公开(公告)号：US08680692B2

公开(公告)日：2014-03-25

申请号：US13440180

申请日：2012-04-05

申请人： Chiang-Cheng Chang ,  Meng-Tsung Lee ,  Jung-Pang Huang ,  Shih-Kuang Chiu

发明人： Chiang-Cheng Chang ,  Meng-Tsung Lee ,  Jung-Pang Huang ,  Shih-Kuang Chiu

IPC分类号： H01L23/28

CPC分类号： H01L21/56 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L21/673 ,  H01L21/67333 ,  H01L21/67763 ,  H01L21/68 ,  H01L21/683 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L24/05 ,  H01L24/13 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/1815 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/014

摘要： A fabrication method of a semiconductor package includes the steps of: providing a carrier having a concave portion and a releasing layer formed on a surface thereof; disposing a chip on the releasing layer in the concave portion; forming an encapsulant on the chip and the releasing layer; removing the releasing layer and the carrier; and forming a circuit structure on the encapsulant and the chip. The design of the concave portion facilitates alignment of the chip to prevent it from displacement, thereby improving the product reliability. A semiconductor package fabricated by the fabrication method is also provided.

摘要翻译： 半导体封装的制造方法包括以下步骤：提供在其表面上形成有凹部和脱模层的载体; 在凹部中的脱模层上设置芯片; 在芯片和释放层上形成密封剂; 去除释放层和载体; 并在密封剂和芯片上形成电路结构。 凹部的设计有助于芯片对准以防止其移位，从而提高产品的可靠性。 还提供了通过制造方法制造的半导体封装。

公开(公告)号：US20130187285A1

公开(公告)日：2013-07-25

申请号：US13440180

申请日：2012-04-05

申请人： Chiang-Cheng Chang ,  Meng-Tsung Lee ,  Jung-Pang Huang ,  Shih-Kuang Chiu

发明人： Chiang-Cheng Chang ,  Meng-Tsung Lee ,  Jung-Pang Huang ,  Shih-Kuang Chiu

IPC分类号： H01L23/48 ,  H01L21/50 ,  H01L21/56

CPC分类号： H01L21/56 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L21/673 ,  H01L21/67333 ,  H01L21/67763 ,  H01L21/68 ,  H01L21/683 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L24/05 ,  H01L24/13 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/1815 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/014

摘要： A fabrication method of a semiconductor package includes the steps of: providing a carrier having a concave portion and a releasing layer formed on a surface thereof; disposing a chip on the releasing layer in the concave portion; forming an encapsulant on the chip and the releasing layer; removing the releasing layer and the carrier; and forming a circuit structure on the encapsulant and the chip. The design of the concave portion facilitates alignment of the chip to prevent it from displacement, thereby improving the product reliability. A semiconductor package fabricated by the fabrication method is also provided.

摘要翻译： 半导体封装的制造方法包括以下步骤：提供在其表面上形成有凹部和释放层的载体; 在凹部中的脱模层上设置芯片; 在芯片和释放层上形成密封剂; 去除释放层和载体; 并在密封剂和芯片上形成电路结构。 凹部的设计有助于芯片对准以防止其移位，从而提高产品的可靠性。 还提供了通过制造方法制造的半导体封装。

公开(公告)号：USRE42402E1

公开(公告)日：2011-05-31

申请号：US11351214

申请日：1995-10-13

申请人： Barry Gregerson ,  Brian Wiseman ,  Gary Gallagher

发明人： Barry Gregerson ,  Brian Wiseman ,  Gary Gallagher

IPC分类号： B65D85/90

CPC分类号： H01L21/67369 ,  G11B33/0405 ,  G11B33/14 ,  H01L21/67379 ,  H01L21/67383 ,  H01L21/67396 ,  H01L21/67763

摘要： A container for creating a microenvironment is disclosed. The container includes a shell, a door and a plurality of supports having a unique design which are used to securely retain items, such as silicon wafers, in a spaced apart parallel relationship. The supports are removable. An electrical path is provided to ground the supports. Kinematic coupling structures are also provided for positioning the container on a surface so as to, for example, properly align the door with the port of a wafer processing tool.

摘要翻译： 公开了一种用于创建微环境的容器。 容器包括壳体，门和具有独特设计的多个支撑件，其用于以间隔开的平行关系可靠地保持诸如硅晶片的物品。 支架是可移动的。 提供电路以使支撑件接地。 还提供运动耦合结构用于将容器定位在表面上，以便例如将门与晶片处理工具的端口正确对准。

公开(公告)号：US20110106300A1

公开(公告)日：2011-05-05

申请号：US12764493

申请日：2010-04-21

申请人： Wei-Cheng Wang ,  Feng-Ning Lee

发明人： Wei-Cheng Wang ,  Feng-Ning Lee

IPC分类号： H01L21/677 ,  H01L21/673 ,  G06F19/00

CPC分类号： H01L21/67763 ,  H01L21/67733

摘要： A system for managing semiconductor production includes a conveyor to convey a wafer carrier to or from an overhead hoist transfer system. The system also includes a cross-system transport apparatus to transfer the wafer carrier between the conveyor and an overhead shuttle system.

