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公开(公告)号：US20120270340A1
公开(公告)日：2012-10-25
申请号：US13533963
申请日：2012-06-26
Applicant: HIROSHI MAKI , Tsuyoshi Yokomori , Tatsuyuki Okubo
Inventor： HIROSHI MAKI , Tsuyoshi Yokomori , Tatsuyuki Okubo
IPC: H01L21/66
CPC classification number: H01L21/77 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/78 , H01L22/12 , H01L22/20 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , Y10T156/1132 , Y10T156/1944 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01032 , H01L2924/01031 , H01L2924/3512
Abstract: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.
Abstract translation: 在半导体集成电路器件制造期间的组装工艺中的切割之后的芯片拾取过程中，减少由快速进行的每个芯片的厚度减小引起的拾取缺陷是重要的课题。 特别地，由剥离操作引起的芯片周边部分的弯曲很可能引起芯片的破裂和碎裂。 在本发明中，为了解决这些问题，在通过夹紧夹头对芯片进行真空夹持的情况下，在从切割带（胶带）等剥离芯片的情况下，夹紧夹头中的真空夹紧系统的流量 被监视以在第一芯片从胶带完全分离之前检查芯片的弯曲状态。
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92.发明授权
公开(公告)号：US08267143B2
公开(公告)日：2012-09-18
申请号：US12761014
申请日：2010-04-15
Applicant: Gregory George , Hale Johnson , Patrick Gorun , James Hermanowski , Matthew Stiles
Inventor： Gregory George , Hale Johnson , Patrick Gorun , James Hermanowski , Matthew Stiles
IPC: B32B38/10
CPC classification number: H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
Abstract: An apparatus for debonding two temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge arranged adjacent to a first edge of the chuck and connected to a hinge. The flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor moves the contact roller vertical to the plane of the chuck top surface.
Abstract translation: 用于剥离两个临时粘合晶片的装置包括卡盘组件，柔性板组件和接触辊。 卡盘组件包括卡盘和第一晶片保持器，以保持晶片与卡盘的顶表面接触。 柔性板组件包括柔性板和第二晶片保持器，第二晶片保持器被构造成保持与柔性板的第一表面接触的晶片。 柔性板包括与卡盘的第一边缘相邻并且连接到铰链的第一边缘。 柔性板被构造成围绕铰链摆动并且被放置在卡盘的顶表面之上。 接触辊被布置成与卡盘的与其第一边缘径向相对的第二边缘相邻。 脱粘驱动电机使接触辊垂直于卡盘顶面的平面移动。
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公开(公告)号：US20120090763A1
公开(公告)日：2012-04-19
申请号：US13274394
申请日：2011-10-17
Applicant: Chouhei Okuno , Masayuki Yamamoto
Inventor： Chouhei Okuno , Masayuki Yamamoto
IPC: B32B38/10
CPC classification number: H01L21/67132 , H01L21/6838 , Y10T156/1105 , Y10T156/1132 , Y10T156/1168 , Y10T156/15 , Y10T156/1906 , Y10T156/1944 , Y10T156/1978
Abstract: A first holding table suction-holds an annular projection of a wafer remaining on a rear face thereof for surrounding a back grinding region. A second holding table having an outer peripheral wall adjacent to an inner wall of the annular projection is inserted into a flat portion inside the annular projection for joining a separating adhesive tape to a protective tape on a surface of the wafer while a flat plane of the flat portion is suction-held. Thereafter, the adhesive tape is separated. Accordingly, the adhesive tape is separated from the surface of the wafer together with the protective tape.
Abstract translation: 第一保持台吸附保持在其后表面上的晶片的环形突起以围绕后研磨区域。 具有与环形突起的内壁相邻的外周壁的第二保持台插入到环形突起内的平坦部分中，用于将分离的粘合带连接到晶片的表面上的保护带，同时 平坦部分是抽吸的。 此后，胶带被分离。 因此，粘合带与保护带一起与晶片的表面分离。
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公开(公告)号：US20120037307A9
公开(公告)日：2012-02-16
申请号：US12975521
申请日：2010-12-22
Applicant: JAMES HERMANOWSKI
Inventor： JAMES HERMANOWSKI
IPC: B32B38/10
CPC classification number: H01L21/67745 , H01L21/67132 , H01L21/6719 , H01L21/67207 , H01L21/67748 , H01L21/6836 , H01L21/6838 , H01L21/68742 , H01L2221/68318 , H01L2221/68331 , H01L2924/30105 , Y10T156/1132 , Y10T156/15 , Y10T156/1944
Abstract: An improved apparatus for debonding temporary bonded wafers includes a debonder, a cleaning module and a taping module. A vacuum chuck is used in the debonder for holding the debonded thinned wafer and remains with the thinned debonded wafer during the follow up processes steps of cleaning and mounting onto a dicing tape. In one embodiment the debonded thinned wafer remains onto the vacuum chuck and is moved with the vacuum chuck into the cleaning module and then the taping module. In another embodiment the debonded thinned wafer remains onto the vacuum chuck and first the cleaning module moves over the thinned wafer to clean the wafer and then the taping module moves over the thinned wafer to mount a dicing tape onto the wafer.
