公开(公告)号：US08690493B2

公开(公告)日：2014-04-08

申请号：US12672921

申请日：2008-08-12

申请人： Takashi Miki ,  Yuji Takagi

发明人： Takashi Miki ,  Yuji Takagi

IPC分类号： B23C5/10

CPC分类号： B24B3/06 ,  B23C5/10

摘要： An end mill including multiple spiral flutes in a helical shape around an axis that are formed in a periphery of the top portion of an end mill body which rotates on the axis. Cutting edges are formed at peripheral side ridge portions of wall surfaces of the flutes facing a front side in an end mill rotating direction. Honing is applied along each peripheral cutting edge such that the cutting edge has a variable honing width in the direction of the axis.

摘要翻译： 一种端铣刀，其包括围绕轴线形成螺旋形的多个螺旋槽纹，所述螺旋槽形成在端轴铣刀主体的顶部的周边上，所述端部在轴线上旋转。 在端铣刀旋转方向上面向前侧的凹槽的壁面的周边侧脊部形成切削刃。 沿着每个周边切削刃施加珩磨，使得切削刃在轴线方向上具有可变的珩磨宽度。

公开(公告)号：US20130191807A1

公开(公告)日：2013-07-25

申请号：US13877922

申请日：2011-09-30

申请人： Yuji Takagi ,  Yuichi Hamamura

发明人： Yuji Takagi ,  Yuichi Hamamura

IPC分类号： G06F17/50

CPC分类号： G06F17/5081 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： In order to enable an evaluation of systematic defects, a method of evaluating systematic defects was configured so as to sample a circuit pattern of a specific layer of a semiconductor device, evaluate the state of superimposition between the sampled circuit pattern and circuit patterns of layers other than the specific layer, using design data, classify the state of superimposition, calculate the ratio thereof as a reference ratio, evaluate the state of superimposition between a pattern in design data corresponding to a defect of the specific layer detected by another inspection apparatus and patterns at positions corresponding to the defects in layers other than the specific layer, classify the evaluated state of superimposition, calculate the ratio of the classification as inspection-result ratio, compare the calculated reference ratio and the calculated inspection-result ratio, and evaluate systematic defects by the comparison between the calculated reference ratio and the calculated inspection-result ratio.

摘要翻译： 为了能够对系统缺陷进行评估，构造了评价系统缺陷的方法，以对半导体器件的特定层的电路图案进行采样，评估采样电路图案与其他层的电路图案之间的叠加状态 比特定层使用设计数据，将叠加状态进行分类，将其比例作为参考比计算，评价与由另一检查装置检测到的特定层的缺陷相对应的设计数据中的图案之间的叠加状态 在与特定层以外的层的缺陷相对应的位置，对评价的叠加状态进行分类，计算分类比作为检查结果比，比较计算出的参考比和计算出的检查结果比，并评价系统缺陷 通过比较计算的参考比和计算 检验结果比例。

公开(公告)号：US08250415B2

公开(公告)日：2012-08-21

申请号：US13055843

申请日：2010-05-18

申请人： Masaru Yamaoka ,  Yuji Takagi ,  Makoto Usui

发明人： Masaru Yamaoka ,  Yuji Takagi ,  Makoto Usui

IPC分类号： G11C29/00

CPC分类号： G11B20/18 ,  G11B20/00376 ,  G11B20/00398 ,  G11B20/00405 ,  G11B20/10342 ,  G11B20/10453 ,  G11B20/10462 ,  G11B20/10472 ,  G11B20/14 ,  G11B20/1833 ,  G11B2220/2562

摘要： Provided is an optical disk reproduction apparatus capable of preventing information that is different from the original sub information from being subjected to error correction erroneously, and of stably reproducing the sub information. The optical disk reproduction apparatus (1) has an optical head (301) for reading a reproduction signal including main information and sub information based on a recording mark formed on an optical disk (300), a main information extraction unit (4) for extracting the main information from the reproduction signal, and a sub information extraction unit (2) for extracting the sub information from the reproduction signal. The sub information extraction unit (2) determines a reproduction accuracy of the sub information, and includes an error correction control unit (308) for deciding a timing of performing error correction of the sub information according to the determined reproduction accuracy, and an error correction unit (309) for performing the error correction of the sub information according to the timing decided with the error correction control unit (308).

