Suction device
    91.
    发明授权

    公开(公告)号:US11548121B2

    公开(公告)日:2023-01-10

    申请号:US16498206

    申请日:2018-03-29

    IPC分类号: B25B11/00 B65G47/91

    摘要: The invention relates to a suction device (12) comprising a valve housing (18), a flexible partition wall (28) which runs in such a way that a control space (30) extends on one side and an intake side (21) lies on the other side, wherein the control space (30) is connected to the intake side (21) via a throttle passage (38), wherein the throttle passage (38) is formed in such a way that a flow resistance for flows is defined by the throttle passage (38) in such a way that, in the case of free suction, a negative pressure in relation to the intake side occurs in the control space (30) on account of the flow resistance. A sealing protrusion (44) protruding into the interior of the control space (30) and an associated seal seat (50) within the control space (30) are provided, wherein the sealing protrusion (44) and seal seat (50) are formed in such a way that, when the sealing protrusion (44) is placed against the seal seat (50), the flow path (40) through the throttle passage (38) into the control space (30) is interrupted within the control space (30).

    Devices and methods for monitoring, in particular for regulating, a cutting process

    公开(公告)号:US11440141B2

    公开(公告)日:2022-09-13

    申请号:US16545273

    申请日:2019-08-20

    IPC分类号: B23K26/38

    摘要: The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of the high-energy beam with the workpiece. An control apparatus determines at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the captured interaction region.

    METHOD FOR OFFSET MEASURE COMPENSATION

    公开(公告)号:US20220187782A1

    公开(公告)日:2022-06-16

    申请号:US17600707

    申请日:2020-03-31

    摘要: A method for recognition and compensation of an offset measure between stamping coordinates of a stamping device and laser coordinates of a laser device in a combined stamping-laser machine for processing a plate-shaped workpiece, particularly a metal sheet, includes introducing a structure into the plate-shaped workpiece by respectively using the stamping device or the laser device. A measurement variable of the introduced structure is determined respectively by the laser device or the stamping device. The measurement variable is compared with an expected variable, and a deviation of the measurement variable from the expected variable corresponds to an offset measure. The offset measure is balanced with the coordinates of the laser device in the laser coordinate system or with the coordinates of the stamping device in the stamping coordinate system in order to compensate for the offset measure between the stamping coordinates and the laser coordinates.

    Indoor location systems for industrial production

    公开(公告)号:US11356811B2

    公开(公告)日:2022-06-07

    申请号:US17078186

    申请日:2020-10-23

    IPC分类号: H04W4/029 H04W4/33 G05B19/418

    摘要: Methods, devices, and systems for production controls of process sequences in industrial processing of workpieces supported by indoor localization are provided. In one aspect, an indoor location system includes a plurality of mobile transceivers and an analyzer. At least one mobile transceiver is configured to determine a position of a selected mobile transceiver in a three-dimensional space. Each mobile transceiver is spatially assignable to a corresponding object from a group of objects within a framework of process sequences. Each object is movable in one or more dimensions in the three-dimensional space. The analyzer is configured to determine the position of the selected mobile transceiver based at least on run times of electromagnetic signals between the mobile transceivers in a position determination process and to perform tracking of a movement of a target object assigned to the selected mobile transceiver based on the position of the selected mobile transceiver.

    GRIPPING UNITS FOR HANDLING DEVICES OF PROCESSING MACHINES

    公开(公告)号:US20220135345A1

    公开(公告)日:2022-05-05

    申请号:US17512085

    申请日:2021-10-27

    IPC分类号: B65G47/91 B23Q3/18

    摘要: The disclosure relates to gripping units for handling devices of processing machines, e.g., for handling plate-shaped workpieces, including a plurality of vacuum cups that are provided on a main body and are arranged relative to one another to form at least one cup field, and at least one cup field can be subjected to negative pressure for handling the workpiece, wherein at least one holding unit is provided on the main body, the holding unit has at least one sealing element and surrounds at least one cup field, and has at least one actuation unit for applying a negative pressure for the at least one sealing element to act on the plate-shaped workpiece.