摘要翻译： 用于管理半导体生产的系统包括将晶片载体输送到或从天花板起重机输送系统输送的输送机。 该系统还包括跨系统传送装置，以在输送机和架空梭系统之间传送晶片载体。

公开(公告)号：US20100232914A1

公开(公告)日：2010-09-16

申请号：US12403632

申请日：2009-03-13

申请人： Diwaskar Adhikari ,  Raymond G. Goss ,  Carmen A. Maxim ,  Jon Rothe

发明人： Diwaskar Adhikari ,  Raymond G. Goss ,  Carmen A. Maxim ,  Jon Rothe

IPC分类号： H01L21/677

CPC分类号： H01L21/67253 ,  H01L21/67276 ,  H01L21/67763 ,  H01L21/67778

摘要： A method includes designating a plurality of wafers as members of a group. A first subset of the wafers is housed in a first wafer pod and a second subset of the wafers is housed in a second wafer pod. The first wafer pod is routed to a first tool, and at least a first operation is performed on the wafers in the first subset using the first tool. The second wafer pod is routed to a second tool, and the first operation is performed on the wafers in the second subset using the second tool. The wafers in the first and second subsets are consolidated following the performing of the first operation.

摘要翻译： 一种方法包括将多个晶片指定为组的成员。 晶片的第一子集被容纳在第一晶片盒中，并且晶片的第二子集被容纳在第二晶片盒中。 第一晶片盒被路由到第一工具，并且使用第一工具对第一子集中的晶片执行至少第一操作。 第二晶片盒被路由到第二工具，并且使用第二工具在第二子集中的晶片上执行第一操作。 在执行第一操作之后，第一和第二子集中的晶片被合并。

公开(公告)号：US20090110518A1

公开(公告)日：2009-04-30

申请号：US12257376

申请日：2008-10-23

申请人： Michael Robert Rice ,  Jeffrey C. Hudgens

发明人： Michael Robert Rice ,  Jeffrey C. Hudgens

IPC分类号： H01L21/677

CPC分类号： H01L21/67763 ,  B65D85/70 ,  H01L21/67386 ,  H01L21/67393 ,  H01L21/67775 ,  Y10S414/137

摘要： An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects.

摘要翻译： 公开了一种电子设备制造系统。 该系统包括具有一个或多个处理室的处理工具，每个处理室适于在一个或多个基板上执行电子设备制造过程; 衬底载体，其适于耦合到所述系统并携带一个或多个衬底; 以及适于相对于所述衬底载体的至少一部分产生密封环境并且基本上使所述密封环境与所述衬底载体内的环境相等的部件。 本发明的方法被描述为许多其它方面。

公开(公告)号：US20090010748A1

公开(公告)日：2009-01-08

申请号：US11585337

申请日：2006-10-24

申请人： Yuji Kamikawa ,  Koji Egashira

发明人： Yuji Kamikawa ,  Koji Egashira

IPC分类号： B65G59/00

CPC分类号： H01L21/67739 ,  H01L21/67718 ,  H01L21/67763 ,  H01L21/67778 ,  H01L21/67781 ,  Y10S414/138

摘要： A batch forming apparatus forms a batch of substrates by combining a plurality of substrates that have been taken out from a plurality of carriers each containing therein the substrates in a stacked manner. The batch forming apparatus includes: a substrate transfer mechanism that takes out the substrates from each carrier and transfer the substrates; a substrate relative positional relationship changing mechanism that rearranges one or more substrates out of the substrates transferred by the substrate transfer mechanism one by one relative to other substrates to change positional relationships of the substrates relative to each other; and a batch forming mechanism that forms a batch of substrates out of the substrates that have been transferred thereto by the substrate transfer mechanism, with positional relationships of the substrates having been changed relative to each other by the substrate relative positional relationship changing mechanism. A substrate processing system includes such a batch forming apparatus, and a substrate processing apparatus that process the batch of substrates formed by the batch forming apparatus.