摘要翻译： 提供了能够防止与原始子信息不同的信息被错误地进行错误纠正并且稳定地再现子信息的光盘再现装置。 光盘再现装置（1）具有用于读取包含基于形成在光盘（300）上的记录标记的主信息和子信息的再现信号的光头（301），用于提取的主信息提取单元 来自再现信号的主要信息，以及用于从再现信号中提取子信息的子信息提取单元（2）。 子信息提取单元（2）确定子信息的再现精度，并且包括用于根据确定的再现精度来确定执行子信息的纠错的定时的纠错控制单元（308） 单元（309），用于根据由纠错控制单元（308）确定的定时执行子信息的纠错。

公开(公告)号：US08217351B2

公开(公告)日：2012-07-10

申请号：US12858209

申请日：2010-08-17

申请人： Yasutaka Toyoda ,  Yasunari Souda ,  Yuji Takagi ,  Koji Arai

发明人： Yasutaka Toyoda ,  Yasunari Souda ,  Yuji Takagi ,  Koji Arai

IPC分类号： G06K9/46 ,  G01N23/00

CPC分类号： H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A pattern data examination method and system capable of accurately and speedily examining a circuit pattern without failing to extract pattern contour data are provided. While pattern comparison is ordinarily made by using a secondary electron image, a contour of a pattern element is extracted by using a backscattered electron image said to be suitable for observation and examination of a three dimensional configuration of a pattern element, and pattern inspection is executed by using the extracted contour of the pattern element. More specifically, pattern inspection is executed by comparing a contour of a pattern element with design data such as CAD data to measure a difference between the contour and the data, and by computing, for example, the size of the circuit pattern element from the contour of a pattern. From two or more backscattered electron images formed by detecting backscattered electrons at two or more different spatial positions, pattern contour data contained in the backscattered electron images may be obtained.

摘要翻译： 提供了能够准确且快速地检查电路图案而不会提取图案轮廓数据的图形数据检查方法和系统。 虽然通常使用二次电子图像进行图案比较，但是通过使用所述适合于观察和检查图案元素的三维构造的背散射电子图像来提取图案元素的轮廓，并且执行图案检查 通过使用所提取的图案元素的轮廓。 更具体地，通过将​​图案元素的轮廓与诸如CAD数据的设计数据进行比较来测量轮廓和数据之间的差异，并且例如通过计算来自轮廓的电路图案元素的尺寸来执行图案检查 的模式。 通过在两个或更多个不同的空间位置检测反向散射电子形成的两个或更多个背散射电子图像，可以获得包含在背散射电子图像中的图案轮廓数据。

公开(公告)号：US20120093392A1

公开(公告)日：2012-04-19

申请号：US13266800

申请日：2010-03-25

申请人： Yuji Takagi ,  Minoru Harada ,  Yuichi Hamamura

发明人： Yuji Takagi ,  Minoru Harada ,  Yuichi Hamamura

IPC分类号： G06K9/62

CPC分类号： G01N21/9501 ,  G01N21/956 ,  G01N2021/8867 ,  H01L22/12 ,  H01L22/20

摘要： The present invention relates to semiconductor inspection and provides a technology capable of efficiently detecting a systematic defect. In the present system, with regard to the process (S7, S8) of matching hot spot (HS) points that can be simulated in advance and defect points obtained as a result of a visual inspection each other and the unmatched defect points, a process (S6, S9) of classifying the defect points into groups based on similarity of pattern layout at the defect points to determine the defects belonging to a pattern layout where defects frequently occur, thereby reliably detecting the systematic defect. Also, with a process (S11) of acquiring an uneven distribution in a defect occurrence distribution on a wafer, the systematic defect occurring due to topography of the wafer can also be detected.

摘要翻译： 本发明涉及半导体检查，并且提供能够有效地检测系统缺陷的技术。 在本系统中，关于可以预先模拟的热点（HS）点和作为目视检查的结果获得的缺陷点与不匹配的缺陷点的处理（S7，S8），处理 （S6，S9），根据缺陷点的图案布局的相似度将缺陷点分类成组，以确定属于频繁发生缺陷的图案布局的缺陷，从而可靠地检测系统缺陷。 此外，通过获取晶片上的缺陷发生分布中的不均匀分布的处理（S11），也可以检测由于晶片的形貌而发生的系统缺陷。

