connections for its electrical connections, gas feed-through channels, recessed areas, raised areas, MESA, through-holes such as lift-pin holes, threaded bolt holes, blind holes, and the like, with the special configurations employing connectors and fillers having excellent chemical resistant properties and optimized CTEs, i.e., having a coefficient of thermal expansion (CTE) that closely matches the CTE of the base substrate layer, the electrode(s), as well as the CTE of coating layer. In one embodiment, a nickel plated molybdenum insert is employed.

摘要翻译： 一种晶片处理装置，其特征在于具有用于其电连接，气体馈通通道，凹陷区域，凸起区域，MESA，诸如提升针孔，螺纹孔，盲孔等通孔的耐腐蚀连接， 具有采用具有优异的耐化学性能和优化的CTE的连接器和填料的特殊构造，即具有与基底衬底层，电极以及CTE的CTE密切匹配的热膨胀系数（CTE） 的涂层。 在一个实施例中，使用镀镍的钼插入件。

公开(公告)号：US20080066676A1

公开(公告)日：2008-03-20

申请号：US11549968

申请日：2006-10-16

申请人： John Mariner ,  Ajit Sane ,  Toshiki Ebata ,  Marc Schaepkens ,  Xiang Liu ,  Wei Fan

发明人： John Mariner ,  Ajit Sane ,  Toshiki Ebata ,  Marc Schaepkens ,  Xiang Liu ,  Wei Fan

IPC分类号： C23C16/00

CPC分类号： C23C16/4586 ,  H01L21/67103

摘要： A heating apparatus for regulating/controlling the surface temperature of a substrate is provided. At least a thermal pyrolytic graphite (TPG) layer is embedded in the heater to diffuse the temperature difference of the various components in the heating apparatus and provide temporal and spatial control of the surface temperature of the substrate, for a relatively uniform substrate temperature with the difference between the maximum and minimum temperature points on the substrate of less than 10° C.

摘要翻译： 提供一种用于调节/控制基板的表面温度的加热装置。 至少一个热解石墨（TPG）层嵌入在加热器中以扩散加热装置中的各种组分的温度差，并提供衬底的表面温度的时间和空间控制，对于相对均匀的衬底温度， 基板上最大和最小温度点之间的差值小于10°C

公开(公告)号：US07901509B2

公开(公告)日：2011-03-08

申请号：US11549968

申请日：2006-10-16

申请人： John Mariner ,  Ajit Sane ,  Toshiki Ebata ,  Marc Schaepkens ,  Xiang Liu ,  Wei Fan

发明人： John Mariner ,  Ajit Sane ,  Toshiki Ebata ,  Marc Schaepkens ,  Xiang Liu ,  Wei Fan

IPC分类号： C23C16/00 ,  H01L21/306

CPC分类号： C23C16/4586 ,  H01L21/67103

摘要： A heating apparatus for regulating/controlling the surface temperature of a substrate is provided. At least a thermal pyrolytic graphite (TPG) layer is embedded in the heater to diffuse the temperature difference of the various components in the heating apparatus and provide temporal and spatial control of the surface temperature of the substrate, for a relatively uniform substrate temperature with the difference between the maximum and minimum temperature points on the substrate of less than 10° C.

摘要翻译： 提供一种用于调节/控制基板的表面温度的加热装置。 至少一个热解石墨（TPG）层被嵌入在加热器中以扩散加热装置中的各种组分的温度差，并提供衬底的表面温度的时间和空间控制，对于相对均匀的衬底温度， 基板上最大和最小温度点之间的差值小于10°C

公开(公告)号：US20070181065A1

公开(公告)日：2007-08-09

申请号：US11550785

申请日：2006-10-18

申请人： Akinobu Otaka ,  Takeshi Higuchi ,  Sridhar Ramaprasad Prasad ,  Wei Fan ,  Marc Schaepkens ,  Douglas A. Longworth

发明人： Akinobu Otaka ,  Takeshi Higuchi ,  Sridhar Ramaprasad Prasad ,  Wei Fan ,  Marc Schaepkens ,  Douglas A. Longworth

IPC分类号： C23C16/00

CPC分类号： C23C16/4581 ,  C23C16/46 ,  H01L21/67103

摘要： An etch resistant heater for use in a wafer processing assembly with an excellent ramp rate of at least 20° C. per minute. The heater is coated with a protective overcoating layer allowing the heater to have a radiation efficiency above 70% at elevated heater temperatures of >1500° C., and an etch rate in NF3 at 600° C. of less than 100 A/min.

摘要翻译： 用于晶片加工组件的耐蚀刻加热器，具有至少20℃/分钟的优异的斜坡速率。 加热器涂覆有保护性外涂层，允许加热器在升高的加热器温度> 1500℃时具有高于70％的辐射效率，并且在600℃下具有NF 3 N的蚀刻速率。 小于100A / min。

公开(公告)号：US10347559B2

公开(公告)日：2019-07-09

申请号：US13049498

申请日：2011-03-16

申请人： Wei Fan ,  Xiang Liu ,  John Mariner

发明人： Wei Fan ,  Xiang Liu ,  John Mariner

IPC分类号： B32B9/00 ,  H01L23/373 ,  H01L23/36

摘要： A high thermal conductivity/low coefficient of thermal expansion thermally conductive composite material for heat sinks and an electronic apparatus comprising a heat sink formed from such composites. The thermally conductive composite comprises a high thermal conductivity layer disposed between two substrates having a low coefficient of thermal expansion. The substrates have a low coefficient of thermal expansion and a relatively high modulus of elasticity, and the composite exhibits high thermal conductivity and low coefficient of thermal expansion even for composites with high loadings of the thermally conductive material.

