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101.发明授权公开(公告)号：US07394663B2
公开(公告)日：2008-07-01
申请号：US10775656
申请日：2004-02-09
IPC分类号： H05K1/16
CPC分类号： H05K1/187 , H01L23/49894 , H01L23/5389 , H01L25/162 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/82047 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/19105 , H05K1/186 , H05K3/4614 , H01L2924/00012 , H01L2224/0401
摘要： An electronic component built-in module according to the present invention includes a pair of opposed circuit substrates, each of which includes a wiring pattern and an insulating base material containing a resin, an insulating layer that is placed between the pair of circuit substrates and contains an inorganic filler and a resin composition containing a thermosetting resin, an electronic component that is embedded in the insulating layer, and an inner via that is provided in the insulating layer so as to make an electrical connection between wiring patterns provided on different circuit substrates. A glass transition temperature Tg1 of the resin composition contained in the insulating layer and a glass transition temperature Tg2 of the insulating base material included in each of the circuit substrates satisfy a relationship Tg1>Tg2.
摘要翻译： 根据本发明的电子部件内置模块包括一对相对的电路基板，每个电路基板包括布线图案和包含树脂的绝缘基材，绝缘层位于该对电路基板之间并且包含 无机填料和包含热固性树脂的树脂组合物，嵌入在绝缘层中的电子部件和设置在绝缘层中的内部通孔，以便在设置在不同电路基板上的布线图案之间形成电连接。 包含在绝缘层中的树脂组合物的玻璃化转变温度Tg1和包含在每个电路基板中的绝缘基材的玻璃化转变温度Tg2满足Tg1> Tg2。
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102.发明授权Method of producing circuit component built-in module with embedded circuit component 有权具有嵌入式电路元件的电路元件内置模块的制造方法公开(公告)号：US07140104B2
公开(公告)日：2006-11-28
申请号：US10902523
申请日：2004-07-29
申请人： Koichi Hirano , Seiichi Nakatani , Hiroyuki Handa , Tsunenori Yoshida , Yoshihisa Yamashita , Hiroyuki Ishitomi
发明人： Koichi Hirano , Seiichi Nakatani , Hiroyuki Handa , Tsunenori Yoshida , Yoshihisa Yamashita , Hiroyuki Ishitomi
IPC分类号： H01K3/10
CPC分类号： H01G2/065 , H01L25/0652 , H01L29/0657 , H01L2224/16225 , H01L2924/09701 , H01L2924/10157 , H01L2924/10158 , H01L2924/3011 , H05K1/185 , H05K3/3442 , H05K2201/09154 , H05K2201/10568 , H05K2201/10636 , H05K2201/2036 , Y02P70/611 , Y02P70/613 , Y10T29/49004 , Y10T29/49082 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T29/53174 , Y10T29/53178
摘要： A circuit component built-in module can be produced by filling a conducting material in through holes of a sheet-like member, stacking the sheet-like member and a metal foil on a circuit component package, and applying heat and pressure to embed the circuit component in the sheet-like member, and patterning the metal foil. The circuit component package includes a mounting member with substrate and wiring pattern and a circuit component. The circuit component includes a component body and external electrode, with the component body being thinner at a portion on which the external electrode is provided. The external electrode is provided on a surface of the circuit component that is opposed to the mounting member, and the component body is in contact with the mounting member.
摘要翻译： 可以通过在板状构件的通孔中填充导电材料，将片状构件和金属箔堆叠在电路构件封装上，并施加热和压力以嵌入电路来制造电路部件内置模块 并且对金属箔进行图案化。 电路部件封装包括具有衬底和布线图案的安装构件和电路部件。 电路部件包括部件主体和外部电极，其中部件主体在设置有外部电极的部分处更薄。 外部电极设置在与安装部件相对的电路部件的表面上，并且部件主体与安装部件接触。
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103.发明授权Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same 有权电容器及其制造方法以及具有内置电容器的电路板及其制造方法公开(公告)号：US07126811B2
公开(公告)日：2006-10-24
申请号：US10726675
申请日：2003-12-04
IPC分类号： H01G9/00
CPC分类号： H01G9/012 , H01G4/26 , H05K1/186 , H05K3/321 , H05K3/4614 , Y10T29/417
摘要： A miniature solid electrolytic capacitor is provided, which is suitable for being disposed within an electrically insulating layer, and is connected to a component using an electrically conductive adhesive with a connection resistance at an anode being low and with connection reliability being improved. Specifically, the electrolytic capacitor includes a valve metal element for an anode having a capacitor forming part and an electrode lead part, a dielectric oxide film formed on the valve element, a solid electrolyte layer formed on the dielectric oxide film and a charge collecting element for a cathode formed on the solid electrolyte layer, wherein at least one through hole is formed in the electrode lead part so as to expose a core of the valve metal element, and wherein an exposed portion of the core is used as a connecting portion.
