公开(公告)号：US10056672B2

公开(公告)日：2018-08-21

申请号：US15222230

申请日：2016-07-28

申请人： International Business Machines Corporation

发明人： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC分类号： H01P5/107 ,  H01P5/02 ,  H01P3/12 ,  H01P3/08 ,  H01P5/08 ,  H01L23/498 ,  H01L23/66 ,  H01L25/065 ,  H01P3/16 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H01L23/538 ,  H01L23/00 ,  H05K1/02

CPC分类号： H01P5/107 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01P3/08 ,  H01P3/121 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P5/087 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/10522

摘要： Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

公开(公告)号：US20180122755A1

公开(公告)日：2018-05-03

申请号：US15797944

申请日：2017-10-30

申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人： Mikoto NAKAMURA ,  Takeshi KAWASAKI

IPC分类号： H01L23/66 ,  H01L23/528 ,  H03F3/195 ,  H01L23/00 ,  H01P3/08

CPC分类号： H01L23/66 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/14 ,  H01L24/16 ,  H01L2223/6627 ,  H01L2223/6644 ,  H01L2224/14131 ,  H01L2224/16013 ,  H01L2224/16227 ,  H01L2924/1421 ,  H01L2924/19032 ,  H01P3/081 ,  H01P5/028 ,  H03F3/195 ,  H03F2200/451

摘要： A radio-frequency (RF) apparatus that reduces signal reflections at input and output terminals is disclosed. The RF apparatus includes an assembly base and a semiconductor chip mounted on the assembly base in upside down. The semiconductor chip includes first to third metal layers and a top metal layer that provides a top ground layer and a pad. The pad is connected to the input or output terminals on the assembly base and extracts a signal line and a stub line in the third metal layer, where lines are transferred to the first metal layer. The semiconductor chip further includes an inner ground layer formed in the second metal line. The inner ground layer and the signal line just pulled out from the pad and formed in the third metal layer form a micro-strip line.

公开(公告)号：US09648725B2

公开(公告)日：2017-05-09

申请号：US14720229

申请日：2015-05-22

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Takuya Suzuki

IPC分类号： H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H01L23/552 ,  H01L23/58 ,  H01L23/66 ,  H01L25/18 ,  H01P5/107 ,  H01L25/065 ,  H01P3/08 ,  H01Q9/04 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34

CPC分类号： H05K1/0218 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2924/15321 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/3011 ,  H01P3/081 ,  H01P5/107 ,  H01Q9/04 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/09618 ,  H05K2201/10151 ,  H05K2201/10734

摘要： Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate (20) is disposed, on an underside surface layer of which are disposed high-frequency circuits (21 and 22) and is formed a first grounding conductor that has same electric potential as grounding conductors of the high-frequency circuits and that surrounds the high-frequency circuits. A mother control substrate (3) is disposed, on which the high-frequency circuit mounting substrate (20) is mounted in such a way that the high-frequency circuits are sandwiched therebetween and on which a second grounding conductor is formed in a region facing the high-frequency circuits. Plural first lands are formed on the first grounding conductor of the high-frequency circuit mounting substrate (20) to surround the high-frequency circuits. Plural second lands are formed that are electrically connected to the second grounding conductor at positions on a surface layer of the mother control substrate (3) which face the first lands. Plural solder balls (30G2) are disposed for connecting the first lands and the second lands. The high-frequency circuits are housed in pseudo shielding cavities surrounded by the solder balls (30G2), the grounding conductors of the high-frequency circuits, and the first and second grounding conductors.

公开(公告)号：US09531052B2

公开(公告)日：2016-12-27

申请号：US14750033

申请日：2015-06-25

申请人： International Business Machines Corporation

发明人： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC分类号： H01P5/107 ,  H01P5/08 ,  H01P3/16 ,  H01P3/08

CPC分类号： H01P5/107 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01P3/08 ,  H01P3/121 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P5/087 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/10522

摘要： Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

摘要翻译： 实施例包括具有集成波导的封装结构，以实现封装组件之间的高数据速率通信。 例如，封装结构包括具有集成波导的封装衬底和安装到封装衬底的第一和第二集成电路芯片。 第一集成电路芯片使用第一传输线到波导过渡耦合到集成波导，并且第二集成电路芯片使用第二传输线耦合到集成波导到波导转换。 第一和第二集成电路芯片被配置为通过在封装载体内使用集成波导发送信号进行通信。

公开(公告)号：US20160276729A1

公开(公告)日：2016-09-22

申请号：US14750033

申请日：2015-06-25

申请人： International Business Machines Corporation

发明人： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC分类号： H01P5/107 ,  H01P3/08 ,  H01P5/08 ,  H01P3/16

CPC分类号： H01P5/107 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01P3/08 ,  H01P3/121 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P5/087 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/10522

摘要： Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

公开(公告)号：US20150257254A1

公开(公告)日：2015-09-10

申请号：US14720229

申请日：2015-05-22

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Takuya SUZUKI

IPC分类号： H05K1/02 ,  H01Q9/04 ,  H01L25/065 ,  H01P3/08

CPC分类号： H05K1/0218 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2924/15321 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/3011 ,  H01P3/081 ,  H01P5/107 ,  H01Q9/04 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/09618 ,  H05K2201/10151 ,  H05K2201/10734

摘要： Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate (20) is disposed, on an underside surface layer of which are disposed high-frequency circuits (21 and 22) and is formed a first grounding conductor that has same electric potential as grounding conductors of the high-frequency circuits and that surrounds the high-frequency circuits. A mother control substrate (3) is disposed, on which the high-frequency circuit mounting substrate (20) is mounted in such a way that the high-frequency circuits are sandwiched therebetween and on which a second grounding conductor is formed in a region facing the high-frequency circuits. Plural first lands are formed on the first grounding conductor of the high-frequency circuit mounting substrate (20) to surround the high-frequency circuits. Plural second lands are formed that are electrically connected to the second grounding conductor at positions on a surface layer of the mother control substrate (3) which face the first lands. Plural solder balls (30G2) are disposed for connecting the first lands and the second lands. The high-frequency circuits are housed in pseudo shielding cavities surrounded by the solder balls (30G2), the grounding conductors of the high-frequency circuits, and the first and second grounding conductors.

