Fringe Field Switching Mode Liquid Crystal Display Device and Method of Fabricating the Same
    91.
    发明申请
    Fringe Field Switching Mode Liquid Crystal Display Device and Method of Fabricating the Same 有权
    边缘场切换模式液晶显示装置及其制造方法

    公开(公告)号:US20110109861A1

    公开(公告)日:2011-05-12

    申请号:US12831793

    申请日:2010-07-07

    IPC分类号: G02F1/1343 H01L33/60

    摘要: Provided is a liquid crystal display including a transparent pixel electrode and a transparent common electrode in a pixel region to drive liquid crystals. The transparent common electrode includes a plurality of slits and is configured to open at least a portion of a switching device to connect unit pixels, the slits have an angle of 5 to 10° with respect to a gate line, and a rubbing direction of a liquid crystal layer is substantially parallel to a gate direction. Therefore, it is possible to provide the liquid crystal display capable of removing factors decreasing an aperture ratio, preventing light from leaking, and further improving internal reflection.

    摘要翻译: 提供一种在像素区域中包括透明像素电极和透明公共电极以驱动液晶的液晶显示器。 透明公共电极包括多个狭缝,并且被配置为打开开关装置的至少一部分以连接单位像素,所述狭缝相对于栅极线具有5至10°的角度,并且 液晶层基本上平行于栅极方向。 因此,可以提供能够去除降低开口率的因素的液晶显示器,防止光泄漏,并进一步改善内部反射。

    MULTI-GAS FLOW DIFFUSER
    92.
    发明申请
    MULTI-GAS FLOW DIFFUSER 失效
    多气流扩散器

    公开(公告)号:US20100311249A1

    公开(公告)日:2010-12-09

    申请号:US12794756

    申请日:2010-06-06

    摘要: Embodiments of the disclosure generally provide a method and apparatus for processing a substrate in a vacuum process chamber. In one embodiment a vacuum process chamber is provided that includes a chamber body and lid disposed on the chamber body. A blocker plate is coupled to the lid and bounds a staging plenum therewith. A gas distribution plate is coupled to the lid. The gas distribution plate separates a main plenum defined between the gas distribution plate and the blocker plate from a process volume defined within the chamber body. The gas distribution plate and the blocker plate define a spacing gradient therebetween which influences mixing of gases within the main plenum.

    摘要翻译: 本公开的实施例通常提供用于在真空处理室中处理衬底的方法和装置。 在一个实施例中,提供真空处理室,其包括设置在室主体上的室主体和盖。 阻挡板联接到盖子并且与其分隔起来。 气体分配板联接到盖子上。 气体分配板将限定在气体分配板和阻挡板之间的主增压室与室主体内限定的过程体积分开。 气体分配板和阻挡板限定了它们之间的间隔梯度,其影响主增压室内气体的混合。

    SUBSTRATE SUPPORT WITH GAS INTRODUCTION OPENINGS
    94.
    发明申请
    SUBSTRATE SUPPORT WITH GAS INTRODUCTION OPENINGS 审中-公开
    基础支持与气体介绍开幕

    公开(公告)号:US20100184290A1

    公开(公告)日:2010-07-22

    申请号:US12686483

    申请日:2010-01-13

    IPC分类号: H01L21/28

    CPC分类号: H01L21/68742 H01L21/6831

    摘要: Embodiments disclosed herein generally relate to an apparatus and a method for placing a substrate substantially flush against a substrate support in a processing chamber. When a large area substrate is placed onto a substrate support, the substrate may not be perfectly flush against the substrate support due to gas pockets that may be present between the substrate and the substrate support. The gas pockets can lead to uneven deposition on the substrate. Therefore, pulling the gas from between the substrate and the support may pull the substrate substantially flush against the support. During deposition, an electrostatic charge can build up and cause the substrate to stick to the substrate support. By introducing a gas between the substrate and the substrate support, the electrostatic forces may be overcome so that the substrate can be separated from the susceptor with less or no plasma support which takes extra time and gas.

