公开(公告)号：US20120193729A1

公开(公告)日：2012-08-02

申请号：US13017809

申请日：2011-01-31

申请人： TAKASHI ANDO ,  Christian Lavoie ,  Vijay Narayanan

发明人： TAKASHI ANDO ,  Christian Lavoie ,  Vijay Narayanan

IPC分类号： H01L29/772 ,  H01L21/336

CPC分类号： H01L29/66545 ,  H01L21/26506 ,  H01L21/26513 ,  H01L21/28518 ,  H01L21/324 ,  H01L29/165 ,  H01L29/456 ,  H01L29/66606 ,  H01L29/66628 ,  H01L29/7848

摘要： Devices and methods for device fabrication include forming a gate structure with a sacrificial material. Silicided regions are formed on source/drain regions adjacent to the gate structure or formed at the bottom of trench contacts within source/drain areas. The source/drain regions or the silicided regions are processed to build resistance to subsequent thermal processing and adjust Schottky barrier height and thus reduce contact resistance. Metal contacts are formed in contact with the silicided regions. The sacrificial material is removed and replaced with a replacement conductor.

摘要翻译： 用于器件制造的器件和方法包括用牺牲材料形成栅极结构。 硅化区域形成在与栅极结构相邻的源极/漏极区域上，或者形成在源极/漏极区域内的沟槽触点的底部。 对源极/漏极区域或硅化物区域进行处理，以建立对后续热处理的阻力，并调整肖特基势垒高度，从而降低接触电阻。 金属触点形成为与硅化物区域接触。 去除牺牲材料并用替换导体代替。

公开(公告)号：US08168503B2

公开(公告)日：2012-05-01

申请号：US12726736

申请日：2010-03-18

申请人： Marwan H. Khater ,  Christian Lavoie ,  Bin Yang ,  Zhen Zhang

发明人： Marwan H. Khater ,  Christian Lavoie ,  Bin Yang ,  Zhen Zhang

IPC分类号： H01L21/336

CPC分类号： H01L29/7839 ,  H01L29/78654

摘要： A method of fabricating a Schottky field effect transistor is provided that includes providing a substrate having at least a first semiconductor layer overlying a dielectric layer, wherein the first semiconductor layer has a thickness of less than 10.0 nm. A gate structure is formed directly on the first semiconductor layer. A raised semiconductor material is selectively formed on the first semiconductor layer adjacent to the gate structure. The raised semiconductor material is converted into Schottky source and drain regions composed of a metal semiconductor alloy. A non-reacted semiconductor material is present between the Schottky source and drain regions and the dielectric layer.

摘要翻译： 提供一种制造肖特基场效应晶体管的方法，其包括提供具有覆盖在电介质层上的至少第一半导体层的衬底，其中第一半导体层具有小于10.0nm的厚度。 栅极结构直接形成在第一半导体层上。 凸起的半导体材料选择性地形成在与栅极结构相邻的第一半导体层上。 凸起的半导体材料被转换成由金属半导体合金构成的肖特基源极和漏极区域。 在肖特基源极和漏极区域与电介质层之间存在未反应的半导体材料。

公开(公告)号：US08003524B2

公开(公告)日：2011-08-23

申请号：US12177309

申请日：2008-07-22

申请人： Chih-Chao Yang ,  Simon Gaudet ,  Christian Lavoie ,  Shom Ponoth ,  Terry A. Spooner

发明人： Chih-Chao Yang ,  Simon Gaudet ,  Christian Lavoie ,  Shom Ponoth ,  Terry A. Spooner

IPC分类号： H01L21/4763

CPC分类号： H01L21/76843 ,  H01L21/76844 ,  H01L21/76846 ,  H01L21/76856 ,  H01L21/76873 ,  H01L23/53238 ,  H01L2221/1089 ,  H01L2924/0002 ,  H01L2924/00

摘要： An interconnect structure which includes a plating seed layer that has enhanced conductive material, preferably, Cu, diffusion properties is provided that eliminates the need for utilizing separate diffusion and seed layers. Specifically, the present invention provides an oxygen/nitrogen transition region within a plating seed layer for interconnect metal diffusion enhancement. The plating seed layer may include Ru, Ir or alloys thereof, and the interconnect conductive material may include Cu, Al, AlCu, W, Ag, Au and the like. Preferably, the interconnect conductive material is Cu or AlCu. In more specific terms, the present invention provides a single seeding layer which includes an oxygen/nitrogen transition region sandwiched between top and bottom seed regions. The presence of the oxygen/nitrogen transition region within the plating seed layer dramatically enhances the diffusion barrier resistance of the plating seed.