Abstract translation: 用于剥离临时粘合晶片的改进的装置包括剥离器，清洁模块和胶带模块。 在脱粘器中使用真空吸盘来保持脱粘的薄化晶片，并且在清洁和安装到切割带上的后续处理步骤期间保持与变薄的脱粘晶片。 在一个实施例中，剥离的薄化晶片保留在真空卡盘上，并且随着真空卡盘移动到清洁模块中，然后移动到胶带模块。 在另一个实施例中，脱粘的薄化晶片保留在真空卡盘上，并且首先清洁模块在薄的晶片上移动以清洁晶片，然后胶带模块在薄的晶片上移动以将切割带安装到晶片上。
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公开(公告)号：US20110290427A1
公开(公告)日：2011-12-01
申请号：US13208171
申请日：2011-08-11
Applicant: Hiroshi Maki , Tsuyoshi Yokomori , Tatsuyuki Okubo
Inventor： Hiroshi Maki , Tsuyoshi Yokomori , Tatsuyuki Okubo
IPC: B32B38/10
CPC classification number: H01L21/77 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/78 , H01L22/12 , H01L22/20 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , Y10T156/1132 , Y10T156/1944 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01032 , H01L2924/01031 , H01L2924/3512
Abstract: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.
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公开(公告)号：US20110277941A1
公开(公告)日：2011-11-17
申请号：US13189160
申请日：2011-07-22
Applicant: Thomas J. Hagman
Inventor： Thomas J. Hagman
IPC: B32B38/10
CPC classification number: B32B43/006 , B32B2605/18 , Y10T156/1132 , Y10T156/1153 , Y10T156/1174 , Y10T156/1179 , Y10T156/1195 , Y10T156/1944 , Y10T156/1956 , Y10T156/1961 , Y10T156/1978 , Y10T156/1983 , Y10T156/1994
Abstract: An apparatus and method is provided for removing a selected portion of tape material from backing paper. One embodiment of an apparatus may include a supply reel, at least one cutting member, at least one bending member, and first and second vacuum rollers. The apparatus may further include pinch rollers, scraping members, and scrap bins. The apparatus may allow for the removal of scrap tape material from the backing paper.
Abstract translation: 提供了一种用于从背纸去除带材料的选定部分的装置和方法。 设备的一个实施例可以包括供应卷轴，至少一个切割构件，至少一个弯曲构件以及第一和第二真空辊。 该装置还可以包括夹送辊，刮削构件和废料箱。 该设备可以允许从背纸去除废带材料。
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公开(公告)号：US20110266709A1
公开(公告)日：2011-11-03
申请号：US13087519
申请日：2011-04-15
Applicant: Tae-Joon SONG , Dhang KWON , Hang-Sup CHO , Seong-Pil CHO , Ho Su KIM , Doo-Hee JANG
Inventor： Tae-Joon SONG , Dhang KWON , Hang-Sup CHO , Seong-Pil CHO , Ho Su KIM , Doo-Hee JANG
IPC: B28B11/08
CPC classification number: G03F7/0002 , B82Y10/00 , B82Y40/00 , Y10T156/1132 , Y10T156/1944
Abstract: Disclosed are an apparatus and method for fabricating a flat panel display device to realize easy separation of a substrate from an imprinting mold. The apparatus includes an imprinting mold connected to a substrate to form a thin film pattern on the substrate, a first adsorption pad to vacuum-adsorb the center of the imprinting mold, a second adsorption pad to vacuum-adsorb the periphery of the imprinting mold, and a connector connected to vacuum pins to vertically move in different regions of the first and second adsorption pads.