    摘要翻译: 本文公开的实施例通常涉及用于将衬底基本上与衬底支撑件齐平地放置在处理室中的装置和方法。 当将大面积基板放置在基板支撑件上时,由于可能存在于基板和基板支撑件之间的气体袋,基板可能不能完全与基板支撑件齐平。 气袋可导致基板上的不均匀沉积。 因此,从衬底和支撑件之间拉动气体可以将衬底基本上与支撑件齐平。 在沉积期间,静电电荷可能积聚并使衬底粘附到衬底支撑件上。 通过在衬底和衬底支撑件之间引入气体,可以克服静电力,使得衬底可以用较少或不需要额外时间和气体的等离子体支架与基座分离。

    METHOD TO PREVENT THIN SPOT IN LARGE SIZE SYSTEM
    95.
    发明申请
    METHOD TO PREVENT THIN SPOT IN LARGE SIZE SYSTEM 审中-公开
    在大型系统中防止漏点的方法

    公开(公告)号:US20100151688A1

    公开(公告)日:2010-06-17

    申请号:US12634921

    申请日:2009-12-10

    IPC分类号: H01L21/3065 H01L21/302

    摘要: Embodiments disclosed herein generally include methods of ensuring uniform deposition on a substrate. The smallest gap between a portion of the substrate and the substrate support upon which the substrate rests may lead to uneven deposition of material or ‘thin spots’ on the substrate. Large area substrates, due to their size, are susceptible to numerous gaps at random locations. By inducing an electrostatic charge on the substrate prior to placing the substrate onto the substrate support, the substrate may be placed generally flush against the substrate support. The electrostatic charge on the substrate creates an attraction between the substrate and substrate support to pull substantially the entire surface of the substrate into contact with the substrate support. Material may then be substantially uniformly deposited on the substrate while reducing ‘thin spots’.

    摘要翻译: 本文公开的实施例通常包括确保在基底上均匀沉积的方法。 衬底的一部分和衬底支撑物之间的最小间隙可能导致材料的不均匀沉积或衬底上的“薄点”。 由于其大尺寸,大面积基板在随机位置易受许多间隙的影响。 通过在将衬底放置在衬底支撑件上之前在衬底上引起静电电荷,衬底可以放置在与衬底支撑件相对齐齐的位置。 衬底上的静电电荷在衬底和衬底支撑件之间产生吸引力,以基本上将衬底的整个表面拉到与衬底支撑件接触。 然后可以将材料基本均匀地沉积在衬底上,同时减少“薄点”。

    Detection and suppression of electrical arcing
    98.
    发明授权
    Detection and suppression of electrical arcing 有权
    检测和抑制电弧

    公开(公告)号:US07514936B2

    公开(公告)日:2009-04-07

    申请号:US11925893

    申请日:2007-10-27

    IPC分类号: G01N27/62

    CPC分类号: G01R31/1254

    摘要: Method and apparatus for detecting or suppressing electrical arcing or other abnormal change in the electrical impedance of a load connected to a power source. Preferably the load is a plasma chamber used for manufacturing electronic components such as semiconductors and flat panel displays. Arcing is detected by monitoring one or more sensors. Each sensor either responds to a characteristic of the electrical power being supplied by an electrical power source to the plasma or is coupled to the plasma chamber so as to respond to an electromagnetic condition within the chamber. Arcing is suppressed by reducing the power output for a brief period. Then the power source increases its power output, preferably to its original value. If the arcing resumes, the power source repeats the steps of reducing and then restoring the power output.