公开(公告)号：US20120082018A1

公开(公告)日：2012-04-05

申请号：US13322666

申请日：2011-03-24

申请人： Toyoji Gushima ,  Makoto Usui ,  Yuji Takagi

发明人： Toyoji Gushima ,  Makoto Usui ,  Yuji Takagi

IPC分类号： G11B7/09

CPC分类号： G11B20/1217 ,  G11B7/0037 ,  G11B7/0045 ,  G11B7/006 ,  G11B7/00736 ,  G11B20/1024 ,  G11B2020/1277 ,  G11B2020/1288 ,  G11B2220/218 ,  G11B2220/2537

摘要： Provided are an optical disc recording device and a recording signal generating device which enable to correct displacement between a reproducing position of a reproduction signal from a concave-convex mark preformed in an optical disc, and a recording position of second information to be recorded in synchronism with the reproduction signal, and stably and speedily record the second information. A digital signal processor (202) specifies a reproducing position in the concave-convex mark, using a reproduction signal and a channel clock. A recording signal generator (211) generates a recording signal alternately including a plurality of additionally recordable data, each of which includes second information and has a predetermined length, and a plurality of dummy data. A recording position controller (110) detects a recording position displacement amount representing a displacement amount between the reproducing position and a recording position of the additionally recordable data, using the reproducing position and the reading signal. A recording length adjustor (208) increases or decreases the recording length of dummy data in accordance with the recording position displacement amount.

摘要翻译： 提供了一种光盘记录装置和记录信号产生装置，其能够校正来自在光盘中预先形成的凹凸标记的再现信号的再现位置与待同步记录的第二信息的记录位置之间的位移 具有再现信号，并稳定且快速地记录第二信息。 数字信号处理器（202）使用再现信号和通道时钟指定凹凸标记中的再现位置。 记录信号发生器（211）交替地产生包括多个附加可记录数据的记录信号，每个可附加记录数据包括第二信息并具有预定长度，以及多个伪数据。 记录位置控制器（110）使用再现位置和读取信号来检测表示可附加记录的数据的再现位置和记录位置之间的位移量的记录位置位移量。 记录长度调节器（208）根据记录位置位移量增加或减少虚拟数据的记录长度。

公开(公告)号：US08107717B2

公开(公告)日：2012-01-31

申请号：US13072102

申请日：2011-03-25

申请人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

发明人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

摘要： Arrangements for inspecting a specimen on which plural patterns are formed; capturing a first image of a first area; capturing a second image of a second area in which patterns which are essentially the same with the patterns formed in the first area; creating data relating to corresponding pixels of the first and second images, for each pixel; determining a threshold for each pixel for detecting defects directly in accordance with the first and second images; and detecting defects on the specimen by processing the first and second images by using the threshold for each pixel and information of a scattered diagram of brightness of the first and second images, wherein the threshold is determined by using information of brightness of a local region of at least one of the first and second images, with the local region including an aimed pixel and peripheral pixels of the aimed pixel.

摘要翻译： 用于检查形成多个图案的样本的布置; 捕获第一区域的第一图像; 捕获与形成在第一区域中的图案基本上相同的图案的第二区域的第二图像; 为每个像素创建与第一和第二图像的相应像素有关的数据; 根据第一和第二图像确定用于检测缺陷的每个像素的阈值; 以及通过使用每个像素的阈值和第一和第二图像的亮度的散射图的信息来处理第一和第二图像来检测样本上的缺陷，其中，通过使用第一和第二图像的局部区域的亮度的信息来确定阈值 第一和第二图像中的至少一个，其中局部区域包括目标像素和目标像素的外围像素。

公开(公告)号：US20110299371A1

公开(公告)日：2011-12-08

申请号：US13202434

申请日：2010-12-17

申请人： Tsuyoshi Nakasendo ,  Masaru Yamaoka ,  Yuji Takagi ,  Makoto Usui

发明人： Tsuyoshi Nakasendo ,  Masaru Yamaoka ,  Yuji Takagi ,  Makoto Usui

IPC分类号： G11B20/16 ,  G11B7/09 ,  G11B19/28

CPC分类号： G11B20/10009 ,  G11B7/0045 ,  G11B7/00736 ,  G11B19/26 ,  G11B20/00086 ,  G11B20/00115 ,  G11B20/00594 ,  G11B20/10027 ,  G11B20/1024 ,  G11B2220/2541 ,  G11B2220/2562

摘要： To provide an optical disk device, an optical disk control method and an integrated circuit, which are capable of writing a recordable mark by changing the reflectance ratio of a reflective film formed on concave-convex pits without using an industrial special device or a high-power laser light source. A data reproduction controller (103) sets a first rotation speed in a disk rotation speed switching unit (108) and a first laser power in a laser power switching unit (107) when reproducing the concave-convex pits. When writing the recordable mark, a mark recording controller (104) sets in the disk rotation speed switching unit (108) a second rotation speed that is slower than the first rotation speed and the lowest rotation speed at which the concave-convex pits can be reproduced, and sets a second laser power greater than the first laser power in the laser power switching unit (107) in accordance with the emission timing.

