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104 条记录 (耗时 0.026 秒)

    Laser diode system for reflecting and maintaining laser light within the system
    91.
    发明授权
    Laser diode system for reflecting and maintaining laser light within the system 失效
    用于在系统内反射和维持激光的激光二极管系统

    公开(公告)号：US5245620A

    公开(公告)日：1993-09-14

    申请号：US938677

    申请日：1992-09-01

    申请人： Haruo Tanaka ,  Naotaro Nakata

    发明人： Haruo Tanaka ,  Naotaro Nakata

    IPC分类号： H01S5/022

    CPC分类号： H01S5/02248 ,  H01S5/02228 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01S2301/176 ,  H01S5/0683

    摘要： A laser diode is provided which includes a substrate, a laser diode chip bonded on the substrate through a sub-mount, and a monitor element formed on the sub-mount. A space between a rear cleavage face of the laser diode chip and the surface of the monitor element is connected by a solid state waveguide, and the surface of the solid state waveguide is covered by a light reflecting resin layer.

    摘要翻译： 提供了一种激光二极管，其包括基板，通过子安装座接合在基板上的激光二极管芯片，以及形成在子安装座上的监视元件。 激光二极管芯片的后切割面与监视元件的表面之间的空间通过固态波导连接，固态波导的表面被光反射树脂层覆盖。

    Laser diode system for cutting off the environment from the laser diode
    92.
    发明授权
    Laser diode system for cutting off the environment from the laser diode 失效
    用于从激光二极管切断环境的激光二极管系统

    公开(公告)号：US5226052A

    公开(公告)日：1993-07-06

    申请号：US946022

    申请日：1992-09-10

    申请人： Haruo Tanaka ,  Naotaro Nakata

    发明人： Haruo Tanaka ,  Naotaro Nakata

    IPC分类号： H01S5/022 ,  H01S5/028

    CPC分类号： H01S5/02248 ,  H01L2224/48091 ,  H01L2924/19107 ,  H01S2301/176 ,  H01S5/02228 ,  H01S5/0282 ,  H01S5/0683

    摘要： A laser diode, which includes a substrate, a laser diode chip bonded on the substrate through a sub-mount, and a monitor element formed on the substrate, monitors laser light emitted from a rear cleavage face of the laser diode chip. The laser diode chip has its front cleavage face covered by a transparent resin. As a result, variations of the surface state of the front cleavage face are prevented.

    摘要翻译： 激光二极管，其包括基板，通过子安装座接合在基板上的激光二极管芯片以及形成在基板上的监视元件，监视从激光二极管芯片的后裂纹面发射的激光。 激光二极管芯片的前裂纹面被透明树脂覆盖。 结果，防止了前裂纹面的表面状态的变化。

    Semi-conductor laser unit
    93.
    发明授权
    Semi-conductor laser unit 失效
    半导体激光单元

    公开(公告)号：US5177753A

    公开(公告)日：1993-01-05

    申请号：US715362

    申请日：1991-06-14

    申请人： Haruo Tanaka

    发明人： Haruo Tanaka

    IPC分类号： H01S5/00 ,  G02B6/42 ,  H01S5/022 ,  H01S5/042

    CPC分类号： H01S5/02228 ,  G02B6/4212 ,  H01L2224/48091 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L33/54 ,  H01S5/02248 ,  H01S5/0683

    摘要： A semi-conductor laser unit is provided which includes a substrate, and a laser chip bonded on the substrate through a submount so as to project laser beam towards the outside from a front cleavage face of the laser chip. The front cleavage face of the laser chip is covered by a transparent resin material, with a front face of the transparent resin material being formed into a smooth face. As a result, the beam characteristics and resistance against the environment for the semi-conductor laser are improved.

    摘要翻译： 提供一种半导体激光器单元，其包括基板和激光芯片，该激光芯片通过基座安装在基板上，从而将激光束从激光芯片的前裂纹面向外侧突出。 激光芯片的前裂纹面由透明树脂材料覆盖，透明树脂材料的正面形成平滑的面。 结果，提高了半导体激光器的光束特性和耐环境性。

    Paper coating composition
    96.
    发明授权
    Paper coating composition 失效
    纸涂料组合物

    公开(公告)号：US5131951A

    公开(公告)日：1992-07-21

    申请号：US741890

    申请日：1991-08-08

    申请人： Yoshifumi Yoshida ,  Toshiyuki Hasegawa ,  Haruo Tanaka

    发明人： Yoshifumi Yoshida ,  Toshiyuki Hasegawa ,  Haruo Tanaka

    IPC分类号： D21H19/62

    CPC分类号： D21H19/62

    摘要： A paper coating composition which comprises:(I) a pigment,(II) an aqueous binder, and(II) a resinous ingredient comprising (A) a water-soluble resin which is prepared by cross-linking (a) a condensation product of (al) an alkylenediamine or a polyalkylenepolyamine and (a2) an urea compound with (b) a cross-linking compound. This composition imparts excellent ink receptivity, excellent water resistance, and in particular, excellent anti-blister property to paper.