摘要翻译： 使用不使用任何盖子的简单且便宜的配置来实现高频电路的屏蔽。 高频电路安装基板（20）设置在其下表面层上，设置有高频电路（21和22），并形成与第一接地导体相同的电位的第一接地导体， 频率电路，并且围绕高频电路。 设置母控制基板（3），其上安装有高频电路安装基板（20），使得高频电路夹在其间并在其上形成有第二接地导体的区域 高频电路。 多个第一焊盘形成在高频电路安装基板（20）的第一接地导体上，以围绕高频电路。 形成在母板控制基板（3）的面对第一焊盘的位置处与第二接地导体电连接的多个第二焊盘。 多个焊球（30G2）被设置用于连接第一焊盘和第二焊盘。 高频电路容纳在由焊球（30G2），高频电路的接地导体以及第一和第二接地导体包围的伪屏蔽腔中。

公开(公告)号：US08581113B2

公开(公告)日：2013-11-12

申请号：US11960681

申请日：2007-12-19

申请人： Eric A. Sanjuan ,  Sean S. Cahill

发明人： Eric A. Sanjuan ,  Sean S. Cahill

IPC分类号： H05K1/11

CPC分类号： H01L23/66 ,  H01L23/047 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/6627 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H05K1/0243 ,  Y10T29/49002 ,  Y10T29/49018 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49144 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2224/45099 ,  H01L2924/20752

摘要： A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.

摘要翻译： 描述了一种低成本高频电子器件封装和相关的制造方法，其中波导结构从高频器件形成为封装引线转变。 封装引线转换优化，以利用波导互连结构。

公开(公告)号：US08558638B2

公开(公告)日：2013-10-15

申请号：US13027479

申请日：2011-02-15

申请人： Satoshi Masuda

发明人： Satoshi Masuda

IPC分类号： H03H7/38

CPC分类号： H01L23/66 ,  H01L23/047 ,  H01L23/64 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/6627 ,  H01L2223/6655 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48157 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/16195 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01P5/16 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/20752

摘要： An impedance transformer includes a first transmission line having a first impedance and provided over a first substrate having a first permittivity; a second transmission line and a third transmission line having an impedance lower than the first impedance and provided over a second substrate having a permittivity higher than the first permittivity, the second transmission line and the third transmission line being electrically coupled to the first transmission line; and a resistor coupled between the second transmission line and the third transmission line.

摘要翻译： 阻抗变换器包括具有第一阻抗的第一传输线，并设置在具有第一介电常数的第一衬底上; 第二传输线和第三传输线，其阻抗低于第一阻抗，并且设置在具有高于第一介电常数的介电常数的第二基板上，第二传输线和第三传输线电耦合到第一传输线; 以及耦合在所述第二传输线和所述第三传输线之间的电阻器。

公开(公告)号：US08436450B2

公开(公告)日：2013-05-07

申请号：US12024789

申请日：2008-02-01

申请人： Gaurav Menon

发明人： Gaurav Menon

IPC分类号： H01L23/49

CPC分类号： H03H7/38 ,  H01L23/3121 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6638 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19032 ,  H01L2924/19051 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00014 ,  H01L2924/00

摘要： In wireless communication devices, internally matching impedance in millimeter wave packaging enables better signal retention at high frequencies in the range of 15 GHz and above. Through the use of differential wire bond signal transmission, the inherent inductance of a millimeter wave package can be matched by the capacitance of the package wire bonds if the capacitance is tailored. The capacitance can be tailored by calculating a suitable distance between wire bonds and tuning the dielectric constant of the over-mold material. A differential set of wire bonds act like a differential transmission line whose characteristic impedance can be tuned by configuring the dielectric constant of the over-mold of the millimeter wave package.

摘要翻译： 在无线通信设备中，毫米波封装中的内部匹配阻抗可在15 GHz及以上的高频范围内实现更好的信号保持。 通过使用差分接线信号传输，如果电容被定制，则毫米波封装的固有电感可以通过封装引线接合的电容来匹配。 可以通过计算引线键合之间的合适距离并调整外模材料的介电常数来调整电容。 差分组合引线的作用就像差分传输线，其特性阻抗可以通过配置毫米波封装的外模的介电常数进行调节。

公开(公告)号：US08363421B2

公开(公告)日：2013-01-29

申请号：US12382599

申请日：2009-03-19

申请人： Tatsuaki Tsukuda ,  Masayoshi Hirata

发明人： Tatsuaki Tsukuda ,  Masayoshi Hirata

IPC分类号： H05K7/02 ,  H05K1/02

CPC分类号： H01L24/16 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19032 ,  H01L2924/19051 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0224 ,  H05K1/025 ,  H05K1/0253 ,  H05K3/341 ,  H05K2201/093 ,  H05K2201/1028 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor device has a wiring board having a wiring, a semiconductor chip that is mounted on the wiring board, and an electric conductor reference plane provided in the inside of the wiring board, in which in top view. The wiring includes a first region that overlaps the electric conductor reference plane and a second region that is the whole region except for the first region. A conductor chip is mounted above the second region.