    摘要翻译: 用于检测或抑制连接到电源的负载的电阻抗的电弧或其他异常变化的方法和装置。 优选地,负载是用于制造诸如半导体和平板显示器的电子部件的等离子体室。 通过监视一个或多个传感器来检测电弧。 每个传感器或者响应于由电源提供给等离子体的电力的特性,或者耦合到等离子体室,以便对室内的电磁条件作出响应。 通过在短时间内减少功率输出来抑制电弧。 然后电源增加其功率输出,最好提高到其原始值。 如果电弧恢复,则电源重复减少然后恢复功率输出的步骤。

    METHODS AND APPARATUS FOR DEPOSITING A UNIFORM SILICON FILM WITH FLOW GRADIENT DESIGNS
    99.
    发明申请
    METHODS AND APPARATUS FOR DEPOSITING A UNIFORM SILICON FILM WITH FLOW GRADIENT DESIGNS 审中-公开
    用流平面设计沉积均匀硅膜的方法和装置

    公开(公告)号:US20090000551A1

    公开(公告)日:2009-01-01

    申请号:US12204717

    申请日:2008-09-04

    IPC分类号: C23C16/54

    摘要: Methods and apparatus having a flow gradient created from a gas distribution plate are provided. In one embodiment, the method and apparatus are particularly useful for, but not limited to, depositing a silicon film for solar cell applications. The apparatus for depositing a uniform film for solar cell applications includes a processing chamber, and a quadrilateral gas distribution plate disposed in the processing chamber and having at least four corners separated by four sides. The gas distribution plate further includes a first plurality of chokes formed through the gas distribution plate, the first plurality of chokes located in the corners, and a second plurality of chokes formed through the gas distribution plate, the second plurality of chokes located along the sides of the gas distribution plate between the corner regions, wherein the first plurality of chokes have a greater flow resistance than that of the second plurality of chokes.

    摘要翻译: 提供了具有由气体分配板产生的流动梯度的方法和装置。 在一个实施例中,该方法和装置特别适用于但不限于沉积太阳能电池应用的硅膜。 用于沉积用于太阳能电池应用的均匀膜的设备包括处理室和设置在处理室中的四边形气体分配板,并且具有由四个侧面分开的至少四个角。 气体分配板还包括通过气体分配板形成的第一多个扼流圈,位于角部的第一多个扼流圈,以及通过气体分配板形成的第二多个扼流圈,沿着侧面设置的第二多个扼流圈 在所述角区域之间的所述气体分配板中,所述第一多个扼流器具有比所述第二多个扼流圈更大的流动阻力。

    Method of controlling film uniformity of a cvd-deposited silicon nitride film during deposition over a large substrate surface
    100.
    发明申请
    Method of controlling film uniformity of a cvd-deposited silicon nitride film during deposition over a large substrate surface 有权
    控制沉积在大的基片表面上的沉积氮化硅膜的膜均匀性的方法

    公开(公告)号:US20080268175A1

    公开(公告)日:2008-10-30

    申请号:US12082554

    申请日:2008-04-11

    IPC分类号: C23C16/448

    摘要: We have discovered that adding H2 to a precursor gas composition including SiH4, NH3, and N2 is effective at improving the wet etch rate and the wet etch rate uniformity across the substrate surface of a-SiNx:H films which are deposited on a substrate by PECVD. Wet etch rate is an indication of film density. Typically, the lower the wet etch rate, the denser the film. The addition of H2 to the SiH4/NH3/N2 precursor gas composition did not significantly increase the variation in deposited film thickness across the surface of the substrate. The uniformity of the film across the substrate enables the production of flat panel displays having surface areas of 25,000 cm2 and larger.

    摘要翻译: 我们已经发现,向包含SiH 4 N,NH 3和N 2的前体气体组合物中加入H 2 N 2, 在通过PECVD沉积在衬底上的a-SiN x H:H膜的衬底表面上改善湿蚀刻速率和湿蚀刻速率均匀性是有效的。 湿蚀刻速率是膜密度的指示。 通常,湿蚀刻速率越低,膜越致密。 向SiH 4 N 3 / NH 3 / N 2 N前体气体组合物中加入H 2 O没有显着增加 衬底表面沉积膜厚度的变化。 跨过衬底的膜的均匀性使得能够生产具有25,000cm 2以上的表面积的平板显示器。