    System and apparatus for and method of assembling workpieces
    97.
    发明授权
    System and apparatus for and method of assembling workpieces 失效
    用于组装工作的系统和装置和方法

    公开(公告)号：US5104033A

    公开(公告)日：1992-04-14

    申请号：US577706

    申请日：1990-09-05

    申请人： Haruo Tanaka ,  Yousuke Narita ,  Hiroshi Itoh ,  Shigeru Suzuki ,  Hidenori Horie ,  Akira Konno

    发明人： Haruo Tanaka ,  Yousuke Narita ,  Hiroshi Itoh ,  Shigeru Suzuki ,  Hidenori Horie ,  Akira Konno

    IPC分类号： B23K37/047 ,  B23Q7/02

    CPC分类号： B23K37/047 ,  B23Q7/02 ,  Y10T29/49321 ,  Y10T29/53404

    摘要： An apparatus for assembling workpieces in which an assembling work is performed includes a workpiece setting jig, a setting station including a workpiece setting apparatus for setting a first workpiece on the workpiece setting jig, an assembling station including an assembling unit for assembling a second workpiece with the first workpiece on the workpiece setting jig, a welding station including a welding unit for welding the first and the second workpieces together, a discharging station including a discharging unit for taking the welded workpieces out of the workpiece setting jig, a charging station provided in a position which faces the setting station as seen in the direction of sending and withdrawing the workpiece setting jig. The charging station, the assembling station, the welding station and the discharging station being arranged in a circular form. A mechanism is provided for circulating the workpiece setting jig among the charging station, the assembling station, the welding station and the discharging station in sequence. A mechanism is provided for reciprocating the workpiece setting jig between the setting station and the charging station. The method of assembling workpieces includes disposing the charging station in a position facing the setting station, and disposing the charging station, the assembling station, the welding station, and the discharging station in a circular form to a side of the setting station.

    摘要翻译： 一种用于组装工件的装置的装置，包括：工件设定夹具;设置工位，包括用于在工件设置夹具上设置第一工件的工件设定装置;组装工位，包括用于组装第二工件的组装单元， 工件设置夹具上的第一工件，包括用于将第一和第二工件焊接在一起的焊接单元的焊接站，包括用于将焊接的工件从工件设置夹具取出的排出单元的排放站，设置在 在发送和取出工件设置夹具的方向上看到的面向设定台的位置。 充电站，组装站，焊接站和排放站以圆形的形式布置。 提供了一种用于在充电站，组装站，焊接站和排放站之间依次循环工件设置夹具的机构。 提供了一种用于使工件设置夹具在设置台和充电站之间往复运动的机构。 组装工件的方法包括将充电站设置在与设置台相对的位置，并将循环形式的充电站，组装站，焊接站和排放站设置到设置站的一侧。

    Semiconductor laser device with mounting block
    98.
    发明授权
    Semiconductor laser device with mounting block 失效
    具有安装块的半导体激光器件

    公开(公告)号：US5089861A

    公开(公告)日：1992-02-18

    申请号：US686152

    申请日：1991-04-16

    申请人： Haruo Tanaka ,  Tetsuichi Inoue

    发明人： Haruo Tanaka ,  Tetsuichi Inoue

    IPC分类号： H01L33/48 ,  H01S5/022

    CPC分类号： H01S5/02244 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L33/483 ,  H01S5/02212 ,  H01S5/02248 ,  H01S5/0683

    摘要： The present invention provides a semiconductor laser device which comprises a metallic stem, a cap mounted to one surface of the stem, a mounting block arranged to project from the one surface of the stem into the cap, and a semiconductor laser chip by the mounting block. The stem comprises a first stem member and a second member joined to the first stem member in lamination thereto. The first stem member is formed with a cutting line partially surrounding a portion of the first stem member. The mounting block is provided by bending the partially surrounded portion into the cap to leave a corresponding perforation in the first stem member.

    摘要翻译： 本发明提供一种半导体激光装置，其包括金属杆，安装在所述杆的一个表面上的盖，安装块，其布置成从所述杆的所述一个表面突出到所述盖中;以及半导体激光器芯片，通过所述安装块 。 所述杆包括第一杆构件和与所述第一杆构件并联连接到所述第一杆构件的第二构件。 第一杆构件形成有部分围绕第一杆构件的一部分的切割线。 通过将部分包围的部分弯曲到盖中来提供安装块，以在第一杆构件中留下相应的穿孔。