公开(公告)号：US20170186712A1

公开(公告)日：2017-06-29

申请号：US15393170

申请日：2016-12-28

Applicant: XINTEC INC.

Inventor： Chia-Lun SHEN ,  Po-Shen LIN ,  Ang CHAN

IPC: H01L23/00 ,  H01L21/768 ,  H01L21/78 ,  H01L23/31

Abstract: A chip package including a substrate is provided. The substrate includes a front surface, a back surface, and a side surface. A redistribution layer is disposed on the back surface and is electrically connected to a sensing or device region in the substrate. A protection layer covers the redistribution layer and extends onto the side surface. A cover plate is disposed on the front surface and laterally protrudes from the protection layer on the side surface. The cover plate includes a first surface facing the front surface and a second surface facing away from the front surface. A bottom portion of the cover plate broadens from the first surface towards the second surface. A method of forming the chip package is also provided.