Light-emitting device and manufacturing method thereof
    92.
    发明授权
    Light-emitting device and manufacturing method thereof 有权
    发光元件及其制造方法

    公开(公告)号:US07943943B2

    公开(公告)日:2011-05-17

    申请号:US11818024

    申请日:2007-06-12

    IPC分类号: H01L33/00

    摘要: To provide a light-emitting device using a nitride semiconductor which can attain high-power light emission by highly efficient light emission and a manufacturing method thereof, the light-emitting device includes a GaN substrate and a light-emitting layer including an InAlGaN quaternary alloy on a side of a first main surface of GaN substrate.

    摘要翻译: 为了提供使用可以通过高效发光获得高功率发光的氮化物半导体的发光器件及其制造方法,该发光器件包括GaN衬底和包括InAlGaN四元合金的发光层 在GaN衬底的第一主表面的一侧。

    Nitride semiconductor light-emitting element
    94.
    发明申请
    Nitride semiconductor light-emitting element 有权
    氮化物半导体发光元件

    公开(公告)号:US20090026440A1

    公开(公告)日:2009-01-29

    申请号:US11659002

    申请日:2006-04-25

    IPC分类号: H01L33/00

    CPC分类号: H01L33/32 H01L33/06

    摘要: A nitride semiconductor light-emitting element 11 is one for generating light containing a wavelength component in an ultraviolet region. The nitride semiconductor light-emitting element 11 has an active region 17 including InX1AlY1Ga1-X1-Y1N well layers 13 (1>X1>0 and 1>Y1>0) and InX2AlY2Ga1-X2-Y2N barrier layers 15 (1>X2>0 and 1>Y2>0). An energy gap difference Eg1 between the InX1AlY1Ga1-X1-Y1N well layers 13 and the InX2AlY2Ga1-X2-Y2N barrier layers 15 is not less than 2.4×10−20 J nor more than 4.8×10−20 J.

    摘要翻译: 氮化物半导体发光元件11是用于产生包含紫外线区域中的波长分量的光的氮化物半导体发光元件。 氮化物半导体发光元件11具有InX1AlY1Ga1-X1-Y1N阱层13(1> X1> 0和Y1> Y1> 0)和InX2AlY2Ga1-X2-Y2N势垒层15(1> X2> 0)的有源区17 和1> Y2> 0)。 InX1AlY1Ga1-X1-Y1N阱层13和InX2AlY2Ga1-X2-Y2N势垒层15之间的能隙差Eg1不小于2.4×10-20J,也不大于4.8×10-20JJ。

    Semiconductor light generating device
    95.
    发明申请
    Semiconductor light generating device 有权
    半导体发光装置

    公开(公告)号:US20080076199A1

    公开(公告)日:2008-03-27

    申请号:US11979873

    申请日:2007-11-09

    IPC分类号: H01L21/00

    摘要: The semiconductor light generating device comprises a light generating region 3, a first AlX1Ga1-X1N semiconductor (0≦X1≦1) layer 5 and a second AlX2Ga1-X2N semiconductor (0≦X2≦1) layer 7. In this semiconductor light generating device, the light generating region 3 is made of III-nitride semiconductor, and includes a InAlGAN semiconductor layer. The first AlX1Ga1-X1N semiconductor (0≦X1≦1) layer 5 is doped with a p-type dopant, such as magnesium, and is provided on the light generating region 3. The second AlX2Ga1-X2N semiconductor layer 7 has a p-type concentration smaller than the first AlX1Ga1-X1N semiconductor layer 5. The second AlX2Ga1-X2N semiconductor (0≦X2≦1) layer 7 is provided between the light generating region 3 and the first AlX1Ga1-X1N semiconductor layer 5.

    摘要翻译: 半导体光产生装置包括发光区域3,第一Al 1 N 1 Ga 1-X1 N半导体(0 <= X1 <= 1)层5和第二层 Al x X2 Ga 1-X2 N半导体(0 <= X2 <= 1)层7.在该半导体光产生装置中,光产生区3由III 氮化物半导体,并且包括InAlGAN半导体层。 第一Al X1 N 1 Ga 1-X1 N半导体(0 <= X1 <= 1)层5掺杂有诸如镁的p型掺杂剂,并且是 设置在发光区域3上。第二Al X2 X2 Ga 1-X2 N半导体层7的p型浓度比第一Al X1 < 第一Al 2 N 2 Ga 1-X 2 N半导体(0 <= X2 <= 1 / 1)层7设置在发光区域3和第一Al 1 N 1 Ga 1-X1 N半导体层5之间。

    Semiconductor light generating device
    96.
    发明授权
    Semiconductor light generating device 有权
    半导体发光装置

    公开(公告)号:US07294867B2

    公开(公告)日:2007-11-13

    申请号:US11032230

    申请日:2005-01-11

    IPC分类号: H01L33/00 H01L29/24

    摘要: The semiconductor light generating device comprises a light generating region 3, a first AlX1Ga1-X1N semiconductor (0≦X1≦1) layer 5 and a second AlX2Ga1-X2N semiconductor (0≦X2≦1) layer 7. In this semiconductor light generating device, the light generating region 3 is made of III-nitride semiconductor, and includes a InAlGaN semiconductor layer. The first AlX1Ga1-X1N semiconductor (0≦X1≦1) layer 5 is doped with a p-type dopant, such as magnesium, and is provided on the light generating region 3. The second AlX2Ga1-X2N semiconductor layer 7 has a p-type concentration smaller than the first AlX1Ga1-X1N semiconductor layer 5. The second AlX2Ga1-X2N semiconductor (0≦X2≦1) layer 7 is provided between the light generating region 3 and the first AlX1Ga1-X1N semiconductor layer 5.