公开(公告)号：US20100326645A1

公开(公告)日：2010-12-30

申请号：US12877412

申请日：2010-09-08

申请人： Wei Fan ,  Xiang Liu ,  John Mariner

发明人： Wei Fan ,  Xiang Liu ,  John Mariner

IPC分类号： F28F7/00

CPC分类号： B82Y30/00 ,  F28F3/02 ,  F28F21/02 ,  F28F2013/006 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3677 ,  H01L23/373 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thermally conductive laminate comprising a first substrate, a second substrate, and a performance layer disposed between the first substrate and the second substrate. The performance layer comprising thermal pyrolytic graphite (TPG) and vias. The TPG board surface and the vias may be at least partially filled with a material comprising at least one of thermally conductive epoxy, soldering metal/alloy or brazing metal/alloy. In addition, the thermally conductive laminate may not contain a framing structure surrounding the performance layer.

摘要翻译： 一种导热层压板，包括第一基板，第二基板和设置在第一基板和第二基板之间的性能层。 性能层包括热解石墨（TPG）和通孔。 TPG板表面和通孔可以至少部分地填充有包括导热环氧树脂，焊接金属/合金或钎焊金属/合金中的至少一种的材料。 此外，导热层压体可以不包含围绕性能层的框架结构。

公开(公告)号：US20120234524A1

公开(公告)日：2012-09-20

申请号：US13049498

申请日：2011-03-16

申请人： Wei Fan ,  Xiang Liu ,  John Mariner

发明人： Wei Fan ,  Xiang Liu ,  John Mariner

IPC分类号： F28F7/00 ,  B32B15/04

CPC分类号： H01L23/373 ,  B32B9/007 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2307/30 ,  B32B2307/302 ,  B32B2307/304 ,  B32B2307/546 ,  B32B2457/00 ,  H01L23/36 ,  H01L2924/0002 ,  Y10T428/31678 ,  H01L2924/00

摘要： A high thermal conductivity/low coefficient of thermal expansion thermally conductive composite material for heat sinks and an electronic apparatus comprising a heat sink formed from such composites. The thermally conductive composite comprises a high thermal conductivity layer disposed between two substrates having a low coefficient of thermal expansion. The substrates have a low coefficient of thermal expansion and a relatively high modulus of elasticity, and the composite exhibits high thermal conductivity and low coefficient of thermal expansion even for composites with high loadings of the thermally conductive material.

摘要翻译： 用于散热器的高热导率/低热膨胀导热复合材料系数和包括由这种复合材料形成的散热器的电子设备。 导热复合材料包括设置在具有低热膨胀系数的两个基板之间的高导热性层。 基板具有低的热膨胀系数和相对较高的弹性模量，并且即使对于具有高负载的导热材料的复合材料，该复合材料也显示出高导热性和低的热膨胀系数。

公开(公告)号：US20140346378A1

公开(公告)日：2014-11-27

申请号：US13977480

申请日：2011-12-21

申请人： Chin Hock Kua ,  Zhenfeng Wang ,  Wei Fan ,  Cong Zhi Leon Chan ,  Zhiping Wang

发明人： Chin Hock Kua ,  Zhenfeng Wang ,  Wei Fan ,  Cong Zhi Leon Chan ,  Zhiping Wang

IPC分类号： F16K99/00

CPC分类号： F16K99/0015 ,  F16K99/0061 ,  F16K2099/0084

摘要： An improved microfluidic system with an improved microfluidic valve module is disclosed. The microfluidic system includes a microfluidic chip and one or more valve modules. The microfluidic chip has microfluidic channels and one or more cavities formed in the chip, each of the one or more cavities designed to receive one of the one or more valve modules. Each of the one or more valve modules includes a first layer, a control layer and one or more second layers. The first layer includes a deformable material. The control layer has a microfluidic control chamber formed in a portion of it. The control layer is also located adjoining the first layer and the deformable material of the first layer forms a deformable surface of the control chamber. The one or more second layers include an input microfluidic channel and an output microfluidic channel. The input microfluidic channel and the output microfluidic channel are fluidically coupled to the microfluidic control chamber, and fluid flow through the input microfluidic channel, the microfluidic control chamber and the output microfluidic channel is controlled in response to a force deforming the deformable material of the first layer at least a predetermined amount.

摘要翻译： 公开了具有改进的微流体阀模块的改进的微流体系统。 微流体系统包括微流体芯片和一个或多个阀模块。 微流体芯片具有微流体通道和在芯片中形成的一个或多个空腔，所述一个或多个空腔中的每一个被设计成容纳一个或多个阀模块中的一个。 一个或多个阀模块中的每一个包括第一层，控制层和一个或多个第二层。 第一层包括可变形材料。 控制层具有形成在其一部分中的微流控制室。 控制层也邻接第一层并且第一层的可变形材料形成控制室的可变形表面。 一个或多个第二层包括输入微流体通道和输出微流体通道。 输入微流体通道和输出微流体通道流体耦合到微流控制室，并且通过输入微流体通道，微流控制室和输出微流体通道的流体流动被响应于使第一 层至少预定量。