摘要翻译： 提供一种互连结构，其包括具有增强的导电材料，优选Cu扩散性质的电镀种子层，其不需要使用单独的扩散和种子层。 具体地说，本发明提供了用于互连金属扩散增强的电镀种子层内的氧/氮过渡区域。 电镀种子层可以包括Ru，Ir或其合金，并且互连导电材料可以包括Cu，Al，AlCu，W，Ag，Au等。 优选地，互连导电材料是Cu或AlCu。 在更具体的术语中，本发明提供了单个接种层，其包括夹在顶部和底部种子区域之间的氧/氮过渡区域。 电镀种子层内的氧/氮过渡区的存在显着提高了电镀种子的扩散阻挡性。

公开(公告)号：US20110147809A1

公开(公告)日：2011-06-23

申请号：US12644092

申请日：2009-12-22

申请人： Bin Yang ,  Devendra Sadana ,  Christian Lavoie ,  Ahmet Ozcan

发明人： Bin Yang ,  Devendra Sadana ,  Christian Lavoie ,  Ahmet Ozcan

IPC分类号： H01L29/78 ,  H01L21/20 ,  H01L21/336

CPC分类号： H01L21/26506 ,  H01L21/28518 ,  H01L29/665 ,  H01L29/6659 ,  H01L29/66636 ,  H01L29/7833 ,  H01L29/7834 ,  H01L29/7848

摘要： A method includes forming a silicon germanium layer, forming a layer comprising carbon and silicon on a top surface of the silicon germanium layer, forming a metal layer above the layer comprising carbon and silicon, and performing a thermal treatment to convert at least the layer comprising carbon and silicon to form a metal silicide layer.

摘要翻译： 一种方法包括形成硅锗层，在硅锗层的顶表面上形成包含碳和硅的层，在包含碳和硅的层之上形成金属层，并进行热处理以至少将含有 碳和硅以形成金属硅化物层。

公开(公告)号：US07932169B2

公开(公告)日：2011-04-26

申请号：US12587301

申请日：2009-10-05

申请人： Luc Belanger ,  Stephen L. Buchwalter ,  Leena Paivikki Buchwalter ,  Ajay P. Giri ,  Jonathan H. Griffith ,  Donald W. Henderson ,  Sung Kwon Kang ,  Eric H. Laine ,  Christian Lavoie ,  Paul A. Lauro ,  Valérie Anne Oberson ,  Da-Yuan Shih ,  Kamalesh K Srivastava ,  Michael J. Sullivan

发明人： Luc Belanger ,  Stephen L. Buchwalter ,  Leena Paivikki Buchwalter ,  Ajay P. Giri ,  Jonathan H. Griffith ,  Donald W. Henderson ,  Sung Kwon Kang ,  Eric H. Laine ,  Christian Lavoie ,  Paul A. Lauro ,  Valérie Anne Oberson ,  Da-Yuan Shih ,  Kamalesh K Srivastava ,  Michael J. Sullivan

IPC分类号： H01L21/44

CPC分类号： H01L24/12 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/114 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2224/13099

摘要： An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.

