公开(公告)号：US06465806B2

公开(公告)日：2002-10-15

申请号：US09095587

申请日：1998-06-11

申请人： Yasushi Kubota ,  Ichiro Shiraki ,  Tamotsu Sakai ,  Zhang Hongyong ,  Jun Koyama

发明人： Yasushi Kubota ,  Ichiro Shiraki ,  Tamotsu Sakai ,  Zhang Hongyong ,  Jun Koyama

IPC分类号： H01L2904

CPC分类号： H01L23/5226 ,  G02F1/1345 ,  G02F1/13454 ,  G09G3/3688 ,  H01L21/76838 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes a first conductive layer; an interlayer insulative layer having an opening; and a second conductive layer. The first conductive layer, the interlayer insulative layer and the second conductive layer are sequentially laminated. The opening is partially covered by the second conductive layer, and an area of the first conductive layer is substantially entirely covered by the second conductive layer in the opening.

摘要翻译： 半导体器件包括第一导电层; 具有开口的层间绝缘层; 和第二导电层。 第一导电层，层间绝缘层和第二导电层依次层叠。 开口部分被第二导电层覆盖，并且第一导电层的面积基本上完全被开口中的第二导电层覆盖。