    摘要翻译: 半导体光产生装置包括发光区域3,第一Al X1 X 1 Ga 1-X1 N半导体(0 <= X 1 <= 1)层5和 第二Al x X2 Ga 1-X2 N半导体(0 <= X 2 <= 1)层7。 在该半导体发光元件中,发光区域3由III族氮化物半导体构成,具有InAlGaN半导体层。 第一Al X1 X1&lt; 1-X1&gt; N半导体(0 <= X 1 <= 1)层5掺杂有诸如镁的p型掺杂剂,以及 设置在发光区域3上。 第二Al X2 X2 Ga 1-X2 N半导体层7的p型浓度比第一Al X1 Ga 1 -X1 N半导体层5。 第二Al X2 X2 Ga 1-X2 N半导体(0 <= X 2 <= 1)层7设置在发光区3和第一Al X1 1-X1 N半导体层5。

    PHOTODIODE AND METHOD FOR PRODUCING THE SAME
    99.
    发明申请
    PHOTODIODE AND METHOD FOR PRODUCING THE SAME 审中-公开
    光致变色剂及其制造方法

    公开(公告)号:US20130313521A1

    公开(公告)日:2013-11-28

    申请号:US14000187

    申请日:2012-02-03

    IPC分类号: H01L31/0352

    摘要: An object of the present invention is to provide, for example, a photodiode that can have sufficiently high sensitivity in a near-infrared wavelength range of 1.5 μm to 1.8 μm and can have a low dark current. A photodiode (10) according to the present invention includes a buffer layer (2) positioned on and in contact with an InP substrate (1), and an absorption layer (3) positioned on and in contact with the buffer layer, wherein the absorption layer includes 50 or more pairs in which a first semiconductor layer 3a and a second semiconductor layer 3b constitute a single pair, the first semiconductor layer 3a having a bandgap energy of 0.73 eV or less, the second semiconductor layer 3b having a larger bandgap energy than the first semiconductor layer 3a, and the first semiconductor layer 3a and the second semiconductor layer 3b constitute a strain-compensated quantum well structure and each have a thickness of 1 nm or more and 10 nm or less.

    摘要翻译: 本发明的一个目的是提供例如在1.5μm至1.8μm的近红外波长范围内具有足够高灵敏度的光电二极管,并且可以具有低暗电流。 根据本发明的光电二极管(10)包括位于InP衬底(1)上并与InP衬底(1)接触的缓冲层(2)和位于缓冲层上并与缓冲层接触的吸收层(3),其中吸收 层包括50个或更多对,其中第一半导体层3a和第二半导体层3b构成单对,第一半导体层3a的带隙能为0.73eV以下,第二半导体层3b的带隙能量比 第一半导体层3a,第一半导体层3a和第二半导体层3b构成应变补偿量子阱结构,并且各自具有1nm以上且10nm以下的厚度。

    Method for fabricating wafer product and method for fabricating gallium nitride based semiconductor optical device
    100.
    发明授权
    Method for fabricating wafer product and method for fabricating gallium nitride based semiconductor optical device 有权
    制造晶圆产品的方法和用于制造氮化镓基半导体光学器件的方法

    公开(公告)号:US08415180B2

    公开(公告)日:2013-04-09

    申请号:US13318039

    申请日:2010-03-01

    IPC分类号: H01L21/00

    摘要: Provided is a method for fabricating a wafer product including an active layer grown on a gallium oxide substrate and allowing an improvement in emission intensity. In step S105, a buffer layer 13 comprised of a Group III nitride such as GaN, AlGaN, or AlN is grown at 600 Celsius degrees on a primary surface 11a of a gallium oxide substrate 11. After the growth of the buffer layer 13, while supplying a gas G2, which contains hydrogen and nitrogen, into a growth reactor 10, the gallium oxide substrate 11 and the buffer layer 13 are exposed to an atmosphere in the growth reactor 11 at 1050 Celsius degrees. A Group III nitride semiconductor layer 15 is grown on the modified buffer layer. The modified buffer layer includes, for example, voids. The Group III nitride semiconductor layer 15 can be comprised of GaN and AlGaN. When the Group III nitride semiconductor layer 15 is formed of these materials, excellent crystal quality is obtained on the modified buffer layer 14.

    摘要翻译: 本发明提供一种制造晶片产品的方法,该晶片产品包括在氧化镓衬底上生长的有源层并且能够提高发光强度。 在步骤S105中,在氧化镓衬底11的主表面11a上以600摄氏度生长由诸如GaN,AlGaN或AlN的III族氮化物构成的缓冲层13.在缓冲层13生长之后,同时 将含有氢和氮的气体G2供给到生长反应器10中,将氧化镓衬底11和缓冲层13在生长反应器11中的气氛中以1050摄氏度暴露。 在改性缓冲层上生长III族氮化物半导体层15。 改性缓冲层包括例如空隙。 III族氮化物半导体层15可以由GaN和AlGaN构成。 当由这些材料形成III族氮化物半导体层15时,在改性缓冲层14上获得优异的晶体质量。