Abstract translation: 公开了一种用于制造平板显示装置的装置和方法，以实现基板与压印模具的容易分离。 该装置包括：与基板连接以在基板上形成薄膜图案的压印模，用于真空吸附压印模的中心的第一吸附垫;第二吸附垫，用于真空吸附压印模的周边; 以及连接到真空管脚以在第一和第二吸附垫的不同区域垂直移动的连接器。
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98.发明授权
公开(公告)号：US08038839B2
公开(公告)日：2011-10-18
申请号：US12603775
申请日：2009-10-22
Applicant: Kazuki Noda , Masaru Iwasawa
Inventor： Kazuki Noda , Masaru Iwasawa
IPC: B32B38/10
CPC classification number: B32B43/006 , B32B2457/14 , H01L21/2007 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/68381 , H01L2221/6839 , Y10S156/93 , Y10T156/1111 , Y10T156/1158 , Y10T156/1917 , Y10T156/1944
Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.
Abstract translation: 提供了一种层叠体，其包括待研磨的基底和支撑体，其中基底被研磨成非常小的厚度，然后可以与支撑体分离而不损坏基底。 本发明的一个实施方案是一种层叠体，其包括待研磨的基材，与待研磨基材接触的接合层，包含光吸收剂和可热分解树脂的光热转换层和透光性支持体。 在与接合层接触的基板表面研磨后，通过透光层照射层叠体，分解光电转换层，分离基板和透光支撑体。
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公开(公告)号：US08029642B2
公开(公告)日：2011-10-04
申请号：US11829525
申请日：2007-07-27
Applicant: Thomas J Hagman
Inventor： Thomas J Hagman
IPC: B32B38/10
CPC classification number: B32B43/006 , B32B2605/18 , Y10T156/1132 , Y10T156/1153 , Y10T156/1174 , Y10T156/1179 , Y10T156/1195 , Y10T156/1944 , Y10T156/1956 , Y10T156/1961 , Y10T156/1978 , Y10T156/1983 , Y10T156/1994
Abstract: An apparatus and method is provided for removing a selected portion of tape material from backing paper. One embodiment of an apparatus may include a supply reel, at least one cutting member, at least one bending member, and first and second vacuum rollers. The apparatus may further include pinch rollers, scraping members, and scrap bins. The apparatus may allow for the removal of scrap tape material from the backing paper.
Abstract translation: 提供了一种用于从背纸去除带材料的选定部分的装置和方法。 设备的一个实施例可以包括供应卷轴，至少一个切割构件，至少一个弯曲构件以及第一和第二真空辊。 该装置还可以包括夹送辊，刮削构件和废料箱。 该设备可以允许从背纸去除废带材料。
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公开(公告)号：US20110146901A1
公开(公告)日：2011-06-23
申请号：US12975521
申请日：2010-12-22
Applicant: JAMES HERMANOWSKI
Inventor： JAMES HERMANOWSKI
IPC: B32B38/10
CPC classification number: H01L21/67745 , H01L21/67132 , H01L21/6719 , H01L21/67207 , H01L21/67748 , H01L21/6836 , H01L21/6838 , H01L21/68742 , H01L2221/68318 , H01L2221/68331 , H01L2924/30105 , Y10T156/1132 , Y10T156/15 , Y10T156/1944
Abstract: An improved apparatus for debonding temporary bonded wafers includes a debonder, a cleaning module and a taping module. A vacuum chuck is used in the debonder for holding the debonded thinned wafer and remains with the thinned debonded wafer during the follow up processes steps of cleaning and mounting onto a dicing tape. In one embodiment the debonded thinned wafer remains onto the vacuum chuck and is moved with the vacuum chuck into the cleaning module and then the taping module. In another embodiment the debonded thinned wafer remains onto the vacuum chuck and first the cleaning module moves over the thinned wafer to clean the wafer and then the taping module moves over the thinned wafer to mount a dicing tape onto the wafer.
Abstract translation: 用于剥离临时粘合晶片的改进的装置包括剥离器，清洁模块和胶带模块。 在脱粘器中使用真空吸盘来保持脱粘的薄化晶片，并且在清洁和安装到切割带上的后续处理步骤期间保持与变薄的脱粘晶片。 在一个实施例中，剥离的薄化晶片保留在真空卡盘上，并且随着真空卡盘移动到清洁模块中，然后移动到胶带模块。 在另一个实施例中，脱粘的薄化晶片保留在真空卡盘上，并且首先清洁模块在薄的晶片上移动以清洁晶片，然后胶带模块在薄的晶片上移动以将切割带安装到晶片上。