摘要翻译： 批量形成装置通过组合从多个载体中取出的多个基板形成一批基板，每个载体以堆叠的方式包含在其中的基板。 批量形成装置包括：基板转印机构，其从每个载体取出基板并转印基板; 基板相对位置关系改变机构，用于相对于其它基板逐一地将由基板传送机构转印的基板中的一个或多个基板重新布置，以改变基板相对于彼此的位置关系; 以及批量形成机构，其通过基板传送机构在已经被转印到基板之外形成一批基板，基板的位置关系通过基板相对位置关系改变机构而相对于彼此改变。 一种基板处理系统包括这样的分批成型装置，以及处理由批量形成装置形成的一批基板的基板处理装置。

公开(公告)号：US20070154293A1

公开(公告)日：2007-07-05

申请号：US11477630

申请日：2006-06-30

申请人： Sung-Hwan Yoon

发明人： Sung-Hwan Yoon

IPC分类号： B65B69/00

CPC分类号： H01L21/67763

摘要： An apparatus for transferring a plurality of substrates in manufacturing a liquid crystal display, includes a storage unit to store the plurality of substrates, an unloading member disposed in the storage unit to unload the substrates from the storage unit, a cassette disposed in the storage unit to lift and lower the plurality of substrates between respective storage substrate positions and the unloading member, a processing equipment to receive the substrates unloaded from the cassette, and a substrate feeder to receive the substrates from the storage unit unloaded by the unloading member and to load the substrates into the processing equipment.

摘要翻译： 一种用于在制造液晶显示器中传送多个基板的装置，包括：存储单元，用于存储多个基板;卸载部件，设置在存储单元中，以从存储单元卸载基板;盒，设置在存储单元中 在各个存储基板位置和卸载部件之间提升和降低多个基板，接收从盒卸载的基板的处理设备和用于从卸载部件卸载的存储单元接收基板的基板进给器， 将基材加入加工设备。

公开(公告)号：US20060088272A1

公开(公告)日：2006-04-27

申请号：US11207231

申请日：2005-08-19

申请人： Ulysses Gilchrist ,  William Fosnight ,  Christopher Hofmeister ,  Gerald Friedman ,  Michael Bufano

发明人： Ulysses Gilchrist ,  William Fosnight ,  Christopher Hofmeister ,  Gerald Friedman ,  Michael Bufano

IPC分类号： G02B6/00

CPC分类号： H01L21/67763 ,  H01L21/67326 ,  H01L21/67353 ,  H01L21/67369 ,  H01L21/67373 ,  H01L21/67376 ,  H01L21/67383 ,  H01L21/67389 ,  H01L21/67393 ,  H01L21/67772 ,  H01L21/67778 ,  H01L21/6779 ,  Y10S414/139

摘要： A substrate transport apparatus is provided. The apparatus has a casing and a door. The casing is adapted to form a controlled environment therein. The casing has supports therein for holding at least one substrate in the casing. The casing defines a substrate transfer opening through which a substrate transport system accesses the substrate in the casing. The door is connected to the casing for closing the substrate transfer opening in the casing. The casing has structure forming a fast swap element allowing replacement of the substrate from the apparatus with another substrate without retraction of the substrate transport system and independent of substrate loading in the casing.

摘要翻译： 提供了基板输送装置。 该装置具有外壳和门。 壳体适于在其中形成受控的环境。 壳体具有用于在壳体中保持至少一个基板的支撑。 壳体限定衬底传送开口，衬底传送系统通过该衬底传送系统访问壳体中的衬底。 门连接到壳体以封闭壳体中的基板传送开口。 壳体具有形成快速互换元件的结构，其允许用另一个基板从设备更换基板，而不会退回基板输送系统，而与壳体中的基板负载无关。

公开(公告)号：US20060081635A1

公开(公告)日：2006-04-20

申请号：US11245105

申请日：2005-10-07

申请人： Chiaki Matsutori ,  Tadahiro Obayashi

发明人： Chiaki Matsutori ,  Tadahiro Obayashi

IPC分类号： B65D53/00 ,  B65D43/04

CPC分类号： H01L21/67376 ,  F16J15/025 ,  F16J15/061 ,  F16J15/062 ,  H01L21/67763 ,  H01L21/67766 ,  H01L21/67769

摘要： To prevent a sealing member from falling off, facilitate attachment of the sealing member, and improve the sealing property of the sealing member. The sealing member of the present invention includes a plurality of individually deformable portions fitted into fitting groove portions separated across a protrusion in the fitting groove formed in one of a container main body and a cover member, a coupling portion connecting the individually deformable portions, and a sealing piece abutting against a wall surface of the other one of the container main body and the cover member to seal a space, the sealing piece being integrated with the coupling portion connecting the individually deformable portions. Convex ribs are respectively formed on opposite sides of the individually deformable portions to elastically come into close contact with the wall surface of the protrusion.

摘要翻译： 为了防止密封部件脱落，便于密封部件的安装，提高密封部件的密封性。 本发明的密封构件包括多个可单独变形的部分，该多个可单独变形的部分嵌合在形成在容器主体和盖构件中的一个中的配合槽中的突起之间分离的装配槽部分中，连接单独可变形部分的联接部分和 密封件与所述容器主体和所述盖部件中的另一个的壁面抵接以密封空间，所述密封件与连接所述可变形部分的所述联接部分一体化。 凸肋分别形成在单独可变形部分的相对侧上，以弹性地与突起的壁表面紧密接触。