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196 条记录 (耗时 0.043 秒)

    Full Sequence Metal and Barrier Layer Electrochemical Mechanical Processing
    92.
    发明申请
    Full Sequence Metal and Barrier Layer Electrochemical Mechanical Processing 失效
    全序列金属和屏障层电化学机械加工

    公开(公告)号：US20060260951A1

    公开(公告)日：2006-11-23

    申请号：US11425682

    申请日：2006-06-21

    申请人： Feng Liu ,  Liang-Yuh Chen ,  Stan Tsai ,  Yongqi Hu

    发明人： Feng Liu ,  Liang-Yuh Chen ,  Stan Tsai ,  Yongqi Hu

    IPC分类号： B23H3/02

    CPC分类号： B23H5/08 ,  C25F7/00

    摘要： A method and apparatus for electrochemically processing metal and barrier materials is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of establishing an electrically-conductive path through an electrolyte between an exposed layer of barrier material on the substrate and an electrode, pressing the substrate against a processing pad assembly, providing motion between the substrate and pad assembly in contact therewith and electrochemically removing a portion of the exposed layer during a first electrochemical processing step in a barrier processing station.

    摘要翻译： 提供了一种用于电化学处理金属和阻隔材料的方法和装置。 在一个实施例中，用于电化学处理衬底的方法包括以下步骤：在衬底上的暴露的阻挡材料层与电极之间建立通过电解质的导电路径，将衬底压在处理衬垫组件上， 所述衬底和焊盘组件与其接触并且在屏障处理站中的第一电化学处理步骤期间电化学去除所述暴露层的一部分。

    Full sequence metal and barrier layer electrochemical mechanical processing
    94.
    发明申请
    Full sequence metal and barrier layer electrochemical mechanical processing 失效

    公开(公告)号：US20060057812A1

    公开(公告)日：2006-03-16

    申请号：US10941060

    申请日：2004-09-14

    申请人： Feng Liu ,  Liang-Yuh Chen ,  Stan Tsai ,  Yongqi Hu

    发明人： Feng Liu ,  Liang-Yuh Chen ,  Stan Tsai ,  Yongqi Hu

    IPC分类号： H01L21/8222

    CPC分类号： B23H5/08 ,  C25F7/00

    摘要： A method and apparatus for electrochemically processing metal and barrier materials is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of establishing an electrically-conductive path through an electrolyte between an exposed layer of barrier material on the substrate and an electrode, pressing the substrate against a processing pad assembly with a force less than about 2 psi, providing motion between the substrate and pad assembly in contact therewith and electrochemically removing a portion of the exposed layer during a first electrochemical processing step in a barrier processing station.

    PROCESS AND COMPOSITION FOR PASSIVATING A SUBSTRATE DURING ELECTROCHEMICAL MECHANICAL POLISHING
    97.
    发明申请
    PROCESS AND COMPOSITION FOR PASSIVATING A SUBSTRATE DURING ELECTROCHEMICAL MECHANICAL POLISHING 审中-公开
    电化学机械抛光过程中用于剥离基材的方法和组合

    公开(公告)号：US20070144915A1

    公开(公告)日：2007-06-28

    申请号：US11613918

    申请日：2006-12-20

    申请人： Yuan Tian ,  Renhe Jia ,  Feng Liu ,  Yongqi Hu ,  Stan Tsai ,  Liang-Yuh Chen ,  Robert Ewald

    发明人： Yuan Tian ,  Renhe Jia ,  Feng Liu ,  Yongqi Hu ,  Stan Tsai ,  Liang-Yuh Chen ,  Robert Ewald

    IPC分类号： B23H7/00 ,  H05K3/07

    CPC分类号： C25F3/02 ,  B23H5/08 ,  H01L21/32125

    摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a method of electrochemically processing a substrate using a conductive polishing article is provided. The method includes disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising a cathode coupled to the conductive polishing article and an anode, wherein the substrate is in electrical contact with the anode, supplying a polishing composition comprising a cathodic inhibitor and an anodic inhibitor, forming a protective film on the cathode to prevent corrosion of the cathode, and polishing the substrate. In another embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes a corrosion inhibitor selected from the group of an amino acid based inhibitor, a polymeric based corrosion inhibitor, an oxidizer, a chelating inhibitor or combinations thereof.

    摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施例中，提供了使用导电抛光制品电化学处理衬底的方法。 该方法包括将包括形成在其上的导电材料层的衬底放置在包括耦合到导电抛光制品的阴极和阳极的处理装置中，其中衬底与阳极电接触，提供包含阴极抑制剂的抛光组合物， 阳极抑制剂，在阴极上形成保护膜以防止阴极腐蚀，并抛光衬底。 在另一个实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其组成包括选自氨基酸基抑制剂，聚合物基腐蚀抑制剂，氧化剂，螯合抑制剂或组合的腐蚀抑制剂 其中。

    Method and composition for polishing a substrate
    99.
    发明申请
    Method and composition for polishing a substrate 审中-公开
    抛光基材的方法和组合物

    公开(公告)号：US20060021974A1

    公开(公告)日：2006-02-02

    申请号：US10948958

    申请日：2004-09-24

    申请人： Feng Liu ,  Stan Tsai ,  Martin Wohlert ,  Yuan Tian ,  Renhe Jia ,  Yongqi Hu ,  Liang-Yuh Chen

    发明人： Feng Liu ,  Stan Tsai ,  Martin Wohlert ,  Yuan Tian ,  Renhe Jia ,  Yongqi Hu ,  Liang-Yuh Chen

    IPC分类号： C03C15/00 ,  C09K13/00

    CPC分类号： H01L21/7684 ,  C25F3/16 ,  C25F3/26 ,  H01L21/32125

    摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition is provided for removing at least a conductive material from a substrate surface including sulfuric acid or derivative, phosphoric acid or derivative, a first chelating agent including an organic salt, a pH adjusting agent to provide a pH between about 2 and about 10 and a solvent. The composition may further include a second chelating agent. The composition may be used in a single step or two step electrochemical mechanical planarization process. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface, such as tungsten, with a reduction in planarization type defects.

    摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 在一个方面，提供一种组合物，用于从包括硫酸或衍生物，磷酸或衍生物的底物表面至少去除导电材料，包括有机盐的第一螯合剂，pH调节剂以提供约2 约10和溶剂。 组合物还可以包括第二螯合剂。 组合物可以用于单步或两步电化学机械平面化工艺。 本文所述的抛光组合物和方法提高了材料从衬底表面（例如钨）的有效去除速率，同时平坦化型缺陷的减少。