公开(公告)号：US20210403771A1

公开(公告)日：2021-12-30

申请号：US17471642

申请日：2021-09-10

Applicant: tesa SE

Inventor： Klaus KEITE-TELGENBUSCHER ,  Christian SCHUH ,  Bernd LUHMANN ,  Thilo DOLLASE ,  Minyoung BAI ,  Thorsten KRAWINKEL

IPC: C09J125/08 ,  C09J153/00 ,  C09J153/02 ,  C09J7/38 ,  C08L63/00

Abstract: A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23° C. and greater than 23° C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.