摘要翻译： 提供了一种微型固体电解电容器，其适用于设置在电绝缘层中，并且使用导电粘合剂连接到组件，其中阳极处的连接电阻低，并且连接可靠性得到改善。 具体地说，电解电容器包括用于阳极的阀金属元件，具有电容器形成部分和电极引线部分，形成在阀元件上的电介质氧化膜，形成在电介质氧化物膜上的固体电解质层和用于 形成在所述固体电解质层上的阴极，其中，在所述电极引线部中形成有至少一个通孔，以露出所述阀金属元件的芯，并且其中所述芯的暴露部分用作连接部。
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公开(公告)号：US07041535B2
公开(公告)日：2006-05-09
申请号：US10758517
申请日：2004-01-14
IPC分类号： H01L21/44
CPC分类号： H01L23/3737 , H01L23/42 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/45144 , H01L2224/73253 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19105 , H01L2924/19106 , H05K1/0203 , H05K3/284 , H01L2924/00
摘要： In a power module, a wiring substrate to which a heat generating component is connected electrically and a heat sink are connected through the medium of a thermally conductive and electrically insulating member. The thermally conductive and electrically insulating member is a curable composition containing (A) a thermosetting resin, (B) a thermoplastic resin, (C) a latent curing agent, and (D) an inorganic filler. The thermally conductive and electrically insulating member is bonded to the heat generating component in such a manner as to be deformed complementarily to unevenness in shape and height of the heat generating component. Heat generated from the heat generating component is radiated by means of the heat sink. Thus, a power module that allows heat generated from an electronic component to be radiated evenly and efficiently and achieves high-density mounting, and a method of manufacturing the power module are provided.
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公开(公告)号：US06936774B2
公开(公告)日：2005-08-30
申请号：US10283386
申请日：2002-10-29
申请人： Yasuhiro Sugaya , Shingo Komatsu , Koichi Hirano , Seiichi Nakatani , Yasuyuki Matsuoka , Toshiyuki Asahi , Yoshihisa Yamashita
发明人： Yasuhiro Sugaya , Shingo Komatsu , Koichi Hirano , Seiichi Nakatani , Yasuyuki Matsuoka , Toshiyuki Asahi , Yoshihisa Yamashita
CPC分类号： H05K3/20 , H01L2221/68345 , H01L2221/68359 , H01L2221/68363 , H01L2924/0002 , H01L2924/0102 , H01L2924/01078 , H05K1/0306 , H05K1/16 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/205 , H05K3/4061 , H05K3/4069 , H05K2203/1461 , Y10T29/49149 , Y10T29/49179 , Y10T29/49208 , Y10T29/49213 , Y10T428/12486 , H01L2924/00
摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.
摘要翻译： 能够可靠且容易地将精细布线图案转印到基板的转印材料。 转印材料包括作为载体的第一金属层，作为布线图案转印到基板的第二金属层和可释放地粘附第一和第二金属层的剥离层的至少三层。 在第一金属层的表面部分上形成与布线图形对应的凹凸部分，并且在凸部的区域上形成剥离层和第二金属层。
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106.发明授权公开(公告)号：US06870244B2
公开(公告)日：2005-03-22
申请号：US10026522
申请日：2001-12-27
IPC分类号： H01L23/373 , H01L23/498 , H05K1/03 , H05K1/05 , H05K3/20 , H01L23/48
CPC分类号： H01L23/49861 , H01L23/3737 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K3/202 , H05K2201/0209 , Y10T29/49128 , Y10T428/24917 , H01L2924/00
摘要： A thermally conductive substrate includes a thermally conductive resin sheet member attached to a lead frame. The lead frame comprises a thermally conductive resin sheet member and it is integrated with the thermally conductive resin sheet member on the lead frame. The thermally conductive resin sheet member is formed from a thermosetting resin mixture comprises 70 to 90 parts by weight of an inorganic filler and 5 to 30 parts by weight of a thermosetting resin composition including a thermosetting resin, and the thermosetting resin is in a semi-cured state.
摘要翻译： 导热基板包括附接到引线框架的导热树脂片部件。 引线框架包括导热树脂片部件，并且与引导框架上的导热树脂片部件一体化。 导热性树脂片部件由热固性树脂混合物形成，该热固性树脂混合物包含70至90重量份的无机填料和5至30重量份的包含热固性树脂的热固性树脂组合物，并且所述热固性树脂为半 固化状态。
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107.发明授权公开(公告)号：US07022276B2
公开(公告)日：2006-04-04
申请号：US10465347
申请日：2003-06-19
IPC分类号： B29C71/02
CPC分类号： H05K1/0373 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H05K3/022 , H05K2201/0129 , H05K2201/0209 , H05K2201/0355 , H05K2203/0156 , Y10S428/901 , Y10T428/24917 , H01L2924/00014
摘要： A method for manufacturing a circuit board with high thermal dissipation includes the following steps: preparing a thermal conductive resin composition including 70 to 95 mass % of an inorganic filler and 5 to 30 mass % of a resin composition that includes a liquid thermosetting resin, a thermoplastic resin powder, and a latent curing agent; bonding the thermal conductive resin composition and a metal foil together by heating at a temperature lower than a temperature at which the thermosetting resin starts to cure while applying pressure so that the thermal conductive resin composition increases in viscosity and thus is solidified irreversibly; providing holes and curing the thermosetting resin to form an insulating substrate; and forming through holes and a circuit pattern. This method can achieve improved productivity and low cost in processing the holes. It is preferable that the thermal conductive resin composition is integral with a reinforcing material.