摘要翻译： 一种适于将微电子器件芯片倒装连接到封装的互连结构，包括二层，三层或四层限流冶金，包括粘附/反应阻挡层，并且具有与含锡的组分反应的焊料可湿性层 无铅焊料，使得可焊接层在焊接期间可以完全消耗，但在焊接期间与无铅焊料接触后，阻挡层保持不变。 一个或多个无铅焊料球选择性地位于焊料润湿层上，该无铅焊球包含锡作为主要成分和一种或多种合金成分。

公开(公告)号：US07923838B2

公开(公告)日：2011-04-12

申请号：US12122984

申请日：2008-05-19

申请人： Christian Lavoie ,  Conal E. Murray ,  Kenneth P. Rodbell

发明人： Christian Lavoie ,  Conal E. Murray ,  Kenneth P. Rodbell

IPC分类号： H01L21/4763

CPC分类号： H01L23/485 ,  H01L21/28518 ,  H01L21/76877 ,  H01L21/76883 ,  H01L23/53209 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： A semiconductor structure in which the contact resistance in the contact opening is reduced as well as a method of forming the same are provided. This is achieved in the present invention by replacing conventional contact metallurgy, such as tungsten, or a metal silicide, such as Ni silicide or Cu silicide, with a metal germanide-containing contact material. The term “metal germanide-containing” is used in the present application to denote a pure metal germanide (i.e., MGe alloy) or a metal germanide that includes Si (i.e., MSiGe alloy).

摘要翻译： 提供了其中接触开口中的接触电阻降低的半导体结构及其形成方法。 这在本发明中通过用含金属锗化物的接触材料代替常规的接触冶金例如钨或金属硅化物，例如硅化镍或硅化铜，来实现。 在本申请中使用的术语“含金属锗”表示纯金属锗（即MGe合金）或包含Si（即，MSiGe合金）的金属锗化物。

公开(公告)号：US20110062525A1

公开(公告)日：2011-03-17

申请号：US12560585

申请日：2009-09-16

申请人： Christian Lavoie ,  Viorel C. Ontalus ,  Ahmet S. Ozcan

发明人： Christian Lavoie ,  Viorel C. Ontalus ,  Ahmet S. Ozcan

IPC分类号： H01L27/092 ,  H01L21/8238

CPC分类号： H01L21/28 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823864 ,  H01L29/7848

摘要： A method forms an integrated circuit structure. The method patterns a protective layer over a first-type field effect transistor and removes a stress liner from above a second-type field effect transistors. Then, the method removes a first-type silicide layer from source and drain regions of the second-type field effect transistor, but leaves at least a portion of the first-type silicide layer on the gate conductor of the second-type field effect transistor. The method forms a second-type silicide layer on the gate conductor and the source and drain regions of the second-type field effect transistor. The second-type silicide layer that is formed is different than the first-type silicide layer. For example, the first-type silicide layer and the second-type silicide layer can comprise different materials, different thicknesses, different crystal orientations, and/or different chemical phases, etc.

摘要翻译： 一种方法形成集成电路结构。 该方法在第一类场效应晶体管上形成保护层，并从第二种场效应晶体管上方去除应力衬垫。 然后，该方法从第二类型场效应晶体管的源极区和漏极区去除第一类型的硅化物层，但是将第一类型硅化物层的至少一部分留在第二类型场效应晶体管的栅极导体上 。 该方法在栅极导体和第二类场效应晶体管的源极和漏极区域上形成第二类型的硅化物层。 所形成的第二类硅化物层与第一型硅化物层不同。 例如，第一型硅化物层和第二类型硅化物层可以包括不同的材料，不同的厚度，不同的晶体取向和/或不同的化学相等。

公开(公告)号：US20100304563A1

公开(公告)日：2010-12-02

申请号：US12814942

申请日：2010-06-14

申请人： Kevin K. Chan ,  Christian Lavoie ,  Kern Rim

发明人： Kevin K. Chan ,  Christian Lavoie ,  Kern Rim

IPC分类号： H01L21/283

CPC分类号： H01L29/66507 ,  H01L29/6653 ,  H01L29/7833

摘要： A metal oxide semiconductor field effect transistor (MOSFET) structure that includes multiple and distinct self-aligned silicide contacts and methods of fabricating the same are provided. The MOSFET structure includes at least one metal oxide semiconductor field effect transistor having a gate conductor including a gate edge located on a surface of a Si-containing substrate; a first inner silicide having an edge that is substantially aligned to the gate edge of the at least one metal oxide semiconductor field effect transistor; and a second outer silicide located adjacent to the first inner silicide. In accordance with the present invention, the second outer silicide has second thickness is greater than the first thickness of the first inner silicide. Moreover, the second outer silicide has a resistivity that is lower than the resistivity of the first inner silicide.