摘要翻译： 为了提供一种光盘装置，光盘控制方法和集成电路，其能够通过改变形成在凹凸坑上的反射膜的反射率而写入可记录标记，而不使用工业专用装置或高速数据， 功率激光光源。 数据再现控制器（103）在再现凹凸坑时，在盘旋转速度切换单元（108）中设置第一旋转速度和激光功率切换单元（107）中的第一激光功率。 当写入可记录标记时，标记记录控制器（104）在盘转速切换单元（108）中设置比第一转速慢的凹部凹坑的最低转速和第二转速 根据发射定时，在激光功率切换单元（107）中再现并设定大于第一激光功率的第二激光功率。

公开(公告)号：US20110170765A1

公开(公告)日：2011-07-14

申请号：US13072102

申请日：2011-03-25

申请人： Shunji MAEDA ,  Kenji OKA ,  Yukihiro SHIBATA ,  Minoru YOSHIDA ,  Chie SHISHIDO ,  Yuji TAKAGI ,  Atsushi YOSHIDA ,  Kazuo YAMAGUCHI

发明人： Shunji MAEDA ,  Kenji OKA ,  Yukihiro SHIBATA ,  Minoru YOSHIDA ,  Chie SHISHIDO ,  Yuji TAKAGI ,  Atsushi YOSHIDA ,  Kazuo YAMAGUCHI

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

摘要： Arrangements for inspecting a specimen on which plural patterns are formed; capturing a first image of a first area; capturing a second image of a second area in which patterns which are essentially the same with the patterns formed in the first area; creating data relating to corresponding pixels of the first and second images, for each pixel; determining a threshold for each pixel for detecting defects directly in accordance with the first and second images; and detecting defects on the specimen by processing the first and second images by using the threshold for each pixel and information of a scattered diagram of brightness of the first and second images, wherein the threshold is determined by using information of brightness of a local region of at least one of the first and second images, with the local region including an aimed pixel and peripheral pixels of the aimed pixel.

摘要翻译： 用于检查形成多个图案的样本的布置; 捕获第一区域的第一图像; 捕获与形成在第一区域中的图案基本上相同的图案的第二区域的第二图像; 为每个像素创建与第一和第二图像的相应像素有关的数据; 根据第一和第二图像确定用于检测缺陷的每个像素的阈值; 以及通过使用每个像素的阈值和第一和第二图像的亮度的散射图的信息来处理第一和第二图像来检测样本上的缺陷，其中，通过使用第一和第二图像的局部区域的亮度的信息来确定阈值 第一和第二图像中的至少一个，其中局部区域包括目标像素和目标像素的外围像素。

公开(公告)号：US20110013825A1

公开(公告)日：2011-01-20

申请号：US12888286

申请日：2010-09-22

申请人： Hisae SHIBUYA ,  Yuji TAKAGI

发明人： Hisae SHIBUYA ,  Yuji TAKAGI

IPC分类号： G06K9/00

CPC分类号： G06T7/0004 ,  G06T2207/30148

摘要： In a process for manufacturing a semiconductor wafer, defect distribution state analysis is performed so as to facilitate identification of the defect cause including a device cause and a process cause by classifying the defect distribution state according to the defect position coordinates detected by the inspection device, into one of the distribution characteristic categories: repeated defects, clustered defects, arc-shaped regional defects, radial regional defects, line type regional defects, ring and blob type regional defects, and random defects.

摘要翻译： 在制造半导体晶片的过程中，进行缺陷分布状态分析，以便根据由检查装置检测到的缺陷位置坐标来分类缺陷分布状态，便于识别包括装置原因和处理原因的缺陷原因， 成为分布特征类别之一：反复缺陷，聚类缺陷，弧形区域缺陷，径向区域缺陷，线型区域缺陷，环型和Blob型区域缺陷以及随机缺陷。