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公开(公告)号：US06871396B2
公开(公告)日：2005-03-29
申请号：US09778709
申请日：2001-02-07
申请人： Yasuhiro Sugaya , Shingo Komatsu , Koichi Hirano , Seiichi Nakatani , Yasuyuki Matsuoka , Toshiyuki Asahi , Yoshihisa Yamashita
发明人： Yasuhiro Sugaya , Shingo Komatsu , Koichi Hirano , Seiichi Nakatani , Yasuyuki Matsuoka , Toshiyuki Asahi , Yoshihisa Yamashita
CPC分类号： H05K3/20 , H01L2221/68345 , H01L2221/68359 , H01L2221/68363 , H01L2924/0002 , H01L2924/0102 , H01L2924/01078 , H05K1/0306 , H05K1/16 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/205 , H05K3/4061 , H05K3/4069 , H05K2203/1461 , Y10T29/49149 , Y10T29/49179 , Y10T29/49208 , Y10T29/49213 , Y10T428/12486 , H01L2924/00
摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.
摘要翻译： 能够可靠且容易地将精细布线图案转印到基板的转印材料。 转印材料包括作为载体的第一金属层，作为布线图案转印到基板的第二金属层和可释放地粘附第一和第二金属层的剥离层的至少三层。 在第一金属层的表面部分上形成与布线图形对应的凹凸部分，并且在凸部的区域上形成剥离层和第二金属层。
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109.发明授权Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink 有权制造具有连接到散热器的接地图案的导热电路板的方法公开(公告)号：US06860004B2
公开(公告)日：2005-03-01
申请号：US10309707
申请日：2002-12-03
IPC分类号： C08J5/18 , B29C43/18 , C08K3/00 , C08L101/00 , H01L23/373 , H01L23/433 , H01L23/498 , H01L23/50 , H05K1/02 , H05K1/03 , H05K1/05 , H05K3/20 , H05K3/40 , H05K7/20 , H05K3/30
CPC分类号： H05K7/205 , H01L23/3737 , H01L23/4334 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/48247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/19041 , H05K1/0204 , H05K1/056 , H05K3/0061 , H05K3/202 , H05K3/4084 , H05K7/20463 , H05K2201/0209 , H05K2201/0382 , H05K2201/09054 , H05K2201/0969 , H05K2201/10416 , H05K2203/1189 , Y10T29/49121 , Y10T29/4913 , Y10T29/49146 , Y10T29/49158 , Y10T29/49171 , Y10T29/49172 , H01L2924/00 , H01L2224/05599
摘要： In a method of manufacturing a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection, a sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. The method provides that a part of a lead frame and heat sink are connected not only mechanically, but also electrically, and allows an associated power module size to be reduced and its density to be increased.
摘要翻译： 在具有高散热，高导电性和高接地连接的导热电路板的制造方法中，含有70〜95重量份的片状导热性树脂组合物， ％无机填料和5〜30wt。 热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。 因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。 因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。 该方法提供引线框架和散热器的一部分不仅机械地而且电连接，并且允许相关联的功率模块尺寸减小并且其密度增加。
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110.发明授权公开(公告)号：US06700182B2
公开(公告)日：2004-03-02
申请号：US09870684
申请日：2001-06-01
IPC分类号： H01L23495
CPC分类号： H05K1/0256 , H01L23/367 , H01L23/498 , H01L23/49861 , H01L23/60 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K3/202 , H05K2201/0209 , H05K2201/0355 , H05K2201/09145 , H01L2924/00
摘要： By providing an end portion of a radiation plate located on and near an end portion of an insulator sheet, to which a lead frame extends, at a position away from the end portion of the insulator sheet inside of the insulator sheet in a plane direction of the insulator sheet, it is possible to secure a creeping distance between the lead frame and the radiation plate without decreasing a lead frame area on which components can be actually mounted.
摘要翻译： 通过设置位于绝缘片的端部和靠近引线框架延伸的绝缘片的端部上的辐射板的端部，在离开绝缘片的端部的位置远离绝缘体片的端部的位置处， 绝缘体片材，可以确保引线框架和辐射板之间的蠕变距离，而不会减少可实际安装部件的引线框区域。
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