摘要翻译： 提供了包括多个不同的自对准硅化物触点的金属氧化物半导体场效应晶体管（MOSFET）结构及其制造方法。 MOSFET结构包括至少一个金属氧化物半导体场效应晶体管，其具有包括位于含Si衬底的表面上的栅极边缘的栅极导体; 第一内部硅化物，其具有基本上与所述至少一个金属氧化物半导体场效应晶体管的栅极边缘对准的边缘; 以及位于第一内部硅化物附近的第二外部硅化物。 根据本发明，第二外部硅化物的第二厚度大于第一内部硅化物的第一厚度。 此外，第二外部硅化物的电阻率低于第一内部硅化物的电阻率。

公开(公告)号：US20100003800A1

公开(公告)日：2010-01-07

申请号：US12557557

申请日：2009-09-11

申请人： Francois Pagette ,  Christian Lavoie ,  Anna Topol

发明人： Francois Pagette ,  Christian Lavoie ,  Anna Topol

IPC分类号： H01L21/331

CPC分类号： H01L29/737 ,  H01L29/0821 ,  H01L29/66242

摘要： Embodiments of the invention provide a method of fabricating a semiconductor device. The method includes defining a sub-collector region in a layer of doped semiconductor material; forming an active region, a dielectric region, and a reach-through region on top of the layer of doped semiconductor material with the dielectric region separating the active region from the reach-through region; and siliciding the reach-through region and a portion of the sub-collector region to form a partially silicided conductive pathway. A semiconductor device made thereby is also provided.

摘要翻译： 本发明的实施例提供一种制造半导体器件的方法。 该方法包括在掺杂半导体材料层中限定子集电极区; 在所述掺杂半导体材料层的顶部上形成有源区，电介质区和到达区，所述电介质区将所述有源区与所述覆盖区分离; 并且将通过区域和子集电极区域的一部分硅化以形成部分硅化物的导电路径。 还提供了由此制成的半导体器件。

公开(公告)号：US20090026623A1

公开(公告)日：2009-01-29

申请号：US11828455

申请日：2007-07-26

申请人： Christian Lavoie ,  Francois Pagette ,  Anna W. Topol

发明人： Christian Lavoie ,  Francois Pagette ,  Anna W. Topol

IPC分类号： H01L23/48 ,  H01L21/4763

CPC分类号： H01L23/53271 ,  H01L21/743 ,  H01L21/76243 ,  H01L21/76889 ,  H01L21/84 ,  H01L23/535 ,  H01L27/1203 ,  H01L29/78603 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for forming a metal-semiconductor alloy layer uses particular thermal annealing conditions to provide a stress free metal-semiconductor alloy layer through interdiffusion of a buried semiconductor material layer and a metal-semiconductor alloy forming metal layer that contacts the buried semiconductor material layer within an aperture through a capping layer beneath which is buried the semiconductor material layer. A resulting semiconductor structure includes the metal-semiconductor alloy layer that further includes an interconnect portion beneath the capping layer and a contiguous via portion that penetrates at least partially through the capping layer. Such a metal-semiconductor alloy layer may be located interposed between a substrate and a semiconductor device having an active doped region.

摘要翻译： 一种形成金属 - 半导体合金层的方法使用特定的热退火条件，通过掩埋半导体材料层和接触掩埋半导体材料层的金属 - 半导体合金形成金属层的相互扩散来提供无应力的金属 - 半导体合金层， 穿过覆盖层的孔，其下埋有半导体材料层。 所得到的半导体结构包括还包括覆盖层下面的互连部分的金属 - 半导体合金层和至少部分地穿过覆盖层的连续通孔部分。 这种金属 - 半导体合金层可以位于衬底和具有有源掺杂区域的半导体器件之间。